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公开(公告)号:US07537046B2
公开(公告)日:2009-05-26
申请号:US11695462
申请日:2007-04-02
申请人: Dong-Bo Zheng , Lei Cao , Meng Fu , Chun-Chi Chen
发明人: Dong-Bo Zheng , Lei Cao , Meng Fu , Chun-Chi Chen
CPC分类号: H01L23/427 , F28D15/0266 , F28D15/0275 , H01L2924/0002 , H01L2924/00
摘要: A heat dissipation device includes a base (10) for thermally engaging with an electronic device and a plurality of fins (320) arranged on the base (10). A heat pipe (52) thermally connects the fins (320) and the base (10) for transferring heat from the base (10) to the fins (320). The heat pipe (52) comprises an evaporation section (521) sandwiched between the base (10) and the fins (320), two condensation sections (525, 526) parallel to the evaporation section (521) and thermally engaging with the fins (320), and two connecting sections (527, 528) interconnecting corresponding condensation sections (525, 526) and the evaporation section (521). The connecting sections (527, 528) form an included angle therebetween. The condensation sections (525, 526) are spaced from and extend toward each other.
摘要翻译: 散热装置包括用于与电子设备热接合的基座(10)和布置在基座(10)上的多个翅片(320)。 热管(52)热连接翅片(320)和底座(10),用于将热量从基座(10)传送到散热片(320)。 热管(52)包括夹在基座(10)和翅片(320)之间的蒸发部分(521),与蒸发部分(521)平行的两个冷凝部分(525,526),并与翅片 320)和互连相应的冷凝部分(525,526)和蒸发部分(521)的两个连接部分(527,528)。 连接部分(527,528)在它们之间形成夹角。 冷凝部分(525,526)彼此间隔开并且彼此延伸。
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公开(公告)号:US07391615B2
公开(公告)日:2008-06-24
申请号:US11309839
申请日:2006-10-10
申请人: Meng Fu , Shi-Wen Zhou , Chun-Chi Chen
发明人: Meng Fu , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号: H05K7/20
CPC分类号: H01L23/4093 , H01L2224/16 , Y10T24/44427 , Y10T24/4447
摘要: A clip includes a body with opposite first and second legs, a movable fastener, an actuating member and a sliding axle. The movable fastener has a retaining hole defined therein for engaging with a retention module and an elongated slot above the retaining hole. The actuating member includes a curving slot and is pivotally coupled to the movable fastener via a pivot. The sliding axle extends through the second leg of the body and the elongated slot of the movable fastener to couple them together, and the sliding axle has one portion inserted into the curving slot of the actuating member. When the actuating member is rotated about the pivot, the movable fastener is driven to move relative to the sliding axle between a relaxed position and a locked position.
摘要翻译: 夹具包括具有相对的第一和第二腿部的主体,可移动紧固件,致动构件和滑动轴。 可移动紧固件具有限定在其中的保持孔,用于与保持模块和保持孔上方的细长狭槽接合。 致动构件包括弯曲槽,并且经由枢轴枢转地联接到可动紧固件。 滑动轴延伸穿过主体的第二腿部和可移动紧固件的细长槽以将它们联接在一起,并且滑动轴具有插入致动构件的弯曲槽中的一个部分。 当致动构件围绕枢轴旋转时,可移动紧固件被驱动以在松弛位置和锁定位置之间相对于滑动轴线移动。
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公开(公告)号:US20060054307A1
公开(公告)日:2006-03-16
申请号:US11221285
申请日:2005-09-07
申请人: Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu
发明人: Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu
IPC分类号: H05K7/20
CPC分类号: H01L23/427 , F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要: A heat sink for dissipating heat of an electronic device comprises a base, a first fin group comprising a plurality of fins stacked together, a second fin group comprising a plurality of fins and overlapping the first fin group, and a sinuous heat pipe attached to the base. The first and second fin groups are respectively engaged with the heat pipe twice at different locations of the first and second fin groups.
摘要翻译: 一种用于散热电子装置的散热器包括:基座,包括堆叠在一起的多个翅片的第一翅片组,包括多个翅片并与第一翅片组重叠的第二翅片组,以及连接到第一翅片组的弯曲热管 基础。 第一和第二翅片组分别在第一和第二翅片组的不同位置与热管接合两次。
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公开(公告)号:US20060032617A1
公开(公告)日:2006-02-16
申请号:US11012958
申请日:2004-12-14
申请人: Chun-Chi Chen , Shi-Wen Zhou , Chi Liang , Meng Fu
发明人: Chun-Chi Chen , Shi-Wen Zhou , Chi Liang , Meng Fu
IPC分类号: F28D15/00
CPC分类号: H01L23/427 , F28D15/0275 , F28F3/02 , H01L2924/0002 , H01L2924/00
摘要: A heat sink for electronic component includes a base, a first heat dissipation member coupled to the base, heat pipes embedded in the base and a second heat dissipation member coupled to the base. The base is made of a first metal material and includes a heat absorbing portion having a bottom surface for contacting with the electronic component and a heat conductive portion extending from a top surface of heat absorbing portion. The first heat dissipation member is made of a second metal material and coupled to the heat absorbing portion of the base. The second heat dissipation member is made of second metal material and coupled to the heat conductive portion of the base. The first metal material differs from and has higher heat conductivity than the second metal material.
