公开(公告)号：US20100081272A1

公开(公告)日：2010-04-01

申请号：US12241744

申请日：2008-09-30

Applicant: Woo Jin Jang ,  Sung Dong Cho ,  Hyung Woo Kim ,  Bum Ki Moon

Inventor： Woo Jin Jang ,  Sung Dong Cho ,  Hyung Woo Kim ,  Bum Ki Moon

IPC: H01L21/768

CPC classification number: H01L21/76804 ,  H01L21/76805 ,  H01L21/76832 ,  H01L21/76834 ,  H01L21/76844 ,  H01L21/76847 ,  H01L21/76849 ,  H01L21/76877 ,  H01L23/5226 ,  H01L23/53233 ,  H01L23/53238 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Methods of forming electrical interconnects include forming a copper pattern on a semiconductor substrate and then forming an electrically insulating capping layer on the copper pattern and an interlayer insulating layer on the electrically insulating capping layer. A contact hole is then formed, which extends through the interlayer insulating layer and the electrically insulating capping layer and exposes an upper surface of the copper pattern. An electroless plating step is then performed to form a copper pattern extension onto the exposed upper surface of the copper pattern. The copper pattern extension may have a thickness that is less than a thickness of the electrically insulating capping layer, which may be formed as a SiCN layer.

Abstract translation: 形成电互连的方法包括在半导体衬底上形成铜图案，然后在铜图案上形成电绝缘覆盖层，以及在电绝缘覆盖层上形成层间绝缘层。 然后形成接触孔，其延伸穿过层间绝缘层和电绝缘覆盖层并暴露铜图案的上表面。 然后执行化学镀步骤以在铜图案的暴露的上表面上形成铜图案延伸。 铜图案延伸部的厚度可以小于可以形成为SiCN层的电绝缘覆盖层的厚度。

公开(公告)号：US20080298292A1

公开(公告)日：2008-12-04

申请号：US12159029

申请日：2006-12-29

Applicant: Woo Jin Jang

Inventor： Woo Jin Jang

IPC: G08C17/00

CPC classification number: H04W24/00 ,  H04W52/0216 ,  H04W80/00 ,  Y02D70/1242 ,  Y02D70/142 ,  Y02D70/144 ,  Y02D70/146 ,  Y02D70/164 ,  Y02D70/23 ,  Y02D70/24

Abstract: A wireless broadband Internet (WiBro) terminal and a method of determining a sleep mode of a WiBro terminal, which can measure a strength of a preamble signal and determine an effective sleep interval are provided. A WiBro terminal, which can measure a strength of a preamble signal in the listening mode during an L frame after operating in a sleep mode during an N1 frame, and operate in a sleep mode during either an N1 or 2*N1 frames, or perform a normal operation when MOB_TRF_IND is positive, resulting from the comparing the strength with a threshold value, is provided.

Abstract translation: 提供了一种无线宽带因特网（WiBro）终端和确定WiBro终端的睡眠模式的方法，其可以测量前导码信号的强度并确定有效睡眠间隔。 WiBro终端，其可以在N1帧期间以睡眠模式操作之后在L帧期间在聆听模式下测量前导信号的强度，并且在N1或2 * N1帧期间以睡眠模式操作，或执行 提供了通过将强度与阈值进行比较而导致的MOB_TRF_IND为正的正常操作。

公开(公告)号：US20080238279A1

公开(公告)日：2008-10-02

申请号：US12061541

申请日：2008-04-02

Applicant: Woo Jin JANG

Inventor： Woo Jin JANG

IPC: A47B96/00

CPC classification number: F25D23/02 ,  F25D2323/023 ,  Y10T29/49

Abstract: Provided is a home-bar door and a method of manufacturing the home-bar door. The home-bar door includes a first case, an insulating plate, and a second case. The first case forms a portion of an exterior of the home-bar door, and the insulating plate is disposed in the first case as a separate component. The second case is configured to be coupled to the first case to cover the insulating plate and form the exterior of the home-bar door. Therefore, since the first and second cases can be coupled to each other after disposing the insulating plate between the first and second cases, the home-bar door can be efficiently manufactured and have good quality.

Abstract translation: 提供家庭酒吧门和制造家庭酒吧门的方法。 家庭门包括第一壳体，绝缘板和第二壳体。 第一种情况形成家庭门的外部的一部分，并且绝缘板作为单独的部件设置在第一壳体中。 第二壳体被配置为联接到第一壳体以覆盖绝缘板并形成家庭门的外部。 因此，由于第一壳体和第二壳体可以在将绝缘板设置在第一壳体和第二壳体之间而彼此耦合，所以可以有效地制造家用门门并且具有良好的质量。

公开(公告)号：US20070080453A1

公开(公告)日：2007-04-12

申请号：US11542283

申请日：2006-10-03

Applicant: Woo-jin Jang ,  Seung-won Lee

Inventor： Woo-jin Jang ,  Seung-won Lee

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H01L24/13 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/05666 ,  H01L2224/13099 ,  H01L2224/13166 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/01074 ,  H01L2224/05599

Abstract: A semiconductor chip includes a plurality of chip pads and a plurality of bumps formed on respective chip pads, each bumps including a bump main body and a conductive particle disposed on the bump main body and exposed to the air, the conductive particle including an elastic portion made of an elastic material and a conductive layer enclosing the elastic portion.

Abstract translation: 半导体芯片包括多个芯片焊盘和形成在各个芯片焊盘上的多个凸块，每个凸块包括设置在凸块主体上并暴露于空气的凸块主体和导电颗粒，导电颗粒包括弹性部分 由弹性材料制成，导电层由弹性部分包围。