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公开(公告)号：US09819144B2
公开(公告)日：2017-11-14
申请号：US15019981
申请日：2016-02-10
申请人： Apple Inc.
发明人： Chin Han Lin , Kevin A. Sawyer , Neil MacKinnon , Venkataram R. Raju , Weiping Li , Xiaofeng Fan
CPC分类号： H01S5/02469 , H01S5/0042 , H01S5/0217 , H01S5/0224 , H01S5/423
摘要： A method for production of an optoelectronic device includes fabricating a plurality of vertical emitters on a semiconductor substrate. Respective top surfaces of the emitters are bonded to a heat sink, after which the semiconductor substrate is removed below respective bottom surfaces of the emitters. Both anode and cathode contacts are attached to the bottom surfaces so as to drive the emitters to emit light from the bottom surfaces. In another embodiment, the upper surface of a semiconductor substrate is bonded to a carrier substrate having through-holes that are aligned with respective top surfaces of the emitters, after which the semiconductor substrate is removed below respective bottom surfaces of the emitters, and the respective bottom surfaces of the emitters are bonded to a heat sink.
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公开(公告)号：US10470307B2
公开(公告)日：2019-11-05
申请号：US16016610
申请日：2018-06-24
申请人： Apple Inc.
摘要： An apparatus includes a main substrate, a device, and a heat spreader. The main substrate is configured for mounting the device in a mounting location thereon and having a cavity located below the mounting location. The device is mounted in the mounting location, and the heat spreader is fitted into the cavity and coupled to the device and to a heat sink. The heat spreader is configured to conduct heat from the device to the heat sink and to provide electrical insulation between the device and the heat sink.
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公开(公告)号：US10034375B2
公开(公告)日：2018-07-24
申请号：US15145828
申请日：2016-05-04
申请人： APPLE INC.
摘要： An apparatus includes a main substrate, a device, and a heat spreader. The main substrate is configured for mounting the device in a mounting location thereon and having a cavity located below the mounting location. The device is mounted in the mounting location, and the heat spreader is fitted into the cavity and coupled to the device and to a heat sink. The heat spreader is configured to conduct heat from the device to the heat sink and to provide electrical insulation between the device and the heat sink.
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公开(公告)号：US20160345423A1
公开(公告)日：2016-11-24
申请号：US15145828
申请日：2016-05-04
申请人： APPLE INC.
CPC分类号： H05K1/141 , H05K1/0204 , H05K1/021 , H05K1/144 , H05K1/183 , H05K3/368 , H05K2201/10416
摘要： An apparatus includes a main substrate, a device, and a heat spreader. The main substrate is configured for mounting the device in a mounting location thereon and having a cavity located below the mounting location. The device is mounted in the mounting location, and the heat spreader is fitted into the cavity and coupled to the device and to a heat sink. The heat spreader is configured to conduct heat from the device to the heat sink and to provide electrical insulation between the device and the heat sink.
摘要翻译： 一种装置包括主基板，装置和散热器。 主基板被构造成用于将装置安装在其上的安装位置并且具有位于安装位置下方的空腔。 该装置安装在安装位置，并且散热器装配到空腔中并且耦合到装置和散热器。 散热器被配置为将热量从设备传导到散热器并且在设备和散热器之间提供电绝缘。
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公开(公告)号：US20180310407A1
公开(公告)日：2018-10-25
申请号：US16016610
申请日：2018-06-24
申请人： Apple Inc.
CPC分类号： H05K1/141 , H05K1/0204 , H05K1/021 , H05K1/144 , H05K1/183 , H05K3/368 , H05K2201/10416
摘要： An apparatus includes a main substrate, a device, and a heat spreader. The main substrate is configured for mounting the device in a mounting location thereon and having a cavity located below the mounting location. The device is mounted in the mounting location, and the heat spreader is fitted into the cavity and coupled to the device and to a heat sink. The heat spreader is configured to conduct heat from the device to the heat sink and to provide electrical insulation between the device and the heat sink.
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公开(公告)号：US20160336717A1
公开(公告)日：2016-11-17
申请号：US15019981
申请日：2016-02-10
申请人： Apple Inc.
发明人： Chin Han Lin , Kevin A. Sawyer , Neil MacKinnon , Venkataram R. Raju , Weiping Li , Xiaofeng Fan
CPC分类号： H01S5/02469 , H01S5/0042 , H01S5/0217 , H01S5/0224 , H01S5/423
摘要： A method for production of an optoelectronic device includes fabricating a plurality of vertical emitters on a semiconductor substrate. Respective top surfaces of the emitters are bonded to a heat sink, after which the semiconductor substrate is removed below respective bottom surfaces of the emitters. Both anode and cathode contacts are attached to the bottom surfaces so as to drive the emitters to emit light from the bottom surfaces. In another embodiment, the upper surface of a semiconductor substrate is bonded to a carrier substrate having through-holes that are aligned with respective top surfaces of the emitters, after which the semiconductor substrate is removed below respective bottom surfaces of the emitters, and the respective bottom surfaces of the emitters are bonded to a heat sink.
摘要翻译： 制造光电器件的方法包括在半导体衬底上制造多个垂直发射极。 发射器的各个顶表面被结合到散热器，之后半导体衬底在发射器的相应底表面之下移除。 阳极和阴极触点均附接到底表面，以便驱动发射器从底表面发光。 在另一个实施例中，将半导体衬底的上表面接合到具有与发射器的各个顶表面对准的通孔的载体衬底上，然后在发射器的相应底表面之下移除半导体衬底，并且分别 发射器的底表面结合到散热器。
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