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公开(公告)号：US08238127B1
公开(公告)日：2012-08-07
申请号：US12641310
申请日：2009-12-17
CPC分类号： G05F1/455 , H02M5/293 , H02M2001/008
摘要： A dimming power supply includes a power source, a full bridge rectifier with four nodes, a control switch and a controller. The first node is connected to the power source, the second is connected to a load output, and the third is connected to a reference voltage node. The control switch is connected between the fourth node and the reference voltage node. The controller is connected to a control input of the control switch. The controller is adapted to adjust a voltage or current through the load output.
摘要翻译： 调光电源包括电源，具有四个节点的全桥整流器，控制开关和控制器。 第一个节点连接到电源，第二个连接到负载输出，第三个连接到参考电压节点。 控制开关连接在第四节点和参考电压节点之间。 控制器连接到控制开关的控制输入。 控制器适用于通过负载输出调节电压或电流。
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公开(公告)号：US07782644B2
公开(公告)日：2010-08-24
申请号：US11681767
申请日：2007-03-03
CPC分类号： H02M3/335 , H02M7/12 , Y10T307/414
摘要： A power supply includes a power source having at least one power source output, and a plurality of drivers connected to the at least one power source output. At least one of the plurality of drivers includes a bridge network having a first switch, a second switch and a bridge network output. The first switch is connected between the at least one power source output and the bridge network output. The second switch is connected between the bridge network output and a ground. The bridge network further includes at least one control input connected to the second switch to direct electrical current from the at least one power source output either substantially through the bridge network output or through the second switch to ground.
摘要翻译： 电源包括具有至少一个电源输出的电源和连接到所述至少一个电源输出的多个驱动器。 多个驱动器中的至少一个包括具有第一开关，第二开关和桥接网络输出的桥接网络。 第一开关连接在至少一个电源输出端和桥接网络输出端之间。 第二个开关连接在桥网输出和地之间。 桥接网络还包括连接到第二开关的至少一个控制输入，以将基本上通过桥接网络输出或通过第二开关的至少一个电源输出的电流引导到地。
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公开(公告)号：US20100039342A1
公开(公告)日：2010-02-18
申请号：US12468253
申请日：2009-05-19
IPC分类号： H01Q13/10
CPC分类号： H01Q13/10 , H01Q1/40 , H01Q21/064
摘要： In one embodiment, a slot array antenna comprising a quartz layer and a silicon layer, wherein the quartz and silicon layers are matched to suppress microwave modes, and a metal layer adjacent to the silicon layer comprising offset cuts.
摘要翻译： 在一个实施例中，包括石英层和硅层的缝隙阵列天线，其中石英和硅层匹配以抑制微波模式，以及与硅层相邻的金属层包括偏移切割。
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公开(公告)号：US20090009096A1
公开(公告)日：2009-01-08
申请号：US12168123
申请日：2008-07-05
IPC分类号： H05B41/36
CPC分类号： H05B41/282
摘要： Various current controlled driver apparatuses are disclosed herein. For example, some embodiments of the present invention provide a current controlled driver including a control circuit having a current input and a driver circuit having a power input. The control circuit has an output that is directly electrically connected to an input of the driver circuit. The control circuit operates between a positive voltage level and a ground potential. The driver circuit is adapted to operate between a higher positive voltage level and a negative voltage level.
摘要翻译： 本文公开了各种电流控制的驱动装置。 例如，本发明的一些实施例提供一种电流控制驱动器，其包括具有电流输入的控制电路和具有功率输入的驱动器电路。 控制电路具有与驱动电路的输入端直接电连接的输出。 控制电路在正电压电平和地电位之间工作。 驱动电路适于在较高的正电压电平和负电压电平之间工作。
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公开(公告)号：US06107179A
公开(公告)日：2000-08-22
申请号：US85763
申请日：1998-05-28
IPC分类号： H01L23/482 , H01L21/44
CPC分类号： H01L23/4822 , H01L24/01 , H01L2924/01029 , H01L2924/12042 , H01L2924/14
摘要： A method of creating a plurality of fine pitch integrated interconnects utilizes a flexible layer to create a plurality of integrated interconnects which extend beyond the boundary of the integrated circuit chip onto the substrate. Subsequently, a support layer is deposited on the interconnects and the substrate under the plurality of interconnects which is located beyond the boundary of the integrated circuit chip is removed.
摘要翻译： 创建多个精细间距集成互连的方法利用柔性层来产生多个集成互连，其跨越集成电路芯片的边界延伸到衬底上。 随后，在互连上沉积支撑层，并且移除位于超过集成电路芯片的边界的多个互连线下方的衬底。
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公开(公告)号：US5893015A
公开(公告)日：1999-04-06
申请号：US670734
申请日：1996-06-24
CPC分类号： G03G15/08 , G03G2215/0651
摘要： An apparatus for transporting charged particles in a predetermine path which includes a donor member that is adapted to move charged particles on the surface thereof in the predetermined path. The donor member includes an electrode array on the outer surface thereof; the array including a plurality of spaced apart electrodes extending substantially across width of the surface of the donor member. A multi-phase DC voltage source is operatively coupled to the electrode array, the phase being shifted with respect to each other such as to create an electrodynamic wave pattern capable of moving charged particles on the surface thereof in the predetermined path.
摘要翻译： 一种用于在预定路径中传送带电粒子的装置，其包括适于在预定路径中在其表面上移动带电粒子的施主构件。 供体构件在其外表面上包括电极阵列; 所述阵列包括基本上横跨所述供体构件的表面的宽度延伸的多个间隔开的电极。 多相DC电压源可操作地耦合到电极阵列，该相位相对于彼此移动，以产生能够在预定路径中的带电粒子在其表面上移动的电动势波形图案。
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27.发明授权Advanced technique for packaging multiple number of electrically stackable high voltage transistors in one package 失效在一个封装中封装多个可电叠置的高压晶体管的先进技术
公开(公告)号：US5577617A
公开(公告)日：1996-11-26
申请号：US581385
申请日：1995-12-29
IPC分类号： H01L23/495 , B65D73/02
CPC分类号： H01L23/49575 , H01L2924/0002
摘要： High voltage circuitry often requires assembling an array of high voltage devices that are electrically isolated from one another. A lead frame that fits within conventional plastic packaging has been designed that will allow electrical isolation of the substrates of two or more transistors mounted together in a single package.
摘要翻译： 高电压电路通常需要组装彼此电隔离的高压器件阵列。 已经设计出适合传统塑料封装的引线框架，其将允许在单个封装中安装在一起的两个或多个晶体管的基板电隔离。
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