摘要:
A manufacturing method for a Flip Chip Quad Flat Non-leaded package structure is provided. A lead frame having a plurality of leads is provided at first in the manufacturing method. A dielectric layer is formed on the lead frame and exposes a top surface and a bottom surface of the leads. A redistribution layer including a plurality of pads and a plurality of conductive lines connected the pads and the top surface of the leads is formed on the dielectric layer. A solder resist layer is formed to cover the redistribution layer, the dielectric layer and the leads, and expose the surface of the pads. An adhesive layer is formed on the solder resist layer. A chip having a plurality of bumps is provided. The chip is adhered on the solder resist layer with the adhesive layer and each bump is electrically connected with one of the pads.
摘要:
A stacked package structure with leadframe having bus bar, comprising: a leadframe composed of a plurality of inner leads arranged in rows facing each other, a plurality of outer leads, and a die pad, in which the die pad is provided between the inner leads and is vertically distant from the inner leads; a bus bar being provided between the inner leads and the die pad; an offset chip-stacked structure stacked by a plurality of chips, the offset chip-stacked structure being fixedly connected to a first surface of the die pad and electrically connected to the inner leads; and an encapsulant covering the offset chip-stacked structure, the inner leads, the first surface of die pad, and the upper surface of bus bar, the second surface of die pad and the lower surface of bus bar being exposed and the outer leads extending out of the encapsulant.
摘要:
A packaging apparatus is disclosed having a substrate with an interior area and a peripheral area. The substrate is configured to have an integrated circuit chip bonded to an adhesion structure located substantially within the interior area of the substrate. The substrate is further configured to have the integrated circuit chip electrically coupled to either the interior area on a distal surface of the substrate or the peripheral area on a proximate side of the substrate through a conductive structure. The adhesion structure includes a bonding area configured to accept an adhesive layer formed between the integrated circuit chip and the interior area of the substrate, and at least one protrusion structure being formed substantially within the bonding area of the substrate and configured to define a gap between the integrated circuit chip and the interior area of the substrate.
摘要:
A stacked package structure with leadframe having bus bar, comprising: a leadframe composed of a plurality of inner leads arranged in rows facing each other, a plurality of outer leads, and a die pad, in which the die pad is provided between the inner leads and is vertically distant from the inner leads; a bus bar being provided between the inner leads and the die pad; an offset chip-stacked structure stacked by a plurality of chips, the offset chip-stacked structure being fixedly connected to a first surface of the die pad and electrically connected to the inner leads; and an encapsulant covering the offset chip-stacked structure, the inner leads, the first surface of die pad, and the upper surface of bus bar, the second surface of die pad and the lower surface of bus bar being exposed and the outer leads extending out of the encapsulant.
摘要:
A chip package includes a thermal enhanced plate, contacts around the thermal enhanced plate and electrically insulated from the thermal enhanced plate, a film-like circuit layer disposed on the contacts and the thermal enhanced plate, a conductive adhesive layer, a first molding, and at least one chip disposed on the film-like circuit layer. The conductive adhesive layer is disposed between the contacts and the film-like circuit layer electrically connected to the contacts through the conductive adhesive layer. The chip has a back surface, an active surface and many bumps disposed thereon, and the chip is electrically connected to the film-like circuit layer via the bumps. The first molding at least encapsulates a portion of the thermal enhanced plate, the conductive adhesive layer, parts of the contacts and at least a portion of the film-like circuit layer. Therefore, heat dissipation efficiency of the light emitting chip package is improved.
摘要:
A chip package including a thermal enhanced plate, contacts around the thermal enhanced plate and electrically insulated from the thermal enhanced plate, a film-like circuit layer disposed on the contacts and the thermal enhanced plate, a conductive adhesive layer, a first molding, and at least one chip disposed on the film-like circuit layer is provided. The conductive adhesive layer is disposed between the contacts and the film-like circuit layer electrically connected to the contacts through the conductive adhesive layer. The chip has a back surface, an active surface and many bumps disposed thereon, and the chip is electrically connected to the film-like circuit layer via the bumps. The first molding at least encapsulates a portion of the thermal enhanced plate, the conductive adhesive layer, parts of the contacts and at least a portion of the film-like circuit layer. Therefore, heat dissipation efficiency of the light emitting chip package is improved.
摘要:
A chip package includes a thermal enhanced plate, contacts around the thermal enhanced plate and electrically insulated from the thermal enhanced plate, a film-like circuit layer disposed on the contacts and the thermal enhanced plate, a conductive adhesive layer, a first molding, and at least one chip disposed on the film-like circuit layer. The conductive adhesive layer is disposed between the contacts and the film-like circuit layer electrically connected to the contacts through the conductive adhesive layer. The chip has a back surface, an active surface and many bumps disposed thereon, and the chip is electrically connected to the film-like circuit layer via the bumps. The first molding at least encapsulates a portion of the thermal enhanced plate, the conductive adhesive layer, parts of the contacts and at least a portion of the film-like circuit layer. Therefore, heat dissipation efficiency of the light emitting chip package is improved.
摘要:
A chip package including a thermal enhanced plate, contacts around the thermal enhanced plate and electrically insulated from the thermal enhanced plate, a film-like circuit layer disposed on the contacts and the thermal enhanced plate, a conductive adhesive layer, a first molding, and at least one chip disposed on the film-like circuit layer is provided. The conductive adhesive layer is disposed between the contacts and the film-like circuit layer electrically connected to the contacts through the conductive adhesive layer. The chip has a back surface, an active surface and many bumps disposed thereon, and the chip is electrically connected to the film-like circuit layer via the bumps. The first molding at least encapsulates a portion of the thermal enhanced plate, the conductive adhesive layer, parts of the contacts and at least a portion of the film-like circuit layer. Therefore, heat dissipation efficiency of the light emitting chip package is improved.
摘要:
An IC package with a defined wire-bonding region primarily comprises a multi-layer lead frame with a plurality of leads, a chip, a plurality of bonding wires within the wire-bonding region, and at least an electrical transition component outside the wire-bonding region. At least a transition finger is carried on one of the lead and is electrically isolated from the corresponding carrying lead without covering inner end of the carrying lead. The parts of the electrical transition component electrically connects the transition finger to another lead that is not directly below the transition finger to reduce the crossings of the bonding wires or to increase the vertical distances between the bonding wires at the crossings to avoid electrical shorts between the bonding wires during encapsulation.
摘要:
A chip package structure including a chip, a lead frame, first bonding wires and second bonding wires is provided. The chip has an active surface, first bonding pads and second bonding pads, wherein the first bonding pads and the second bonding pads are disposed on the active surface. The chip is fixed below the lead frame, and the lead frame includes inner leads and bus bars. The inner leads and the bus bars are disposed above the active surface of the chip, and the bus bars are located between the inner leads and the corresponding first bonding pads. The first bonding wires respectively connect the first bonding pads and the bus bars. The second bonding wires respectively connect the bus bars and a part of the inner leads. The third bonding wires respectively connect the second bonding pads and the other of the inner leads.