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公开(公告)号:US10515864B2
公开(公告)日:2019-12-24
申请号:US15822859
申请日:2017-11-27
Applicant: AGC Inc.
Inventor: Yu Hanawa , Shigeki Sawamura , Shuhei Nomura , Kazutaka Ono , Nobuhiko Takeshita , Keisuke Hanashima
Abstract: The present invention provides a glass substrate in which in a step of sticking a glass substrate and a silicon-containing substrate to each other, bubbles hardly intrude therebetween. The present invention relates to a glass substrate for forming a laminated substrate by lamination with a silicon-containing substrate, having a warpage of 2 μm to 300 μm, and an inclination angle due to the warpage of 0.0004° to 0.12°.
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公开(公告)号:US20190385920A1
公开(公告)日:2019-12-19
申请号:US16555702
申请日:2019-08-29
Applicant: AGC, Inc.
Inventor: Yu Hanawa , Shigeki Sawamura , Shuhei Nomura , Kazutaka Ono , Nobuhiko Takeshita , Keisuke Hanashima
Abstract: The present invention provides a glass substrate in which in a step of sticking a glass substrate and a silicon-containing substrate to each other, bubbles hardly intrude therebetween. The present invention relates to a glass substrate for forming a laminated substrate by lamination with a silicon-containing substrate, having a warpage of 2 μm to 300 μm, and an inclination angle due to the warpage of 0.0004° to 0.12°.
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