公开(公告)号：US20230092252A1

公开(公告)日：2023-03-23

申请号：US17991814

申请日：2022-11-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yung-Shun CHANG ,  Meng-Wei HSIEH ,  Teck-Chong LEE

IPC: H01L23/522 ,  H01L21/56 ,  H01L21/768 ,  H01L23/31 ,  H01L23/00 ,  H01L23/528

Abstract: A semiconductor package structure includes a semiconductor die and at least one pillar structure. The semiconductor die has an upper surface and includes at least one conductive pad disposed adjacent to the upper surface. The pillar structure is electrically connected to the conductive pad of the semiconductor die, and defines a recess portion recessed from a side surface of the pillar structure. A conductivity of the pillar structure is greater than a conductivity of the conductive pad.

公开(公告)号：US20210280744A1

公开(公告)日：2021-09-09

申请号：US16809500

申请日：2020-03-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tang-Yuan CHEN ,  Meng-Wei HSIEH ,  Cheng-Yuan KUNG

IPC: H01L33/14 ,  H01L33/00

Abstract: A semiconductor device package includes a carrier, an emitting element and a first package body. The carrier includes a first surface and a second surface opposite to the first surface. The emitting element is disposed on the first surface of the carrier. The first package body is disposed over the first surface of the carrier and spaced apart from the first surface of the carrier.

公开(公告)号：US20210249369A1

公开(公告)日：2021-08-12

申请号：US16789246

申请日：2020-02-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Meng-Wei HSIEH ,  Chieh-Chen FU

IPC: H01L23/66 ,  H01L23/498 ,  H01L21/48 ,  H01Q1/22

Abstract: A semiconductor device package includes a carrier, an emitting device, a first building-up circuit and a first package body. The carrier has a first surface, a second surface opposite to the first surface and a lateral surface extending from the first surface to the second surface. The emitting element is disposed on the first surface of carrier. The first building-up circuit is disposed on the second surface of the carrier. The first package body encapsulates the lateral surface of the carrier.

公开(公告)号：US20210249367A1

公开(公告)日：2021-08-12

申请号：US16789236

申请日：2020-02-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Meng-Wei HSIEH

IPC: H01L23/66 ,  H01L23/498 ,  H01L21/48

Abstract: A semiconductor device package includes an emitting device and a first building-up circuit. The emitting device defines a cavity in the emitting device. The first building-up circuit is disposed on the emitting device.