摘要翻译: 一种用于电子部件的散热器包括基座,耦合到基座的第一散热构件,嵌入在基座中的热管和耦合到基座的第二散热构件。 基座由第一金属材料制成,并且包括具有用于与电子部件接触的底面的吸热部和从吸热部的顶面延伸的导热部。 第一散热构件由第二金属材料制成并且联接到基座的吸热部分。 第二散热构件由第二金属材料制成并且连接到基座的导热部分。 第一金属材料与第二金属材料不同并且具有比第二金属材料更高的热导率。
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公开(公告)号:US20050088819A1
公开(公告)日:2005-04-28
申请号:US10901618
申请日:2004-07-28
申请人: Chun-Chi Chen , Meng Fu
发明人: Chun-Chi Chen , Meng Fu
IPC分类号: G06F1/20 , H01L23/467 , H05K7/20
CPC分类号: H01L23/467 , H01L2924/0002 , H01L2924/00
摘要: A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a heat sink (6), a fan (1) and a fan holder (2). The fan holder comprises a guiding receptacle (20) and a securing base (40) covering the heat sink. An inlet (24) of the guiding receptacle is coupled to the bottom of the fan. An opening (221) is defined in the guiding receptacle for providing airflow access from the fan to the heat sink.
摘要翻译: 散热装置适于从电子包装中去除热量。 散热装置包括散热片(6),风扇(1)和风扇架(2)。 风扇支架包括导向插座(20)和覆盖散热器的固定底座(40)。 引导插座的入口(24)联接到风扇的底部。 在导向插座中限定了开口(221),用于提供从风扇到散热器的气流进入。
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公开(公告)号:US07929309B2
公开(公告)日:2011-04-19
申请号:US12632768
申请日:2009-12-07
申请人: Pin-Qun Zhao , Dong-Bo Zheng , Meng Fu , Chun-Chi Chen
发明人: Pin-Qun Zhao , Dong-Bo Zheng , Meng Fu , Chun-Chi Chen
IPC分类号: H05K7/20
CPC分类号: H01L23/4093 , H01L2924/0002 , Y10T24/44017 , H01L2924/00
摘要: A clip is adapted for securing a heat sink on a printed circuit board (PCB). The clip includes a linking portion, an operating portion, a handle, and a pressing portion. The linking portion is located at a lateral side of the heat sink. The operating portion pivotally engages with the linking portion and the heat sink. The handle connects the operating portion. The pressing portion connects the linking portion. A fastener mounted on the PCB extends through the heat sink and the pressing portion. The pressing portion is slidable from a first position to a second position. When the pressing portion is in the second position the handle is operable to drive the operating portion to move upwardly and urge the pressing portion to move along the fastener until the pressing portion abuts against a top portion of the fastener and simultaneously presses the heat sink.
摘要翻译: 夹子适于将散热器固定在印刷电路板(PCB)上。 夹子包括连接部分,操作部分,手柄和按压部分。 连接部分位于散热器的侧面。 操作部分与连接部分和散热器枢转地接合。 手柄连接操作部分。 按压部分连接连接部分。 安装在PCB上的紧固件延伸穿过散热器和按压部分。 按压部分可以从第一位置滑动到第二位置。 当按压部分处于第二位置时,手柄可操作以驱动操作部分向上移动并促使按压部分沿着紧固件移动,直到按压部分抵靠紧固件的顶部并同时按压散热器。
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公开(公告)号:US07874692B2
公开(公告)日:2011-01-25
申请号:US12134163
申请日:2008-06-05
申请人: Dong-Bo Zheng , Meng Fu , Chun-Chi Chen
发明人: Dong-Bo Zheng , Meng Fu , Chun-Chi Chen
IPC分类号: A45B3/02
CPC分类号: F21V14/02 , F21K9/00 , F21K9/65 , F21V14/04 , F21V29/505 , F21V29/74 , F21V29/77 , F21V29/83 , F21Y2107/10 , F21Y2115/10 , Y10S362/80
摘要: An LED lamp includes a lamp cover consisting of a plurality of sector-shaped connecting bodies, a plurality of fins attached to the lamp cover and a plurality of LED modules attached to the lamp cover and opposing the fins. A locking device is pivotably mounted to the lamp cover and comprises a supporting pole extending in the lamp cover, a plurality of branches pivotably mounted to the lamp cover and the supporting pole. The branches are movable along the supporting pole to be locked at a desired position, whereby an illumination angle of the LED modules of the lamp cover relative to the supporting pole is changeable via movement of the branches along the supporting pole of the locking device. Thus, an illumination area and an illumination intensity of the LED lamp are adjustable.
