RADIATIVE HEATSINK
    3.
    发明公开
    RADIATIVE HEATSINK 审中-公开

    公开(公告)号:US20230221083A1

    公开(公告)日:2023-07-13

    申请号:US18153782

    申请日:2023-01-12

    申请人: Maxwell Labs Inc

    发明人: Jacob A. Balma

    摘要: A radiative heatsink includes a cold plate, a radiator mounted to the cold plate and a thermal compound located between and coupling the heat source to the cold plate. The thermal compound converts a portion of a first phononic thermal energy from the heat source into a first photonic near-field and a first photonic far-field thermal radiation and transfers the first photonic near-field, the first photonic far-field and the remaining of the first phononic thermal energy to the cold plate. The cold plate combines the first photonic near-field, the first photonic far-field and the remaining first phononic thermal energy into a second phononic thermal energy and provides the second phononic thermal energy to the radiator. The radiator converts the second phononic thermal energy into a second photonic near-field and a second photonic far-field and emits the second photonic near-field or the second photonic far-field such that cold plate is regenerated.