公开(公告)号：US20230357091A1

公开(公告)日：2023-11-09

申请号：US18353977

申请日：2023-07-18

Applicant: AGC Inc.

Inventor： Yu HANAWA ,  Shuhei OGAWA ,  Seiji INABA

IPC: C04B37/04 ,  C03C3/091 ,  C03C3/093 ,  C03C3/06 ,  C03C3/087 ,  C03C3/097 ,  B32B17/06 ,  B32B9/00 ,  B32B18/00 ,  B32B7/12 ,  B32B7/027 ,  B32B7/022

CPC classification number: C04B37/047 ,  C03C3/091 ,  C03C3/093 ,  C03C3/06 ,  C03C3/087 ,  C03C3/097 ,  B32B17/06 ,  B32B9/005 ,  B32B18/00 ,  B32B7/12 ,  B32B7/027 ,  B32B7/022 ,  C04B2237/365 ,  B32B2307/54 ,  B32B2307/412 ,  B32B2307/302 ,  B32B2307/7376 ,  B32B2307/306 ,  B32B2307/72 ,  B32B2255/26 ,  B32B2307/558

Abstract: The present invention relates to a laminated member, including: a glass member having a linear transmittance at a wavelength of 850 nm of 80% or more; a bonding layer containing a resin and lying on the glass member; and a Si—SiC member lying on the bonding layer, in which the glass member includes predetermined amounts of SiO2, Al2O3, B2O3, and P2O5, the Si—SiC member has an average linear expansion coefficient α at 20 to 200° C. of 2.85 to 4.00 ppm/° C., and has an average linear expansion coefficient β at 20 to 200° C. of 1.50 to 5.00 ppm/° C., and the laminated member has an absolute value |α−β|, which is a value obtained by subtracting β from α, of 2.00 ppm/° C. or less.

公开(公告)号：US20220002183A1

公开(公告)日：2022-01-06

申请号：US17480440

申请日：2021-09-21

Applicant: AGC INC.

Inventor： Yu HANAWA ,  Kazutaka ONO ,  Shigeki SAWAMURA

IPC: C03C3/087 ,  B32B7/06 ,  H01L21/683 ,  B32B17/06 ,  H01L21/78

Abstract: A glass substrate contains, as a glass matrix composition as represented by mole percentage based on oxides, SiO2: 58-75%, Al2O3: 4.5-16%, B2O3: 0-6%, MgO: 0-6%, CaO: 0-6%, SrO: 5-20%, BaO: 5-20%, and MgO+CaO+SrO+BaO:15-40%. The glass substrate has an alkali metal oxide content of 0-0.1% as represented by mole percentage based on oxides. The glass substrate has an average coefficient of thermal expansion α of 56-90 (×10−7/° C.) at 50° C.-350° C.

公开(公告)号：US20210343610A1

公开(公告)日：2021-11-04

申请号：US17367762

申请日：2021-07-06

Applicant: AGC Inc.

Inventor： Yu HANAWA ,  Shigeki SAWAMURA ,  Shuhei NOMURA ,  Kazutaka ONO ,  Nobuhiko TAKESHITA ,  Keisuke HANASHIMA

IPC: H01L23/15 ,  C03C27/04 ,  C03C3/085 ,  C03C3/087 ,  C03C3/091 ,  C03C3/093 ,  C03C17/22 ,  H01L23/13

Abstract: The present invention provides a glass substrate in which in a step of sticking a glass substrate and a silicon-containing substrate to each other, bubbles hardly intrude therebetween. The present invention relates to a glass substrate for forming a laminated substrate by lamination with a silicon-containing substrate, having a warpage of 2 μm to 300 μm, and an inclination angle due to the warpage of 0.0004° to 0.12°.