-
公开(公告)号:US11887296B2
公开(公告)日:2024-01-30
申请号:US17519011
申请日:2021-11-04
Applicant: KLA Corporation
Inventor: Raja Barnwal , Saptarshi Majumder
CPC classification number: G06T7/001 , G06T7/0006 , G06V10/255 , G06V20/80 , G06T2207/30148 , G06T2207/30168 , G06T2207/30242 , G06V2201/06
Abstract: Methods and systems for setting up care areas (CAs) for inspection of a specimen are provided. One system includes an imaging subsystem configured for generating images of a specimen and a computer subsystem configured for determining a number of defects detected in predefined cells within one or more of the images generated in a repeating patterned area formed on the specimen. The computer subsystem is also configured for comparing the number of the defects detected in each of two or more of the predefined cells to a predetermined threshold and designating any one or more of the two or more of the predefined cells in which the number of the defects is greater than the predetermined threshold as one or more CAs. In addition, the computer subsystem is configured for storing information for the one or more CAs for use in inspection of the specimen.
-
公开(公告)号:US11727556B2
公开(公告)日:2023-08-15
申请号:US17489665
申请日:2021-09-29
Applicant: KLA Corporation
Inventor: Wenfei Gu , Pei-Chun Chiang , Weston Sousa
CPC classification number: G06T7/001 , G03F1/84 , G03F7/7065 , G06F16/50 , G06T7/0006 , G06T7/80 , G06T2207/30148
Abstract: Methods and systems for detecting defects on a mask are provided. One method includes generating a database reference image for a multi-die mask by simulation and detecting first defects on the mask by comparing the database reference image to images of the mask generated by an imaging subsystem for a first of the multiple dies. The method also includes generating a die reference image for the first of the multiple dies by applying one or more parameters of the imaging subsystem learned by generating the database reference image to the images generated by the imaging subsystem of one or more of the multiple dies other than the first multiple die. In addition, the method includes detecting second defects on the mask by comparing the die reference image to the images of the mask generated by the imaging subsystem for the first of the multiple dies.
-