公开(公告)号：US4997243A

公开(公告)日：1991-03-05

申请号：US490456

申请日：1990-03-08

申请人： Kunio Aiki ,  Atsushi Sasayama ,  Tugio Nemoto ,  Makoto Haneda ,  Satoru Ishii ,  Haruo Kugimiya ,  Tutomu Kawasaki

发明人： Kunio Aiki ,  Atsushi Sasayama ,  Tugio Nemoto ,  Makoto Haneda ,  Satoru Ishii ,  Haruo Kugimiya ,  Tutomu Kawasaki

IPC分类号： G02B6/42 ,  H01S5/022 ,  H01S5/024

CPC分类号： H01S5/02415 ,  G02B6/4202 ,  G02B6/4204 ,  G02B6/4236 ,  H01S5/02284 ,  G02B6/4238 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01S5/02268 ,  H01S5/02438

摘要： In a photoelectric device, particularly, a photoelectric device for optical communication, an optical fiber is fixed at two fixing points so that the extremity of the optical fiber is disposed opposite to the light emitting surface of a laser diode chip and the optical fiber extends in a nonlinear shape, for example, in a moderate curve, between the two fixing points. Even though holding members fixedly holding the optical fiber at the two fixing points and a base member supporting the holding members are formed of a metal or metals having a coefficient of thermal expansion far greater than that of the optical fiber, and even if the distance between the two fixing points is varied due to the thermal expansion or contraction of the holding members and the base member, the optical fiber is obliged only to change the shape of extension. Therefore, the optical fiber and the solder fixing the optical fiber to the holding members at the two fixing points are not subjected to repeated stress, and hence the fatigue of the optical fiber and the solder is avoided. Accordingly, the photoelectric device is able to continue stable optical communication regardless of temperature variation.

公开(公告)号：US4793688A

公开(公告)日：1988-12-27

申请号：US53481

申请日：1987-05-26

申请人： Kunio Aiki ,  Atsushi Sasayama ,  Tugio Nemoto ,  Tsunetoshi Kawabata ,  Haruo Kugimiya

发明人： Kunio Aiki ,  Atsushi Sasayama ,  Tugio Nemoto ,  Tsunetoshi Kawabata ,  Haruo Kugimiya

IPC分类号： G02B7/00 ,  G02B6/42 ,  G02B7/02 ,  G11B7/12 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01S5/00

CPC分类号： G02B6/4204 ,  G02B6/4226 ,  G02B7/027 ,  G11B7/123 ,  Y10S359/90

摘要： In the photo electro device, a laser diode chip is set fixedly through a submount to a heatsink in a package. In assembling, first a ball lens is anchored to a holder of a lens support frame by clinching claws of the holder. Subsequently the surfaces of the ball lens on the obverse and reverse sides of the lens support frame are coated with nonreflective films. Then the position of the lens support frame is adjusted relatively to the laser diode chip so that the respective optical axes are aligned with each other. And after an arm is welded fixedly to the heatsink, a frame member is severed or removed to complete the work for setting the ball lens.

摘要翻译： 在光电装置中，激光二极管芯片固定地通过底座固定到封装中的散热器。 在组装时，首先通过夹持器的爪来将球透镜锚固到透镜支撑框架的支架上。 随后，透镜支撑框架的正面和反面上的球透镜的表面涂覆有非反射膜。 然后，透镜支撑框架的位置相对于激光二极管芯片进行调节，使得各个光轴彼此对准。 并且在将臂固定地连接到散热器之后，框架构件被切断或移除以完成用于设置球镜的工作。