公开(公告)号：US20090160653A1

公开(公告)日：2009-06-25

申请号：US12003615

申请日：2007-12-28

Applicant: Hsin-Hsien Yeh ,  Ying-Chang Hung ,  Jiun-Jang Yu ,  Hong-Ching Lin ,  Chiung-Hsiung Chen

Inventor： Hsin-Hsien Yeh ,  Ying-Chang Hung ,  Jiun-Jang Yu ,  Hong-Ching Lin ,  Chiung-Hsiung Chen

IPC: G08B1/00

CPC classification number: G06K19/07749 ,  G06K19/07771 ,  H01Q1/2208 ,  H01Q7/00

Abstract: An anti-metal radio frequency identification (RFID) tag and a manufacturing method thereof are described. The anti-metal RFID tag includes a substrate having a first surface and a second surface on an opposite side thereof; a planar integral antenna formed on the first surface of the substrate; a RFID transceiver chip (i.e., RFID chip) disposed on the surface of the substrate and coupled to a signal feed point of the planar integral antenna. The flexible planar integral antenna and substrate are folded and then fixed by a fixing mechanism to form an anti-metal RFID tag with a feed-in structure, a RFID transceiver chip, and a radiator on one side, and a ground plane on the opposite side. A spacer is further sandwiched in the center of the folded structure, which is helpful for improving the antenna gain of the anti-metal RFID tag.

Abstract translation: 描述了一种反金​​属射频识别（RFID）标签及其制造方法。 所述反金属RFID标签包括具有第一表面和在其相对侧上的第二表面的基板; 形成在所述基板的第一表面上的平面集成天线; RFID收发器芯片（即，RFID芯片），其布置在基板的表面上并且耦合到平面一体式天线的信号馈送点。 柔性平面一体化天线和基板被折叠然后通过固定机构固定，以形成具有馈入结构的反金属RFID标签，RFID收发器芯片和一侧的散热器，以及相对的接地平面 侧。 间隔件进一步夹在折叠结构的中心，这有助于提高反金属RFID标签的天线增益。

公开(公告)号：US20050142839A1

公开(公告)日：2005-06-30

申请号：US11002509

申请日：2004-12-02

Applicant: Ying-Chang Houng ,  Hong-Ching Lin ,  Chi-Jen Shih ,  Shao-Ju Shih

Inventor： Ying-Chang Houng ,  Hong-Ching Lin ,  Chi-Jen Shih ,  Shao-Ju Shih

IPC: C23C18/06 ,  C23C18/08 ,  H01B1/22 ,  H01L21/4763 ,  H05K1/09 ,  H05K3/10

CPC classification number: C23C18/06 ,  C23C18/08 ,  H05K1/097 ,  H05K3/105 ,  Y10T428/256

Abstract: Methods for forming conductive layers. A layer of metal composite is applied on a substrate, comprising a plurality of metal flakes, a plurality of nanometer metal spheres, and a plurality of mixed metal precursors. The plurality of mixed metal precursors comprises a mixture of inorganic salts and organic acidic salts. The layer of metal composite is cured to induce an exothermic reaction, thereby forming a conductive layer on the substrate at a relatively low temperature (

Abstract translation: 形成导电层的方法。 将金属复合材料层施加在基板上，包括多个金属薄片，多个纳米金属球体和多个混合金属前体。 多种混合金属前体包括无机盐和有机酸性盐的混合物。 金属复合材料层被固化以引起放热反应，从而在相对低的温度（<200℃）下在基板上形成导电层，