公开(公告)号：US20090189296A1

公开(公告)日：2009-07-30

申请号：US12275172

申请日：2008-11-20

Applicant: Cheng-Ting Wu ,  Hung-Tsun Lin ,  Yu-Ren Chen ,  Chun-Ying Lin

Inventor： Cheng-Ting Wu ,  Hung-Tsun Lin ,  Yu-Ren Chen ,  Chun-Ying Lin

IPC: H01L23/52 ,  H01L21/00

CPC classification number: H01L23/3114 ,  H01L23/49517 ,  H01L23/49822 ,  H01L23/49861 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A manufacturing method for a Flip Chip Quad Flat Non-leaded package structure is provided. A lead frame having a plurality of leads is provided at first in the manufacturing method. A dielectric layer is formed on the lead frame and exposes a top surface and a bottom surface of the leads. A redistribution layer including a plurality of pads and a plurality of conductive lines connected the pads and the top surface of the leads is formed on the dielectric layer. A solder resist layer is formed to cover the redistribution layer, the dielectric layer and the leads, and expose the surface of the pads. An adhesive layer is formed on the solder resist layer. A chip having a plurality of bumps is provided. The chip is adhered on the solder resist layer with the adhesive layer and each bump is electrically connected with one of the pads.

Abstract translation: 提供了一种倒装芯片四边形扁平无铅封装结构的制造方法。 首先在制造方法中设置具有多根引线的引线框架。 在引线框架上形成介电层，并使引线的顶表面和底表面露出。 在电介质层上形成包括多个焊盘的重分配层和连接焊盘和引线顶表面的多条导线。 形成阻焊层以覆盖再分布层，电介质层和引线，并露出焊盘的表面。 在阻焊层上形成粘接层。 提供具有多个凸块的芯片。 该芯片用粘合剂层粘附在阻焊层上，并且每个凸块与其中一个焊盘电连接。

公开(公告)号：US20080281999A1

公开(公告)日：2008-11-13

申请号：US11744961

申请日：2007-05-07

Applicant: Hsin-Yu Kang ,  Cheng-Ting Wu

Inventor： Hsin-Yu Kang ,  Cheng-Ting Wu

IPC: G06F13/28

CPC classification number: G06F13/28

Abstract: In an electronic system, a DMA circuit is supplied with a device selection signal that indicates a processor is accessing or going to access a memory. If the DMA circuit finds that the processor is not accessing or not going to access the memory, the DMA circuit starts its DMA operations. Once the DMA circuit finds that the processor is going to access the memory, the DMA circuit stops its DMA operation and return the use of the memory to the processor.

Abstract translation: 在电子系统中，向DMA电路提供指示处理器正在访问或将访问存储器的设备选择信号。 如果DMA电路发现处理器没有访问或不访问存储器，DMA电路将启动其DMA操作。 一旦DMA电路发现处理器要访问存储器，DMA电路停止其DMA操作，并将存储器的使用返回给处理器。