Abstract:
A light emitting diode (LED) package including a carrier, a housing, at least one LED chip and at least one electrostatic discharge protector (ESD protector) is provided. The housing encapsulating a portion of the carrier has at least one first opening, at least one second opening and a barricade. The barricade separates the first opening from the second opening. The first opening and the second opening expose a first surface of the carrier. The LED chip is disposed on the first surface of the carrier, located in the first opening, and electrically connected to the carrier. The ESD protector is disposed on the first surface of the carrier, located in the second opening, and electrically connected to the carrier.
Abstract:
A method and apparatus for deriving a temporal motion vector predictor (MVP) are disclosed. The MVP is derived for a current block of a current picture in Inter, or Merge, or Skip mode based on co-located reference blocks of a co-located block and a flag is used to indicate the co-located picture. More than one co-located reference blocks can be used to derive the temporal MVP and the co-located reference blocks can be selected from the co-located block as well as neighboring blocks of the co-located block. A search set comprises search motion vectors associated with the co-located reference block(s) is formed. The search motion vector (MV) corresponding to the co-located reference block in the same reference list is searched before the search MV in a different reference list. Various schemes to accommodate implicit method of deriving co-located picture are also disclosed.
Abstract:
An apparatus and method for deriving a motion vector predictor are disclosed. In video coding systems, the spatial and temporal redundancy is exploited using spatial and temporal prediction to reduce the information to be transmitted or stored. Motion vector prediction has been used to further conserve the bitrate associated with motion vector coding. In a conventional coding system, a motion vector predictor (MVP) is selected from the spatial MVPs and temporal MVP. The spatial MVP according to a conventional approach is based on motion vectors (MVs) of neighboring blocking pointing to a target reference picture in a given reference list. Embodiments according to the present invention perform the MVP search among an extended search set including MVs pointing to other reference pictures in the given reference list or the other reference list and MVs pointing to the target reference picture in the given reference list or the other reference list. Other aspects of the present invention address the search order of the search set and configuration of neighboring blocks.
Abstract:
A light emitting diode (LED) package including a carrier, a housing, at least one LED chip and at least one electrostatic discharge protector (ESD protector) is provided. The housing encapsulating a portion of the carrier has at least one first opening, at least one second opening and a barricade. The barricade separates the first opening from the second opening. The first opening and the second opening expose a first surface of the carrier. The LED chip is disposed on the first surface of the carrier, located in the first opening, and electrically connected to the carrier. The ESD protector is disposed on the first surface of the carrier, located in the second opening, and electrically connected to the carrier.
Abstract:
A method for forming a semiconductor element structure is provided. First, a substrate including a first MOS and a second MOS is provided. The gate electrode of the first MOS is connected to the gate electrode of the second MOS, wherein the first MOS includes a first high-K material and a first metal for use in a first gate, and a second MOS includes a second high-K material and a second metal for use in a second gate. Then the first gate and the second gate are partially removed to form a connecting recess. Afterwards, the connecting recess is filled with a conductive material to form a bridge channel for electrically connecting the first metal and the second metal.
Abstract:
A dental traction device comprises an extension main-body, a tractive-body, a blocking-stopping-body, and a seat-body. When using, the dental orthotics are firstly set and the dental correction archwire connection is set, and the bone nail is set at the gum; then, the seat-body is fixed on the dental correction archwire; one end of the elastic element is bypass the blocking-stopping-body to stick and engage on the tractive-body and the other end is stuck and engaged on the bone nail; then the blocking-stopping-body is cooperated with the tractive-body to fix the elastic element to avoid falling-off; and the contraction elastic force of the elastic element generates the pulling force to the dental correction archwire and the teeth by using the extension main-body as the force moment to produce the traction correction effect; and so as to achieve the practicality and progressiveness which is convenient in use and avoids falling-off.
Abstract:
A manufacturing method for a semiconductor device having a metal gate is provided. First and second gate trenches are respectively formed in first and second semiconductor devices. A work-function metal layer is formed in the first and second gate trenches. A shielding layer is formed on the substrate. A first removing step is performed, so that the remaining shielding layer is at bottom of the second gate trench and fills up the first gate trench. A second removing step is performed, so that the remaining shielding layer is at bottom of the first gate trench to expose the work-function metal layer at sidewall of the first gate trench and in the second gate trench. The work-function metal layer not covered by the remaining shielding layer is removed, so that the remaining work-function metal layer is only at bottom of the first gate trench. The remaining shielding layer is removed.
Abstract:
A light emitting diode (LED) package including a carrier, a housing, at least one LED chip and at least one electrostatic discharge protector (ESD protector) is provided. The housing encapsulating a portion of the carrier has at least one first opening, at least one second opening and a barricade. The barricade separates the first opening from the second opening. The first opening and the second opening expose a first surface of the carrier. The LED chip is disposed on the first surface of the carrier, located in the first opening, and electrically connected to the carrier. The ESD protector is disposed on the first surface of the carrier, located in the second opening, and electrically connected to the carrier.
Abstract:
A method for fabricating metal gate transistor is disclosed. First, a substrate having a first transistor region and a second transistor region is provided. Next, a stacked film is formed on the substrate, in which the stacked film includes at least one high-k dielectric layer and a first metal layer. The stacked film is patterned to form a plurality of gates in the first transistor region and the second transistor region, a dielectric layer is formed on the gates, and a portion of the dielectric layer is planarized until reaching the top of each gates. The first metal layer is removed from the gate of the second transistor region, and a second metal layer is formed over the surface of the dielectric layer and each gate for forming a plurality of metal gates in the first transistor region and the second transistor region.