Semiconductor structure in which like-polarity insulated-gate field-effect transistors have multiple vertical body dopant concentration maxima and different halo pocket characteristics
    22.
    发明授权
    Semiconductor structure in which like-polarity insulated-gate field-effect transistors have multiple vertical body dopant concentration maxima and different halo pocket characteristics 有权
    其中类似极性绝缘栅场效应晶体管具有多个垂直体掺杂浓度最大值和不同晕圈特征的半导体结构

    公开(公告)号:US07701005B1

    公开(公告)日:2010-04-20

    申请号:US11974751

    申请日:2007-10-15

    Abstract: Each of a pair of differently configured like-polarity insulated-gate field-effect transistors (40 or 42 and 240 or 242) in a semiconductor structure has a channel zone of semiconductor body material, a gate dielectric layer overlying the channel zone, and a gate electrode overlying the gate dielectric layer. For each transistor, the net dopant concentration of the body material reaches multiple local subsurface maxima below a channel surface depletion region and below largely all gate-electrode material overlying the channel zone. The transistors have source/drain zones (60 or 80) of opposite conductivity type to, and halo pocket portions of the same conductivity type as, the body material. One pocket portion (100/102 or 104) extends along both source/drain zones of one of the transistors. Another pocket portion (244 or 246) extends largely along only one of the source/drain zones of the other transistor so that it is asymmetrical.

    Abstract translation: 半导体结构中的一对不同构造的相同极性的绝缘栅场效应晶体管(40或42和240或242)中的每一个具有半导体主体材料的沟道区,覆盖沟道区的栅介质层和 覆盖栅介电层的栅电极。 对于每个晶体管,主体材料的净掺杂剂浓度在沟道表面耗尽区下方达到多个局部地下极大值,并且大部分覆盖在沟道区上方的所有栅电极材料。 晶体管具有与主体材料相同的导电类型的源极/漏极区域(60或80)以及与主体材料相同的导电类型的卤素口袋部分。 一个口袋部分(100/102或104)沿着一个晶体管的源极/漏极区域延伸。 另一个口袋部分(244或246)沿着另一个晶体管的源极/漏极区域中的一个较大地延伸,使得它是不对称的。

    Fabrication of semiconductor structure in which complementary field-effect transistors each have hypoabrupt body dopant distribution below at least one source/drain zone
    24.
    发明授权
    Fabrication of semiconductor structure in which complementary field-effect transistors each have hypoabrupt body dopant distribution below at least one source/drain zone 有权
    其中互补场效应晶体管在低于至少一个源极/漏极区的每个都具有低破坏的体掺杂剂分布的半导体结构的制造

    公开(公告)号:US07419863B1

    公开(公告)日:2008-09-02

    申请号:US11215537

    申请日:2005-08-29

    Abstract: Complementary IGFETs (210W and 220W or 530 and 540) are fabricated so that the body dopant concentration in each IGFET decreases by at least 10 in moving from a subsurface location in the body material of that IGFET up to one of its source/drain zones. Semiconductor dopant, typically a fast-diffusing species such as aluminum, is introduced into starting semiconductor material to form a relatively uniformly doped region that serves as body material (108) for one of the IGFETs. A remaining part of the starting material serves as body material (268) for the other IGFET. Well dopant is introduced into the body material of each IGFET for establishing the requisite body dopant profile. Alternatively, a cavity is formed through an initial structure having body material (108) doped in the preceding way for one of the IGFETs. Semiconductor material is introduced into the cavity to form the body material (568) for the other IGFET.

