Abstract:
A capacitive sensing device can include multiple capacitive sensors. A first device controller is operatively connected to a portion of the capacitive sensors, while a second device controller is operatively connected to another portion of capacitive sensors. A common node or shield can be connected between the first device controller and the second device controller. Charging and discharging events of selected drive lines in the capacitive sensing device and/or of the common node or shield can be synchronized to reduce undesirable effects such as noise and/or to prevent the charging events and the discharging events from overlapping with each other. One or more reference capacitive sensors can be shared by the multiple device controllers.
Abstract:
An electronic device can include an integrated touch and display chip that can operate in multiple power domains. For example, the integrated touch and display chip can operate in a guarded power domain during the touch operation and can operate in a system power domain during non-guarded display operations. In some examples, two power domains can include a guarded power domain and a system power domain, whose grounds can be differentiated by a guard buffer signal. In some examples, the guard buffer can be disposed between the integrated touch and display chip and a battery of the device. In some examples, the guard buffer can be disposed between the battery of the device and the chassis of the device.
Abstract:
A capacitive sensing device can include multiple capacitive sensors. A first device controller is operatively connected to a portion of the capacitive sensors, while a second device controller is operatively connected to another portion of capacitive sensors. A common node or shield can be connected between the first device controller and the second device controller. Charging and discharging events of selected drive lines in the capacitive sensing device and/or of the common node or shield can be synchronized to reduce undesirable effects such as noise and/or to prevent the charging events and the discharging events from overlapping with each other. One or more reference capacitive sensors can be shared by the multiple device controllers.
Abstract:
A device configured to sense a touch on a surface of the device. The device includes a cover and a force-sensing structure disposed below the cover. The force-sensing structure may be positioned below a display and used in combination with other force-sensing elements to estimate the force of a touch on the cover of a device.
Abstract:
A touch sensing system is disclosed. The touch sensing system includes a guard signal generation chip operating in a first power domain referenced to a first voltage, the guard signal generation chip configured to generate a guard signal. A touch sensing chip operates in a second power domain, different from the first power domain, referenced to the guard signal, the touch sensing chip configured to sense touch at one or more touch electrodes included in a touch sensor panel operating in the second power domain referenced to the guard signal, and the touch sensing chip a different chip than the guard signal generation chip. A voltage regulator is configured to selectively regulate a voltage of the guard signal at the touch sensing chip.
Abstract:
Touch sensor panel configurations and methods for improving touch sensitivity of some or all of the electrodes or portions of the touch sensor panel are disclosed. The touch sensor panel configurations can allow increased speed at which the panel can operate. In some examples, the performance of a given touch electrode can differ from the performance of another touch electrode due to differences in capacitance and/or resistance. The performance of the touch sensor panel can be limited by the touch electrode with the lowest performance relative to the other touch electrodes. The configurations and methods can increase the performance of the touch sensor panel by minimizing the capacitive coupling and/or resistance of touch electrodes. Examples of the disclosure can provide configurations of touch sensor panels and methods for improving optical uniformity of the panel.
Abstract:
Several techniques for driving a force sensor to reduce common mode offset are disclosed. The force sensor can include at least one set of individual strain sensitive structures formed on or in a surface of a substrate. Each set of individual strain sensitive structures can include one or more strain sensitive structures. At least one external resistor is operably connected in series between a first output of one or more transmitter channels and at least one set of strain sensitive structures. The external resistor(s) effectively increases the resistances of the strain sensitive structures to reduce the common mode offset. Additionally or alternatively, one or more signal generators may be connected to one or more transmitter channels. Each signal generator is configured to produce one or more signals that is/are designed to reduce common mode offset.
Abstract:
A touch sensing system is disclosed. The touch sensing system includes a guard signal generation chip operating in a first power domain referenced to a first voltage, the guard signal generation chip configured to generate a guard signal. A touch sensing chip operates in a second power domain, different from the first power domain, referenced to the guard signal, the touch sensing chip configured to sense touch at one or more touch electrodes included in a touch sensor panel operating in the second power domain referenced to the guard signal, and the touch sensing chip a different chip than the guard signal generation chip. A voltage regulator is configured to selectively regulate a voltage of the guard signal at the touch sensing chip.
Abstract:
Several techniques for driving a force sensor to reduce common mode offset are disclosed. The force sensor can include at least one set of individual strain sensitive structures formed on or in a surface of a substrate. Each set of individual strain sensitive structures can include one or more strain sensitive structures. At least one external resistor is operably connected in series between a first output of one or more transmitter channels and at least one set of strain sensitive structures. The external resistor(s) effectively increases the resistances of the strain sensitive structures to reduce the common mode offset. Additionally or alternatively, one or more signal generators may be connected to one or more transmitter channels. Each signal generator is configured to produce one or more signals that is/are designed to reduce common mode offset.
Abstract:
A transmitter device for an inductive energy transfer system can include a DC-to-AC converter operably connected to a transmitter coil, a first capacitor connected between the transmitter coil and one output terminal of the DC-to-AC converter, and a second capacitor connected between the transmitter coil and another output terminal of the DC-to-AC converter. One or more capacitive shields can be positioned between the transmitter coil and an interface surface of the transmitter device. A receiver device can include a touch sensing device, an AC-to-DC converter operably connected to a receiver coil, a first capacitor connected between the receiver coil and one output terminal of the AC-to-DC converter, and a second capacitor connected between the receiver coil and another output terminal of the AC-to-DC converter. One or more capacitive shields can be positioned between the receiver coil and an interface surface of the receiver device.