BATCH PROCESSING APPARATUS
    1.
    发明申请
    BATCH PROCESSING APPARATUS 审中-公开
    批处理装置

    公开(公告)号:US20170004982A1

    公开(公告)日:2017-01-05

    申请号:US14788127

    申请日:2015-06-30

    CPC classification number: H01L21/68785 H01L21/68742 H01L21/68764

    Abstract: Embodiments of batch processing apparatus and collapsible substrate support are provided herein. In some embodiments, a collapsible substrate support includes a base linearly moveable between a first position and a second position; and a first plurality of substrate support elements coupled to the base and including a lowermost substrate support element disposed in a fixed position with respect to the base and an uppermost substrate support element disposed above the lowermost substrate support element, wherein the uppermost substrate support element is linearly movable between a first position nearer to the lowermost substrate support element and a second position further from the lowermost substrate support element.

    Abstract translation: 本文提供批处理装置和可折叠基板支撑件的实施例。 在一些实施例中,可折叠基板支撑件包括可在第一位置和第二位置之间线性移动的基座; 以及耦合到所述基座并且包括相对于所述基座设置在固定位置的最下面的基板支撑元件和设置在所述最下面的基板支撑元件上方的最上面的基板支撑元件的第一多个基板支撑元件,其中所述最上面的基板支撑元件是 可在最靠近最底层支撑元件的第一位置与最下面的衬底支撑元件之间的第二位置之间直线移动。

    HIGH TEMPERATURE FACE PLATE FOR DEPOSITION APPLICATION

    公开(公告)号:US20210395881A1

    公开(公告)日:2021-12-23

    申请号:US16904169

    申请日:2020-06-17

    Abstract: Embodiments of the disclosure relate to faceplates for a processing chamber. In one example, a faceplate includes a body having a plurality of apertures formed therethrough. A heating element is disposed within the body, and the heating element circumscribes the plurality of apertures. A support ring is disposed in the body. The support ring circumscribes the heating element. The support ring includes a main body and a cantilever extending radially inward from the main body. The cantilever contacts the body of the faceplate.

    PROCESSING CHAMBER WITH RF RETURN PATH

    公开(公告)号:US20250118593A1

    公开(公告)日:2025-04-10

    申请号:US18904967

    申请日:2024-10-02

    Abstract: Embodiments of the present disclosure relate to a processing chamber. The process chamber includes a lid assembly, a choke plate, a pedestal assembly, a ground plate, and a ground ring. A processing region is defined between the lid assembly and the pedestal assembly. The pedestal assembly includes an isolator plate assembly. The isolator plate assembly includes three or more plates. Each plate includes one or more alignment tabs, one or more protrusions, one or more lift pin holes, a ground plate, and a ground ring. The lid assembly, choke plate, and pedestal assembly form a RF return path. The ground plate, includes a cylindrical core, an annular body, and an annular projection. The ground ring includes an annular body, an annular wall, an annular connector, and an annular tab. The ground ring and the ground plate are electrically connected via a RF strap.

    HIGH TEMPERATURE FACE PLATE FOR DEPOSITION APPLICATION

    公开(公告)号:US20220119950A1

    公开(公告)日:2022-04-21

    申请号:US17646176

    申请日:2021-12-28

    Abstract: Embodiments of the disclosure relate to faceplates for a processing chamber. In one example, a faceplate includes a body having a plurality of apertures formed therethrough. A heating element is disposed within the body, and the heating element circumscribes the plurality of apertures. A support ring is disposed the body. The support ring circumscribes the heating element. The support ring includes a main body and a cantilever extending radially inward from the main body. The cantilever contacts the body of the faceplate.

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