摘要翻译: LED灯包括由多个扇形连接体组成的灯罩,附接到灯罩的多个灯片和附接到灯罩并与散热片相对的多个LED组件。 锁定装置可枢转地安装到灯罩,并且包括在灯罩中延伸的支撑杆,可枢转地安装到灯罩和支撑杆的多个分支。 分支可沿着支撑杆移动以被锁定在期望的位置,由此灯罩的LED模块相对于支撑杆的照明角度可以通过分支沿着锁定装置的支撑杆的移动而改变。 因此,LED灯的照明区域和照明强度是可调节的。
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公开(公告)号:US07760509B1
公开(公告)日:2010-07-20
申请号:US12581168
申请日:2009-10-19
申请人: Pin-Qun Zhao , Dong-Bo Zheng , Meng Fu , Chun-Chi Chen
发明人: Pin-Qun Zhao , Dong-Bo Zheng , Meng Fu , Chun-Chi Chen
IPC分类号: H05K7/20
CPC分类号: H05K7/20509
摘要: A heat dissipation device for removing heat from an electronic component mounted on a printed circuit board, includes a heat sink having a bottom for in contact with the electronic component and a plurality of fasteners securing the heat sink onto the printed circuit board. Each fastener includes a first latching member, a second latching member rotatably connected to the first latching member and an operating member rotatably connected to the first latching member and having a pressing part engaging a curved portion defined on a top of the second latching member. The heat sink and the printed circuit board are located between the first and second latching members of each fastener. The operating member is rotated to force the first and the second latching members to rotate toward each other to closely clip the heat sink and printed circuit board together.
摘要翻译: 一种用于从安装在印刷电路板上的电子部件移除热量的散热装置,包括具有与电子部件接触的底部的散热器和将散热器固定在印刷电路板上的多个紧固件。 每个紧固件包括第一闩锁构件,可旋转地连接到第一闩锁构件的第二闩锁构件和可旋转地连接到第一闩锁构件并且具有接合限定在第二闩锁构件的顶部上的弯曲部分的按压部分的操作构件。 散热器和印刷电路板位于每个紧固件的第一和第二闩锁构件之间。 旋转操作构件以迫使第一和第二闩锁构件朝向彼此旋转以将散热器和印刷电路板紧密地夹在一起。
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公开(公告)号:US07637311B2
公开(公告)日:2009-12-29
申请号:US11769664
申请日:2007-06-27
申请人: Dong-Bo Zheng , Meng Fu , Chun-Chi Chen
发明人: Dong-Bo Zheng , Meng Fu , Chun-Chi Chen
IPC分类号: H05K7/20
CPC分类号: H01L23/427 , F28D15/0275 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要: A heat dissipation device for at least two heat-generating electronic components, includes a base for contacting with the heat-generating electronic components, a first fin set arranged on one part of the base, a second fin set arranged on another part of the base and at least a heat pipe sandwiched between the base and the first and second fin sets. The first fin set includes a plurality of fins defining a plurality of air passages therebetween. The second fin set includes a plurality of fins. Every two neighboring fins define therebetween an air passage communicating with a corresponding air passage of the first fin set. A channel which is parallel to and has a width larger than that of the air passages of the first and second fin sets is defined in a middle of the second fin set.
摘要翻译: 一种用于至少两个发热电子部件的散热装置,包括用于与发热电子部件接触的基座,布置在基座的一部分上的第一翅片组,布置在基座的另一部分上的第二翅片组 以及至少夹在基座与第一和第二翅片组之间的热管。 第一翅片组包括在其间限定多个空气通道的多个翅片。 第二翅片组包括多个翅片。 每两个相邻的翅片在其间限定有与第一翅片组的相应空气通道连通的空气通道。 与第一和第二翅片组的空气通道平行并具有宽度的通道限定在第二翅片组的中间。
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公开(公告)号:US20090314465A1
公开(公告)日:2009-12-24
申请号:US12202404
申请日:2008-09-01
申请人: Dong-Bo Zheng , Meng Fu , Chun-Chi Chen
发明人: Dong-Bo Zheng , Meng Fu , Chun-Chi Chen
IPC分类号: F28F13/00
CPC分类号: H01L23/38 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要: A heat dissipation device includes a base, a fin group mounted on a top of the base, a fan mounted on a top of the fin group, a hollow fan duct mounted on the fan and a thermoelectric cooler secured on the fan duct. The thermoelectric cooler includes a cooling module having the Peltier effect and extending through a sidewall of the fan duct, and a heat sink enclosed by the fan duct and thermally contacting with the cooling module. The cooling module has a cold surface located at an inner side of the fan duct, and the heat sink thermally contacts with the cold surface of the cooling module. An airflow generated by the fan first flows through the heat sink and then reaches the fin group via the fan.
摘要翻译: 散热装置包括基座,安装在基座顶部的翅片组,安装在翼片组顶部的风扇,安装在风扇上的中空风扇导管和固定在风扇导管上的热电冷却器。 热电冷却器包括具有珀尔帖效应并延伸通过风扇管道的侧壁的冷却模块和由风扇管道封闭并与冷却模块热接触的散热器。 冷却模块具有位于风扇管道内侧的冷表面,并且散热器与冷却模块的冷表面热接触。 风扇产生的气流首先流过散热器,然后通过风扇到达散热片组。
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