    Abstract translation: 制造互补IGFET(210W和220W或530和540),使得每个IGFET中的身体掺杂剂浓度从该IGFET的体材料的地下位置移动到其源极/漏极之一时减少至少10个 区域。 通常将诸如铝的快速扩散物质的半导体掺杂物引入起始半导体材料中以形成用作IGFET之一的主体材料(108)的相对均匀的掺杂区域。 起始材料的剩余部分用作另一个IGFET的主体材料(268)。 将良好的掺杂剂引入每个IGFET的主体材料中以建立必需的体掺杂物分布。 或者,通过具有以前述方式掺杂的IGFET的主体材料(108)的初始结构形成空腔。 将半导体材料引入空腔中以形成其它IGFET的主体材料(568)。

    Configuration and fabrication of semiconductor structure having asymmetric field-effect transistor with tailored pocket portion along source/drain zone
    26.
    发明授权
    Configuration and fabrication of semiconductor structure having asymmetric field-effect transistor with tailored pocket portion along source/drain zone 有权
    具有不对称场效应晶体管的半导体结构的配置和制造,沿着源/漏区具有定制的口袋部分

    公开(公告)号:US08415752B2

    公开(公告)日:2013-04-09

    申请号:US13348577

    申请日:2012-01-11

    Abstract: An asymmetric insulated-gate field effect transistor (100U or 102U) provided along an upper surface of a semiconductor body contains first and second source/drain zones (240 and 242 or 280 and 282) laterally separated by a channel zone (244 or 284) of the transistor's body material. A gate electrode (262 or 302) overlies a gate dielectric layer (260 or 300) above the channel zone. A pocket portion (250 or 290) of the body material more heavily doped than laterally adjacent material of the body material extends along largely only the first of the S/D zones and into the channel zone. The vertical dopant profile of the pocket portion is tailored to reach a plurality of local maxima (316-1-316-3) at respective locations (PH-1-PH-3) spaced apart from one another. The tailoring is typically implemented so that the vertical dopant profile of the pocket portion is relatively flat near the upper semiconductor surface. As a result, the transistor has reduced leakage current.

    Abstract translation: 沿着半导体主体的上表面设置的非对称绝缘栅场效应晶体管(100U或102U)包含由沟道区(244或284)横向隔开的第一和第二源/漏区(240和242或280和282) 的晶体管的主体材料。 栅电极(262或302)覆盖在沟道区上方的栅介电层(260或300)。 比主体材料的横向相邻材料更重掺杂的主体材料的口袋部分(250或290)在很大程度上仅延伸到第一个S / D区域并进入通道区域。 口袋部分的垂直掺杂剂轮廓被调整为在彼此间隔开的相应位置(PH-1-PH-3)处达到多个局部最大值(316-1-316-3)。 通常实施定制,使得袋部分的垂直掺杂剂分布在上半导体表面附近相对平坦。 结果,晶体管具有减小的漏电流。

    Structure and fabrication of field-effect transistor using empty well in combination with source/drain extensions or/and halo pocket
    27.
    发明授权
    Structure and fabrication of field-effect transistor using empty well in combination with source/drain extensions or/and halo pocket 有权
    使用空穴与源极/漏极延伸部分或/和晕圈组合的场效应晶体管的结构和制造

    公开(公告)号:US08410549B2

    公开(公告)日:2013-04-02

    申请号:US12382968

    申请日:2009-03-27

    Abstract: Insulated-gate field-effect transistors (“IGFETs”), both symmetric and asymmetric, suitable for a semiconductor fabrication platform that provides IGFETs for analog and digital applications, including mixed-signal applications, utilize empty-well regions in achieving high performance. A relatively small amount of semiconductor well dopant is near the top of each empty well. Each IGFET (100, 102, 112, 114, 124, or 126) has a pair of source/drain zones laterally separated by a channel zone of body material of the empty well (180, 182, 192, 194, 204, or 206). A gate electrode overlies a gate dielectric layer above the channel zone. Each source/drain zone (240, 242, 280, 282, 520, 522, 550, 552, 720, 722, 752, or 752) has a main portion (240M, 242M, 280M, 282M, 520M, 522M, 550M, 552M, 720M, 722M, 752M, or 752M) and a more lightly doped lateral extension (240E, 242E, 280E, 282E, 520E, 522E, 550E, 552E, 720E, 722E, 752E, or 752E). Alternatively or additionally, a more heavily doped pocket portion (250 or 290) of the body material extends along one of the source/drain zones. When present, the pocket portion typically causes the IGFET to be an asymmetric device.

