CARD INLAY FOR DIRECT CONNECTION OR INDUCTIVE COUPLING TECHNOLOGY

    公开(公告)号:US20240346280A1

    公开(公告)日:2024-10-17

    申请号:US18753146

    申请日:2024-06-25

    IPC分类号: G06K19/077 H01Q1/22

    摘要: An inlay for a chip card. The inlay includes a module coupling antenna for inductively coupling to a chip module antenna of a chip module and a card reader coupling antenna for inductively coupling to a reader antenna of an external card reader. The card reader coupling antenna is electrically connected to the module coupling antenna. The inlay also includes a chip capacitor module that is electrically connected to the card reader coupling antenna for enabling the card reader coupling antenna to resonate at a predetermined frequency. The chip capacitor module includes at least one passive component for storing electrical energy. The at least one passive component has a capacitance within a range from 40 picofarads to 140 picofarads and a major area that is smaller than 2.6 square millimetres.

    Antenna device and electronic apparatus

    公开(公告)号:US12068546B2

    公开(公告)日:2024-08-20

    申请号:US17683403

    申请日:2022-03-01

    CPC分类号: H01Q7/00 H01Q1/2208 H01Q1/38

    摘要: An antenna device includes first and second coils. A portion of the first coil overlaps a coil opening of the second coil, and a portion of the second coil overlaps a coil opening of the first coil. The first coil includes a first coil conductor on a first surface of a base material and a first coil conductor on a second surface. The first coil includes a single-layer portion in which the first coil conductor is only on the first surface of the base material, and the second coil conductor intersects the first coil conductor at a portion facing the single-layer portion on the second surface of the base material.

    Electronic seal having spring antenna

    公开(公告)号:US11973294B2

    公开(公告)日:2024-04-30

    申请号:US17864360

    申请日:2022-07-13

    申请人: Chih-Chuan Chen

    发明人: Chih-Chuan Chen

    IPC分类号: H01R13/639 H01Q1/22 H01Q9/30

    摘要: The present invention includes a plug bolt and a bolt seat. The plug bolt includes a bolt pin having an upper buckle and a receiving hole that receives a circuit device including an RFID chip and a lower contact point therein. The bolt seat includes a lower monopole antenna, a locking hole into which the bolt pin is insertable, and a lower buckle by which the upper buckle is positionable. The bolt pin is manipulatable to lock up with the bolt seat and set the lower monopole antenna and the lower contact point in electrical connection to activate the RFID chip. The lower monopole antenna includes a spring at a location corresponding to the locking hole. The spring provides preloading for keeping electrical connection between the lower monopole antenna and the lower contact point. The spring is set to match with a frequency band of a host device.

    Method to manufacture an electronic device for a rubber article

    公开(公告)号:US11960953B2

    公开(公告)日:2024-04-16

    申请号:US18265003

    申请日:2021-12-02

    摘要: A method to manufacture an electronic device (1) to be applied to rubber article. The device comprises (i) an electronic element (5, 6, 7), (ii) a covering element made of one or more layers (3) of thermoplastic material and arranged to cover said electronic element (5, 6, 7), and (iii) at least a rubber layer (4) arranged to cover at least part of an outer surface (3a) of the covering element. The method comprises a preliminary step comprising (a) a deposition operation, during which an adhesive solution consisting of a basic water solution comprising a latex of an elastomer rubber and a combination of resorcinol and formaldehyde is applied on at least part of one outer surface (3a) of said covering element; and (b) a heating operation, during which the part of the outer surface of the covering element on which the adhesive solution was applied is kept at a temperature ranging from 120 to 230° C. for an amount of time ranging from 2 to 15 min.