公开(公告)号：US20180342471A1

公开(公告)日：2018-11-29

申请号：US15604545

申请日：2017-05-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-En HSU ,  Huei-Shyong CHO ,  Shih-Wen LU

IPC: H01L23/66 ,  H01L23/31 ,  H01P3/08 ,  H01L23/498 ,  H01Q1/22 ,  H01Q13/08

CPC classification number: H01L23/66 ,  H01L23/3121 ,  H01L23/49838 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01P3/08 ,  H01Q1/2283 ,  H01Q13/08

Abstract: An antenna semiconductor package device includes a first conductive layer, a second conductive layer, a first conductive element and a first directing element. The second conductive layer is over the first conductive layer and separated from the first conductive layer. The first conductive element connects the first conductive layer to the second conductive layer. The first directing element is adjacent to the first conductive layer and separated from the first conductive layer by a first gap. The first conductive element, the first conductive layer and the second conductive layer define a waveguide cavity and a radiation opening.