    Abstract translation: 对称和非对称的绝缘栅场效应晶体管(IGFET)适用于为模拟和数字应用(包括混合信号应用)提供IGFET的半导体制造平台,利用空井区域实现高性能。 相对少量的半导体阱掺杂剂在每个空的孔的顶部附近。 每个IGFET(100,102,112,114,124或126)具有由空井(180,182,192,194,204或206)的主体材料的通道区横向隔开的一对源/排出区 )。 栅极电极覆盖在沟道区上方的栅极电介质层。 每个源/漏区(240,242,282,282,520,522,550,552,720,722,752或752)具有主要部分(240M,242M,280M,282M,520M,522M,550M, 552M,720M,722M,752M或752M)和更轻掺杂的侧向延伸部(240E,242E,280E,282E,520E,522E,550E,552E,720E,722E,752E或752E)。 替代地或另外地,主体材料的更加掺杂的凹穴部分(250或290)沿着源极/漏极区域中的一个延伸。 当存在时,口袋部分通常使IGFET成为非对称装置。

    Configuration and Fabrication of Semiconductor Structure in Which Source and Drain Extensions of Field-effect Transistor Are Defined with Different Dopants
    28.
    发明申请
    Configuration and Fabrication of Semiconductor Structure in Which Source and Drain Extensions of Field-effect Transistor Are Defined with Different Dopants 有权
    使用不同掺杂剂定义场效应晶体管的源极和漏极扩展的半导体结构的配置和制造

    公开(公告)号:US20120184077A1

    公开(公告)日:2012-07-19

    申请号:US13100192

    申请日:2011-05-03

    Abstract: An insulated-gate field-effect transistor (100) provided along an upper surface of a semiconductor body contains a pair of source/drain zones (240 and 242) laterally separated by a channel zone (244). A gate electrode (262) overlies a gate dielectric layer (260) above the channel zone. Each source/drain zone includes a main portion (240M or 242M) and a more lightly doped lateral extension (240E or 242E) laterally continuous with the main portion and extending laterally under the gate electrode. The lateral extensions, which terminate the channel zone along the upper semiconductor surface, are respectively largely defined by a pair of semiconductor dopants of different atomic weights. With the transistor being an asymmetric device, the source/drain zones constitute a source and a drain. The lateral extension of the source is then more lightly doped than, and defined with dopant of higher atomic weight, than the lateral extension of the drain.

    Abstract translation: 沿着半导体主体的上表面设置的绝缘栅场效应晶体管(100)包含由沟道区(244)横向隔开的一对源极/漏极区(240和242)。 栅电极(262)覆盖沟道区上方的栅介电层(260)。 每个源极/漏极区域包括主要部分(240M或242M)和与主要部分横向连续并在栅电极下方横向延伸的更轻掺杂的横向延伸部(240E或242E)。 沿着上半导体表面终止沟道区的横向延伸部分分别由不同原子量的一对半导体掺杂剂限定。 在晶体管是非对称器件的情况下,源极/漏极区域构成源极和漏极。 源极的横向延伸比起漏极的横向延伸稍微掺杂,并且由原子量较高的掺杂剂限定。

    Configuration and Fabrication of Semiconductor Structure Having Bipolar Junction Transistor in Which Non-monocrystalline Semiconductor Spacing Portion Controls Base-link Length
    29.
    发明申请
    Configuration and Fabrication of Semiconductor Structure Having Bipolar Junction Transistor in Which Non-monocrystalline Semiconductor Spacing Portion Controls Base-link Length 有权
    具有双极结晶体管的半导体结构的配置和制造,其中非单晶半导体间隔部分控制基链长度

