公开(公告)号：US09930320B2

公开(公告)日：2018-03-27

申请号：US15146454

申请日：2016-05-04

Applicant: Apple Inc.

Inventor： Denis G. Chen ,  Chin Han Lin

IPC: H04N13/02 ,  H04N7/18

CPC classification number: H04N13/296 ,  H04N13/204 ,  H04N13/254 ,  H04N13/271

Abstract: Systems, methods, and computer readable media to resolve three dimensional spatial information of cameras used to construct 3D images. Various embodiments perform communication synchronization between a first image capture system and one or more other image capture systems and generate a first flash pulse that projects a light pattern into an environment. An image is captured that includes the light pattern and a modulated optical signal encoded with an identifier of one of the first image capture system and related-camera information. A second flash from another image capture systems may flash at a second time based on the communication synchronization. During the second flash, the first image capture system captures a second image of the environment. Based on the first and second images, the first image capture system determines the orientation of the second image capture system relative to the first image capture system.

公开(公告)号：US09819144B2

公开(公告)日：2017-11-14

申请号：US15019981

申请日：2016-02-10

Applicant: Apple Inc.

Inventor： Chin Han Lin ,  Kevin A. Sawyer ,  Neil MacKinnon ,  Venkataram R. Raju ,  Weiping Li ,  Xiaofeng Fan

IPC: H01S3/04 ,  H01S5/024 ,  H01S5/42 ,  H01S5/00 ,  H01S5/02 ,  H01S5/022

CPC classification number: H01S5/02469 ,  H01S5/0042 ,  H01S5/0217 ,  H01S5/0224 ,  H01S5/423

Abstract: A method for production of an optoelectronic device includes fabricating a plurality of vertical emitters on a semiconductor substrate. Respective top surfaces of the emitters are bonded to a heat sink, after which the semiconductor substrate is removed below respective bottom surfaces of the emitters. Both anode and cathode contacts are attached to the bottom surfaces so as to drive the emitters to emit light from the bottom surfaces. In another embodiment, the upper surface of a semiconductor substrate is bonded to a carrier substrate having through-holes that are aligned with respective top surfaces of the emitters, after which the semiconductor substrate is removed below respective bottom surfaces of the emitters, and the respective bottom surfaces of the emitters are bonded to a heat sink.

公开(公告)号：US20170324949A1

公开(公告)日：2017-11-09

申请号：US15146454

申请日：2016-05-04

Applicant: Apple Inc.

Inventor： Denis G. Chen ,  Chin Han Lin

IPC: H04N13/02

CPC classification number: H04N13/296 ,  H04N13/204 ,  H04N13/254 ,  H04N13/271

Abstract: Systems, methods, and computer readable media to resolve three dimensional spatial information of cameras used to construct 3D images. Various embodiments perform communication synchronization between a first image capture system and one or more other image capture systems and generate a first flash pulse that projects a light pattern into an environment. An image is captured that includes the light pattern and a modulated optical signal encoded with an identifier of one of the first image capture system and related-camera information. A second flash from another image capture systems may flash at a second time based on the communication synchronization. During the second flash, the first image capture system captures a second image of the environment. Based on the first and second images, the first image capture system determines the orientation of the second image capture system relative to the first image capture system.