公开(公告)号：US11302672B2

公开(公告)日：2022-04-12

申请号：US16818792

申请日：2020-03-13

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Didier Campos

IPC: H01L21/00 ,  H01L25/065 ,  H01L21/56 ,  H01L21/768 ,  H01L23/31 ,  H01L23/00

Abstract: The disclosure concerns an electronic device and methods of making an electronic device. The electronic device includes a circuit that is at least partially formed in an active region of a substrate. An electronic package is stacked on the substrate. A via extends through the circuit from the active region of the substrate to a surface of the substrate that is opposite the active region. At least one contacting element connects the via to the electronic package.

公开(公告)号：US11296626B2

公开(公告)日：2022-04-05

申请号：US16921557

申请日：2020-07-06

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Rousset) SAS

Inventor： Gwenael Maillet ,  Jean-Louis Labyre ,  Gilles Bas

IPC: H02M1/44 ,  H02P7/29 ,  G05B19/042 ,  G06K19/07 ,  G06K19/00 ,  H02P7/03

Abstract: Control over the operation of an electrically-controlled motor is supported by an interface circuit between the electrically-controlled motor and a near-field radio frequency communication controller. The interface circuit includes a first circuit that receives at least one control set point through a near-field radio frequency communication issued by the near-field radio frequency communication controller. A second circuit of the interface generates one or more electric signals in pulse width modulation based on the control set point.

公开(公告)号：US11272118B2

公开(公告)日：2022-03-08

申请号：US16595192

申请日：2019-10-07

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Jerome Chossat ,  Benoit Deschamps ,  Adrien Martin

IPC: H04N5/235 ,  H04N5/225 ,  H04N5/3745 ,  H04N5/369 ,  H04N5/335 ,  G06T5/50

Abstract: An image device has an array of pixels, each pixel having a photosensitive area, a first storage node and a second storage node. A pixel is illuminated for a first period of time, and charge accumulated on the photosensitive area of the pixel during the first period of time is stored on the first storage node of the pixel. The pixel of the array is illuminated for a second period of time, and charge accumulated on the photosensitive area during the second period of time is stored on the second storage node of the pixel. A first signal is generated based on the charge stored on the first storage node, and a second signal is generated based on the charge stored on the second storage node. The first and second signals are combined using at least one subtraction operation having the first and second signals as operands.

公开(公告)号：US11264324B2

公开(公告)日：2022-03-01

申请号：US16901449

申请日：2020-06-15

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Rousset) SAS

Inventor： Samuel Boscher ,  Yann Rebours ,  Michel Cuenca

IPC: H01L23/528 ,  H01L23/50 ,  H01L23/522

Abstract: An electronic chip disclosed herein includes a plurality of IP core circuits, with a shared strip that is at least partially conductive and is linked to a node for applying a fixed potential. A plurality of tracks electrically links the plurality of IP core circuits to the shared strip. Each individual track of the plurality of tracks solely links a single one of said IP core circuits to the shared strip.

公开(公告)号：US11239796B2

公开(公告)日：2022-02-01

申请号：US17180748

申请日：2021-02-20

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics S.r.l.

Inventor： Daniele Mangano ,  Benoit Marchand ,  Santo Leotta ,  Hamilton Emmanuel Querino De Carvalho

IPC: H03B5/32 ,  G04F5/06 ,  H03L1/02 ,  H03L1/04 ,  H03L7/099 ,  H04B1/48

Abstract: An embodiment of the present disclosure relates to a device comprising an electronic circuit; an oscillation circuit comprising a quartz crystal, configured to provide a clock signal to the electronic circuit; and a heater configured to increase the temperature of the quartz crystal.

公开(公告)号：US20210407040A1

公开(公告)日：2021-12-30

申请号：US17361783

申请日：2021-06-29

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Rousset) SAS

Inventor： Julien Closs ,  Jean-Michel Delorme ,  Daniel Fauvarque ,  Laurent Folliot ,  Guillaume Legrain

IPC: G06T3/40

Abstract: An embodiment method for converting an initial digital image into a converted digital image, electronic chip, system and computer program product are disclosed, the initial digital image comprising a set of pixels, the pixels being associated respectively with colors, the initial digital image being acquired by an acquisition device, and the converted digital image able to be used by a neural network. The embodiment method comprises redimensioning of the initial digital image in order to obtain an intermediate digital image, the redimensioning being carried out by a reduction in the number of pixels of the initial image, modification of a format of one of the pixels of the intermediate digital image in order to obtain a converted digital image, the modification being carried out, after the redimensioning, by increasing the number of bits used to represent the color of the pixel.

公开(公告)号：US11211772B2

公开(公告)日：2021-12-28

申请号：US16432576

申请日：2019-06-05

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Romain Coffy ,  Jean-Michel Riviere

IPC: H01S5/068 ,  H01S3/034 ,  H01S3/02 ,  H01S5/00 ,  H01S5/183

Abstract: The disclosure concerns a housing for a light source mounted on a substrate, the housing comprising: a barrel comprising a mounting for a diffuser; and a diffuser positioned in the mounting, wherein the barrel comprises first and second conducting columns and a fuse or conductive wire electrically coupling the first and second conducting columns. A portion of the fuse is mechanically fixed to the diffuser and/or the fuse being arranged to trap the diffuser in said mounting.

公开(公告)号：US20210398919A1

公开(公告)日：2021-12-23

申请号：US17466941

申请日：2021-09-03

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Rousset) SAS

Inventor： Denis FARISON ,  Romain COFFY ,  Jean-Michel RIVIERE

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/528 ,  H01L25/065

Abstract: A first integrated circuit chip is assembled to a second integrated circuit chip with a back-to-back surface relationship. The back surfaces of the integrated circuit chips are attached to each other using one or more of an adhesive, solder or molecular bonding. The back surface of at least one the integrated circuit chips is processed to include at least one of a trench, a cavity or a saw cut.

公开(公告)号：US11204739B2

公开(公告)日：2021-12-21

申请号：US16599581

申请日：2019-10-11

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Rousset) SAS

Inventor： Mark Wallis ,  Yannick Sebillet

IPC: G06F7/544 ,  G06F17/14 ,  G06F17/16

Abstract: A microcontroller is capable of executing a process that is parameterizable by at least one parameter. The microcontroller includes a processor and a hardware module coupled to the processor. The hardware module is configured to hardware execute the process and the processor is configured to deliver the at least one parameter to the hardware module.

公开(公告)号：US11184555B2

公开(公告)日：2021-11-23

申请号：US16692638

申请日：2019-11-22

Applicant: STMicroelectronics SA ,  STMicroelectronics (Grenoble 2) SAS

Inventor： Arnaud Bourge ,  Tarek Lule ,  Gregory Roffet

IPC: H04N5/235 ,  H04N5/355 ,  H04N5/353 ,  H01L27/146

Abstract: An image sensor includes a plurality of pixels, where each of the plurality of pixels includes a photodiode. The image sensor is configured to capture images of a scene exposed with a flickering light source by for each of the plurality of pixels, acquiring a value representative of a light level at a corresponding pixel by gradually varying a value of sensitivity of the corresponding pixel.