公开(公告)号：US12265103B2

公开(公告)日：2025-04-01

申请号：US17817796

申请日：2022-08-05

Applicant: Allegro MicroSystems, LLC

Inventor： Robert A. Briano ,  Michael C. Doogue ,  William P. Taylor

IPC: G01R19/00 ,  G01R15/14 ,  G01R15/20 ,  H01L21/48 ,  H01L23/00 ,  H01L23/495 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30

Abstract: A sensor package comprising a lead frame, a current sensor die, and an interposer. The lead frame includes: (i) a primary conductor, (ii) a plurality of secondary leads, and (iii) a layer of dielectric material that is disposed between the primary conductor and the plurality of secondary leads. The current sensor die includes one or more sensing elements. The current sensor die is configured to measure a level of electrical current through the primary conductor of the lead frame. The interposer is disposed over the layer of dielectric material. The interposer includes a plurality of conductive traces that are configured to couple each of a plurality of terminals of the current sensor die to a respective one of the plurality of secondary leads.

公开(公告)号：US11768229B2

公开(公告)日：2023-09-26

申请号：US17654254

申请日：2022-03-10

Applicant: Allegro MicroSystems, LLC

Inventor： Bradley Boden ,  Rishikesh Nikam ,  Robert A. Briano

IPC: G01R15/20 ,  G01R19/252

CPC classification number: G01R15/202 ,  G01R15/207 ,  G01R19/252

Abstract: A packaged current sensor integrated circuit includes a primary conductor having an input portion and an output portion configured to carry a current to be measured by a magnetic sensing element supported by a semiconductor die adjacent to the primary conductor. The primary current path contains a mechanical locking feature. The thickness of the molded body of the package is reduced to improve vibration immunity.

公开(公告)号：US20230060219A1

公开(公告)日：2023-03-02

申请号：US18053480

申请日：2022-11-08

Applicant: Allegro MicroSystems, LLC

Inventor： Shixi Louis Liu ,  Robert A. Briano ,  Natasha Healey

IPC: G01R15/20 ,  G01R19/00

Abstract: A packaged current sensor integrated circuit includes a primary conductor having an input portion and an output portion configured to carry a current to be measured by one or more magnetic sensing elements supported by a semiconductor die adjacent to the primary conductor. A method of fabricating the packaged current sensor integrated circuit includes partially encasing the lead frame in a first mold material, applying an insulator to one or more die attach pads, attaching a die to the insulator, electrically connecting the die to secondary leads, and providing a second mold to the subassembly. The package is configured to provide increased voltage isolation.

公开(公告)号：US20230058695A1

公开(公告)日：2023-02-23

申请号：US17654254

申请日：2022-03-10

Applicant: Allegro MicroSystems, LLC

Inventor： Bradley Boden ,  Rishikesh Nikam ,  Robert A. Briano

IPC: G01R15/20 ,  G01R19/252

Abstract: A packaged current sensor integrated circuit includes a primary conductor having an input portion and an output portion configured to carry a current to be measured by a magnetic sensing element supported by a semiconductor die adjacent to the primary conductor. The primary current path contains a mechanical locking feature. The thickness of the molded body of the package is reduced to improve vibration immunity.

公开(公告)号：US11519946B1

公开(公告)日：2022-12-06

申请号：US17409011

申请日：2021-08-23

Applicant: Allegro MicroSystems, LLC

Inventor： Simon E. Rock ,  Alexander Latham ,  Robert A. Briano ,  Shixi Louis Liu

IPC: G01R19/165 ,  G01R33/07

Abstract: A packaged current sensor integrated circuit includes a primary conductor having an input portion and an output portion configured to carry a current to be measured by a magnetic sensing element supported by a semiconductor die adjacent to the primary conductor. Each of the input portion and output portion of the primary conductor is exposed from orthogonal sides of the package body. A fault signal may be provided to indicate an overcurrent condition in the integrated current sensor package. The primary current path may be made of a thick lead frame material to reduce the primary current path resistance.

公开(公告)号：US20220238461A1

公开(公告)日：2022-07-28

申请号：US17659687

申请日：2022-04-19

Applicant: Allegro MicroSystems, LLC

Inventor： Robert A. Briano ,  Alejandro Gabriel Milesi

IPC: H01L23/64 ,  H01L23/552 ,  H01L23/66 ,  H03H7/00

Abstract: Methods and apparatus for a signal isolator having reduced parasitics. An example embodiment, a signal isolator and include a first metal region electrically connected to a first die portion, a second die portion isolated from the first die portion, and a second metal region electrically connected to the second die portion. A third metal region can be electrically isolated from the first and second metal regions and a third die portion can be electrically isolated from the first, second and third metal regions. In embodiments, the first metal region, the second metal region, and the third metal region provide a first isolated signal path from the first die portion to the second die portion.

公开(公告)号：US20210048467A1

公开(公告)日：2021-02-18

申请号：US16539405

申请日：2019-08-13

Applicant: Allegro MicroSystems, LLC

Inventor： Robert A. Briano

IPC: G01R31/02 ,  H02H5/10

Abstract: Methods and apparatus for an IC package having an impedance detector module configured to have: a first connection to a first external energy source via a first IO pin of the IC package and a second connection to a detection component. In embodiments, the detection component is configured for connection to a first ground for the first external energy source via a second IO pin of the IC package, and to a barrier component, which is configured for connection to a second ground for a second external energy source via a third IO pin of the IC package. The impedance detector module is configured to detect a disconnection or degradation of a connection to ground.

公开(公告)号：US12183662B2

公开(公告)日：2024-12-31

申请号：US18618259

申请日：2024-03-27

Applicant: Allegro MicroSystems, LLC

Inventor： Robert A. Briano ,  Shixi Louis Liu ,  William P. Taylor

IPC: H01L23/495 ,  H01L23/00

Abstract: Methods and apparatus for a signal isolator having enhanced creepage characteristics. In embodiments, an isolator includes a leadframe having first and second die paddles each having opposed first and second surfaces, a first die supported by the first surface of the first die paddle, and a second die supported by the first surface of the second die paddle. The first and second die paddles are configured enhanced creepage characteristics.

公开(公告)号：US20220137103A1

公开(公告)日：2022-05-05

申请号：US17083487

申请日：2020-10-29

Applicant: Allegro MicroSystems, LLC

Inventor： Robert A. Briano ,  Wade Bussing ,  Timothy A. Clark

IPC: G01R19/10 ,  G01R19/15

Abstract: Methods and apparatus for measuring a current difference between at least two current traces in a circuit board. Each wire or trace generates a magnetic field which may then be measured by at least one magnetic field sensing element positioned on an integrated circuit, such as a current sensor integrated circuit or a differential magnetic field sensor integrated circuit. An output disconnect signal may be provided from the current sensor or differential magnetic field sensing integrated circuit to indicate that a current difference above a predetermined threshold exists in the two or more current traces.

公开(公告)号：US20210285794A1

公开(公告)日：2021-09-16

申请号：US16818199

申请日：2020-03-13

Applicant: Allegro MicroSystems, LLC

Inventor： Robert A. Briano ,  Paul A. David

IPC: G01D5/14 ,  G01R33/09 ,  G01R33/07

Abstract: Methods and apparatus for a current sensor having an elongate current conductor having an input and an output and a longitudinal axis. First, second, third and fourth magnetic field sensing elements are coupled in a bridge configuration and positioned in a plane parallel to a surface of the current conductor such that the second and fourth magnetic field sensing elements comprise inner elements and the first and third magnetic field sensing elements comprise outer elements. Embodiments of the sensor reduce the effects of stray fields on the sensor.