公开(公告)号：US11727556B2

公开(公告)日：2023-08-15

申请号：US17489665

申请日：2021-09-29

Applicant: KLA Corporation

Inventor： Wenfei Gu ,  Pei-Chun Chiang ,  Weston Sousa

IPC: G06K9/00 ,  G06T7/00 ,  G06T7/80 ,  G03F7/00 ,  G06F16/50 ,  G03F1/84

CPC classification number: G06T7/001 ,  G03F1/84 ,  G03F7/7065 ,  G06F16/50 ,  G06T7/0006 ,  G06T7/80 ,  G06T2207/30148

Abstract: Methods and systems for detecting defects on a mask are provided. One method includes generating a database reference image for a multi-die mask by simulation and detecting first defects on the mask by comparing the database reference image to images of the mask generated by an imaging subsystem for a first of the multiple dies. The method also includes generating a die reference image for the first of the multiple dies by applying one or more parameters of the imaging subsystem learned by generating the database reference image to the images generated by the imaging subsystem of one or more of the multiple dies other than the first multiple die. In addition, the method includes detecting second defects on the mask by comparing the die reference image to the images of the mask generated by the imaging subsystem for the first of the multiple dies.

公开(公告)号：US20230098730A1

公开(公告)日：2023-03-30

申请号：US17489665

申请日：2021-09-29

Applicant: KLA Corporation

Inventor： Wenfei Gu ,  Pei-Chun Chiang ,  Weston Sousa

IPC: G06T7/00 ,  G06T7/80 ,  G03F1/84 ,  G03F7/20 ,  G06F16/50

Abstract: Methods and systems for detecting defects on a mask are provided. One method includes generating a database reference image for a multi-die mask by simulation and detecting first defects on the mask by comparing the database reference image to images of the mask generated by an imaging subsystem for a first of the multiple dies. The method also includes generating a die reference image for the first of the multiple dies by applying one or more parameters of the imaging subsystem learned by generating the database reference image to the images generated by the imaging subsystem of one or more of the multiple dies other than the first multiple die. In addition, the method includes detecting second defects on the mask by comparing the die reference image to the images of the mask generated by the imaging subsystem for the first of the multiple dies.