公开(公告)号：US20210343610A1

公开(公告)日：2021-11-04

申请号：US17367762

申请日：2021-07-06

Applicant: AGC Inc.

Inventor： Yu HANAWA ,  Shigeki SAWAMURA ,  Shuhei NOMURA ,  Kazutaka ONO ,  Nobuhiko TAKESHITA ,  Keisuke HANASHIMA

IPC: H01L23/15 ,  C03C27/04 ,  C03C3/085 ,  C03C3/087 ,  C03C3/091 ,  C03C3/093 ,  C03C17/22 ,  H01L23/13

Abstract: The present invention provides a glass substrate in which in a step of sticking a glass substrate and a silicon-containing substrate to each other, bubbles hardly intrude therebetween. The present invention relates to a glass substrate for forming a laminated substrate by lamination with a silicon-containing substrate, having a warpage of 2 μm to 300 μm, and an inclination angle due to the warpage of 0.0004° to 0.12°.