摘要:
An optoelectronic transceiver module having a housing with a first opening at a first end and a second opening at a second end, a printed circuit board mounted within the housing, an electrical connector on the printed circuit board at the first end of the optoelectronic transceiver module, the electrical connector having an insulative mating surface within the first opening and including a first side with electrical contacts in an area oriented substantially parallel to the first side of the insulative mating surface, wherein the electrical contacts slidingly engage a circuit card connector of a host receptacle in order to quickly install and remove the optoelectronic transceiver module from within the circuit card connector, an optical assembly on the printed circuit board at the second end of the optoelectronic transceiver module, the optical assembly including a transmitting optical subassembly and a receiving optical subassembly, the second opening allowing the optical assembly to communicate outside of the housing in order for the optical assembly to be coupled with a duplex fiber optic plug providing for bi-directional data transmission over an optical data link, a data storage module within the housing having a configurable address corresponding to the address of the optoelectronic transceiver module and address contacts electrically connected to at least some of the electrical contacts of the electrical connector, thereby enabling a host receptacle to communicate with the address contacts of the data storage module via the electrical contacts of the electrical connector in order to determine an address of the optoelectronic transceiver module.
摘要:
An optical package is provide including a housing having first and second ends. A ferrule receiving bore is formed in the first end, and an optics cavity is formed in the second end. The optics cavity and the ferrule receiving bore are axially aligned with one another along an optical axis defined by the package. A mounting cap is inserted over the optics cavity and frictionally engages an outer surface of the housing. The end cap includes an endplate and a substrate having an optical device mounted thereon. The sleeve, focusing element and a mounting ring may be insert molded within the housing.
摘要:
The transceiver includes a housing, a transmitting optical sub-assembly mounted in the housing, a receiving optical sub-assembly mounted in the housing, a first electrical connector associated with the transmitting optical sub-assembly, a second electrical connector associated with the receiving optical sub-assembly, and an electro-magnetic shield mounted on the housing. The housing includes a first fiber optic connector receptacle, a second fiber optic connector receptacle, and a first side, and the housing is made of an electrically conductive material.
摘要:
A pluggable optical transceiver module includes two optoelectronic devices mounted to a printed circuit board, and a High Speed Serial Data Connector connected to the printed circuit board. The printed circuit board, and associated optoelectronic devices and the High Speed Serial Data Connector being mounted in a housing. One of the two optoelectronic devices is a transmitter. The other of the two optoelectronic devices is a receiver. The pluggable optical transceiver module converts optical signal to electrical signals, and, also, converts electrical signals to optical signals. The High Speed Serial Data Connector is pluggable into a High Speed Serial Data Connector receptacle of a host device. Another portion of the module may have ports for receiving LC style fiber optic connectors.
摘要:
An optoelectronic transmitter is provided including a semiconductor laser as the active optical transmitting element. The transmitter includes first and second printed circuit boards, with the first printed circuit board having mounted thereon electronic components and circuitry for driving the optoelectronic transmitter. A transmitting optical sub-assembly (TOSA) is mounted to the second printed circuit board. The second printed circuit board has an array of solder pads disposed on the back surface thereof, and the first printed circuit board has a corresponding array of solder pads disposed along an outer edge of the board. Spacing of the solder pads is such that when the first printed circuit board is placed in perpendicular abutment against the outer edge of the first printed circuit board, the solder pads formed on the first printed circuit board are aligned adjacent to the solder pads disposed on the back of the second printed circuit board. Solder joints are then formed in the angular space between the solder pads disposed on the first and second printed circuit boards, bonding the boards together while simultaneously providing electrical connections between the various components mounted on the individual printed circuit boards. An improved control circuit for driving the semiconductor laser transmitter facilitates this arrangement. The improved control circuit provides both automatic power control and laser slope compensation in order to normalize the output characteristics of individual transceivers. An alternate embodiment further includes a laser fault latching circuit for disabling the laser transmitter, and providing laser fault indication.
摘要:
An optical package is provide including a housing having first and second ends. A ferrule receiving bore is formed in the first end, and an optics cavity is formed in the second end. The optics cavity and the ferrule receiving bore are axially aligned with one another along an optical axis defined by the package. A mounting cap is inserted over the optics cavity and frictionally engages an outer surface of the housing. The end cap includes an endplate and a substrate having an optical device mounted thereon.
摘要:
The present invention provides in improved Transmitting Optical Subassembly (TOSA) for coupling an optical output signal from an optical transmitter to an optical fiber sheathed within a fiber optic connector ferrule. The TOSA includes a housing formed of precision molded plastic or machined metal. A first end of the housing includes an optics cavity configured to receive an optical element for emitting an optical signal. A second end of the housing is configured as a long bore configured to receive an optical fiber connector ferrule. The housing further defines a lens cavity for retaining a focusing element between the optics cavity and the ferrule receiving bore. Finally, the housing also includes an attenuator receiving aperture between the optics cavity and the ferrule receiving bore. The plug receiving aperture is configured to removably receive an attenuation plug whereby the optical output of the optical element passes through the attenuator plug and is attenuated. The present invention further provides a method of normalizing the output signal of optical transmitters by measuring the output signals of the transmitters, comparing the measured signals to a normal reference signal, and attenuating the measured signal in order to more nearly match the reference signal.
摘要:
A Media Interface Adapter (MIA) module is provided for converting Fiber Channel data signals from a first copper transfer medium to a second alternate transfer medium. The MIA includes an internal mounted printed circuit board containing the electronic components necessary to convert signals between the first copper medium and second alternate medium. A transmitter is provided for transmitting the data signals over the second alternate transfer medium, and a receiver is provided for receiving data signals over the second alternate transfer medium. Opposite the transmitter and receiver, a nine pin electrical D-sub connector is provided for connecting the module to the first copper transfer medium. The D-sub connector has a metal flange insertable into a connector mounting structures formed in the housing. The connector mounting structures being configured to partially overlap the flange of the D-sub connector. Likewise, the first and second housing members further include transmitter and receiver mounting structures configured to partially overlap the transmitter and receiver packages. Finally, the housing members are configured to enclose the printed circuit board, transmitter, receiver, and electrical connector, the first and second housing members having longitudinal sidewalls including overlapping mating structures forming an overlapping joint between the two housing members.
摘要:
A robust optoelectronic transceiver module which is quick, easy, and inexpensive to manufacture. The transceiver module has a main housing which consists of a potting box with potting material inserted therein. In addition, a circuit board is encased by the potting material. The circuit board has an optical subassembly mounted thereon. The optical subassembly extends outside of the potting box through a recess. Correspondingly, a recess cover is provided for forming a liquid tight seal between the recess cover, the potting box, and the optical subassembly. The module housing may be pluggable via release levers having detentes received in apertures of a receptacle and a pluggable connector of the module mated within the receptacle. The receptacle may include grounding means such as a ground clip mounted within the receptacle and a protective door to limit electromagnetic emissions.
摘要:
An optical package is provided having a diode mounted to a substrate enclosed by a housing which includes a bore for receiving an optical waveguide and a focusing element adjacent the bore. The bore and focusing element are aligned along a common optical axis. An alignment means is associated with the housing for aligning the substrate along the optical axis.