公开(公告)号：US20220406643A1

公开(公告)日：2022-12-22

申请号：US17351530

申请日：2021-06-18

Applicant: Applied Materials, Inc.

Inventor： Tuck Foong KOH ,  Prashant AGARWAL ,  Ananthkrishna JUPUDI

IPC: H01L21/687 ,  H01L21/67 ,  H05B6/64

Abstract: Embodiments of substrate supports for use in microwave degas chambers are provided herein. In some embodiments, a substrate support for use in a microwave degas chamber includes a support plate having one or more support features for supporting a substrate; a susceptor comprising a plate disposed on the support plate, wherein the susceptor includes one or more openings, wherein the one or more support features extend through corresponding ones of the one or more openings; and a metal foil disposed beneath a side of the susceptor facing the support plate.

公开(公告)号：US20220140456A1

公开(公告)日：2022-05-05

申请号：US17084804

申请日：2020-10-30

Applicant: Applied Materials, Inc.

Inventor： Rajesh Kumar PUTTI ,  Prashant AGARWAL ,  Ananthkrishna JUPUDI

IPC: H01P1/08

Abstract: Apparatus for transmitting microwaves into a process chamber using a microwave pressure window assembly. The microwave pressure window assembly may include a first plate with a first aperture surrounded by a first recess for a first pressure seal, a second plate with a second aperture surrounded by a second recess for a second pressure seal, a dielectric plate configured to transmit microwaves and interposed between the first plate and the second plate and between the first pressure seal and the second pressure seal. The apertures include a first vertical step area on a first vertical side of the apertures and a second vertical step area on a second vertical side of the apertures opposite of the first vertical side. The first vertical step areas and the second vertical step areas may have a thickness of approximately 50% of a thickness of the plates that includes a dielectric plate recess.

公开(公告)号：US20170004982A1

公开(公告)日：2017-01-05

申请号：US14788127

申请日：2015-06-30

Applicant: APPLIED MATERIALS, INC.

Inventor： Mukund SUNDARARAJAN ,  Ananthkrishna JUPUDI ,  Manjunatha KOPPA ,  Saket RATHI

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/68785 ,  H01L21/68742 ,  H01L21/68764

Abstract: Embodiments of batch processing apparatus and collapsible substrate support are provided herein. In some embodiments, a collapsible substrate support includes a base linearly moveable between a first position and a second position; and a first plurality of substrate support elements coupled to the base and including a lowermost substrate support element disposed in a fixed position with respect to the base and an uppermost substrate support element disposed above the lowermost substrate support element, wherein the uppermost substrate support element is linearly movable between a first position nearer to the lowermost substrate support element and a second position further from the lowermost substrate support element.

Abstract translation: 本文提供批处理装置和可折叠基板支撑件的实施例。 在一些实施例中，可折叠基板支撑件包括可在第一位置和第二位置之间线性移动的基座; 以及耦合到所述基座并且包括相对于所述基座设置在固定位置的最下面的基板支撑元件和设置在所述最下面的基板支撑元件上方的最上面的基板支撑元件的第一多个基板支撑元件，其中所述最上面的基板支撑元件是 可在最靠近最底层支撑元件的第一位置与最下面的衬底支撑元件之间的第二位置之间直线移动。