Configuration and fabrication of semiconductor structure using empty and filled wells
    1.
    发明授权
    Configuration and fabrication of semiconductor structure using empty and filled wells 有权
    使用空和填充井的半导体结构的配置和制造

    公开(公告)号:US08304835B2

    公开(公告)日:2012-11-06

    申请号:US12382973

    申请日:2009-03-27

    Abstract: A semiconductor structure, which serves as the core of a semiconductor fabrication platform, has a combination of empty-well regions and filled-well regions variously used by electronic elements, particularly insulated-gate field-effect transistors (“IGFETs”), to achieve desired electronic characteristics. A relatively small amount of semiconductor well dopant is near the top of an empty well. A considerable amount of semiconductor well dopant is near the top of a filled well. Some IGFETs (100, 102, 112, 114, 124, and 126) utilize empty wells (180, 182, 192, 194, 204, and 206) in achieving desired transistor characteristics. Other IGFETs (108, 110, 116, 118, 120, and 122) utilize filled wells (188, 190, 196, 198, 200, and 202) in achieving desired transistor characteristics. The combination of empty and filled wells enables the semiconductor fabrication platform to provide a wide variety of high-performance IGFETs from which circuit designers can select particular IGFETs for various analog and digital applications, including mixed-signal applications.

    Abstract translation: 作为半导体制造平台的核心的半导体结构具有由电子元件特别是绝缘栅场效应晶体管(IGFET)不同地使用的空阱区域和填充阱区域的组合,以实现期望的电子 特点 相当少量的半导体阱掺杂剂靠近空穴的顶部。 相当数量的半导体阱掺杂剂靠近填充井的顶部。 一些IGFET(100,102,112,114,124和126)利用空井(180,182,192,194,204和206)实现期望的晶体管特性。 其它IGFET(108,110,116,118,120和122)利用填充的孔(188,190,196,198,200和202)实现期望的晶体管特性。 空孔和填充孔的组合使得半导体制造平台能够提供各种各样的高性能IGFET,电路设计者可以从其中选择特定的IGFET用于各种模拟和数字应用,包括混合信号应用。

    Configuration and fabrication of semiconductor structure using empty and filled wells
    2.
    发明申请
    Configuration and fabrication of semiconductor structure using empty and filled wells 有权
    使用空和填充井的半导体结构的配置和制造

    公开(公告)号:US20100244128A1

    公开(公告)日:2010-09-30

    申请号:US12382973

    申请日:2009-03-27

    Abstract: A semiconductor structure, which serves as the core of a semiconductor fabrication platform, has a combination of empty-well regions and filled-well regions variously used by electronic elements, particularly insulated-gate field-effect transistors (“IGFETs”), to achieve desired electronic characteristics. A relatively small amount of semiconductor well dopant is near the top of an empty well. A considerable amount of semiconductor well dopant is near the top of a filled well. Some IGFETs (100, 102, 112, 114, 124, and 126) utilize empty wells (180, 182, 192, 194, 204, and 206) in achieving desired transistor characteristics. Other IGFETs (108, 110, 116, 118, 120, and 122) utilize filled wells (188, 190, 196, 198, 200, and 202) in achieving desired transistor characteristics. The combination of empty and filled wells enables the semiconductor fabrication platform to provide a wide variety of high-performance IGFETs from which circuit designers can select particular IGFETs for various analog and digital applications, including mixed-signal applications.

    Abstract translation: 作为半导体制造平台的核心的半导体结构具有由电子元件特别是绝缘栅场效应晶体管(“IGFET”)不同地使用的空阱区域和填充阱区域的组合,以实现 所需的电子特性。 相当少量的半导体阱掺杂剂靠近空穴的顶部。 相当数量的半导体阱掺杂剂靠近填充井的顶部。 一些IGFET(100,102,112,114,124和126)利用空井(180,182,192,194,204和206)实现期望的晶体管特性。 其它IGFET(108,110,116,118,120和122)利用填充的孔(188,190,196,198,200和202)实现期望的晶体管特性。 空孔和填充孔的组合使得半导体制造平台能够提供各种各样的高性能IGFET,电路设计者可以从其中选择特定的IGFET用于各种模拟和数字应用,包括混合信号应用。

    Integrated inductor
    3.
    发明授权
    Integrated inductor 失效
    集成电感

    公开(公告)号:US5844299A

    公开(公告)日:1998-12-01

    申请号:US791987

    申请日:1997-01-31

    CPC classification number: H01L28/10

    Abstract: An integrated inductor with filled etch includes a substrate of semiconductor material which includes a surface and a cavity disposed therein, a mass of dielectric material disposed within the cavity, a layer of dielectric material disposed upon the mass of dielectric material, and a patterned layer of conductive material disposed upon the layer of dielectric material, such that the integrated inductor is formed without an oxide bridge. Thus, the integrated inductor has a rugged architecture.

    Abstract translation: 具有填充蚀刻的集成电感器包括半导体材料的衬底,其包括设置在其中的表面和空腔,设置在空腔内的介电材料块,设置在电介质材料块上的介电材料层,以及设置在 导电材料设置在电介质材料层上,使得集成电感器形成为没有氧化物桥。 因此,集成电感器具有坚固的结构。

    Enhancement-depletion mode cascode current mirror
    4.
    发明授权
    Enhancement-depletion mode cascode current mirror 失效
    增强耗尽型共源共栅电流镜

    公开(公告)号:US5311115A

    公开(公告)日:1994-05-10

    申请号:US104827

    申请日:1993-08-11

    Inventor: Donald M. Archer

    CPC classification number: G05F3/262 H01L27/0883

    Abstract: An improved current source having high output impedance, low saturation voltage, and less sensitivity to process parameters is achieved by having enhancement P-channel transistor devices used as current mirror, while depletion P-channel transistor devices are provided as the cascode devices. A "diode connected" depletion device may be inserted between the enhancement gate and the drain of the current reference transistor to reduce saturation voltage. The "diode connected" depletion device keeps the drains of the enhancement devices at a similar voltage even when the enhancement and depletion device threshold, i.e. V.sub.T, do not track over temperature or process. Thus, the current mirror circuit provides not only higher output impedance, lower saturation voltage, but is also less sensitive to process variation.

    Abstract translation: 通过使用增强型P沟道晶体管器件作为电流镜来实现具有高输出阻抗,低饱和电压和对工艺参数的较小灵敏度的改进的电流源,而耗尽P沟道晶体管器件被提供为共源共栅器件。 “二极管连接”耗尽装置可以插入在电流参考晶体管的增强栅极和漏极之间以降低饱和电压。 即使当增强和耗尽装置阈值(即VT)不跟踪温度或过程时,“二极管连接”耗尽装置仍将增强装置的排水管保持在相似的电压。 因此,电流镜电路不仅提供更高的输出阻抗,更低的饱和电压,而且对工艺变化也不太敏感。

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