公开(公告)号：US5831336A

公开(公告)日：1998-11-03

申请号：US687272

申请日：1996-07-25

申请人： Giulio DiGiacomo

发明人： Giulio DiGiacomo

IPC分类号： B23K35/26 ,  C22C11/06 ,  H01L21/60 ,  H05K3/34 ,  H01L23/48

CPC分类号： H01L24/81 ,  B23K35/268 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19043

摘要： An enhanced fatigue life solder comprising, by weight, about 1-3% tin, about 1-3% silver and the balance essentially lead is provided. The solder is particularly useful for joining electronic components and in particular for making C-4 interconnections. A method for using the solder to make electronic components and electric components made using the method are also provided.

公开(公告)号：US4360289A

公开(公告)日：1982-11-23

申请号：US164643

申请日：1980-06-30

申请人： Armando S. Cammarano ,  Giulio DiGiacomo

发明人： Armando S. Cammarano ,  Giulio DiGiacomo

IPC分类号： H01L23/50 ,  H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H05K3/34 ,  B25G3/34 ,  F16B11/00 ,  F16B12/04 ,  F16L13/00

CPC分类号： H01L23/49811 ,  H01L21/4853 ,  H01L24/01 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/01082 ,  H05K3/3426 ,  Y10T403/477 ,  Y10T403/479

摘要： A pin designed to be attached to a solid state module for making connection between the module and other parts of a metallurgical system. The end of the pin that is to be brazed to the module has a sloping (e.g., conical or wedge) shaped head so that gas bubbles can readily escape during brazing, thus reducing voids in the braze.

摘要翻译： 设计成连接到固态模块的引脚，用于在模块与冶金系统的其它部件之间进行连接。 要钎焊到模块的销的端部具有倾斜（例如，锥形或楔形）形状的头部，使得气泡可以在钎焊期间容易地逸出，从而减少钎焊中的空隙。