    公开(公告)号:US20120181619A1

    公开(公告)日:2012-07-19

    申请号:US13198601

    申请日:2011-08-04

    CPC classification number: H01L27/0623 H01L21/82285 H01L21/8249 H01L27/0826

    Abstract: A semiconductor structure contains a bipolar transistor (101) and a spacing structure (265-1 or 265-2). The transistor has an emitter (241), a base (243), and a collector (245). The base is formed with an intrinsic base portion (243I), a base link portion (243L), and a base contact portion (245C). The intrinsic base portion is situated below the emitter and above material of the collector. The base link portion extends between the intrinsic base portion and the base contact portions. The spacing structure includes an isolating dielectric layer (267-1 or 267-2) and a spacing component. The dielectric layer extends along the upper semiconductor surface. The spacing component includes a lateral spacing portion (269-1 or 269-2) of largely non-monocrystalline semiconductor material, preferably polycrystalline semiconductor material, situated on the dielectric layer above the base link portion. Opposite first and second upper edges of the lateral spacing portion (275-1 and 277-1) laterally conform to opposite first and second lower edges (297-1 and 299-1) of the base link portion so as to determine, and thereby control, its length.

    Abstract translation: 半导体结构包含双极晶体管(101)和间隔结构(265-1或265-2)。 晶体管具有发射极(241),基极(243)和集电极(245)。 基部形成有本征基部(243I),基部连接部(243L)和基部接触部(245C)。 本征基部位于发射极之下和集电极材料之上。 基部连接部在本征基部与基部接触部之间延伸。 间隔结构包括隔离电介质层(267-1或267-2)和间隔部件。 电介质层沿着上半导体表面延伸。 间隔部件包括位于基部连接部分上方的电介质层上的大部分非单晶半导体材料(优选多晶半导体材料)的侧向间隔部分(269-1或269-2)。 横向间隔部分(275-1和277-1)的相对的第一和第二上边缘横向地与基部连杆部分的相对的第一和第二下边缘(297-1和299-1)相一致,以便确定,从而 控制,其长度。

    Structure and Fabrication of Field-effect Transistor for Alleviating Short-channel Effects and/or Reducing Junction Capacitance
    30.
    发明申请
    Structure and Fabrication of Field-effect Transistor for Alleviating Short-channel Effects and/or Reducing Junction Capacitance 审中-公开
    用于缓解短沟道效应和/或降低结电容的场效晶体管的结构和制造

    公开(公告)号:US20120181614A1

    公开(公告)日:2012-07-19

    申请号:US13309473

    申请日:2011-12-01

    Abstract: An IGFET (40 or 42) has a channel zone (64 or 84) situated in body material (50). Short-channel threshold voltage roll-off and punchthrough are alleviated by arranging for the net dopant concentration in the channel zone to longitudinally reach a local surface minimum at a location between the IGFET's source/drain zones (60 and 62 or 80 and 82) and by arranging for the net dopant concentration in the body material to reach a local subsurface maximum more than 0.1 μm deep into the body material but not more than 0.1 μm deep into the body material. The source/drain zones (140 and 142 or 160 and 162) of a p-channel IGFET (120 or 122) are provided with graded-junction characteristics to reduce junction capacitance, thereby increasing switching speed.

    Abstract translation: IGFET(40或42)具有位于主体材料(50)中的通道区(64或84)。 通过设置通道区域中的净掺杂剂浓度以在IGFET的源极/漏极区域(60和62或80和82)之间的位置处纵向达到局部表面最小值来减轻短通道阈值电压滚降和穿透,以及 通过排列主体材料中的净掺杂剂浓度达到主体材料深度超过0.1μm的局部表面最大深度,但不超过体积材料的0.1μm深。 p沟道IGFET(120或122)的源极/漏极区(140和142或160和162)具有渐变结特征以减小结电容,从而提高开关速度。

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