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公开(公告)号:US20220157574A1
公开(公告)日:2022-05-19
申请号:US17455197
申请日:2021-11-16
Applicant: Applied Materials, Inc.
Inventor: Benjamin SCHWARZ , Michael D. WILLWERTH , Aditi MITHUN , Prabhat KUMAR , Grace MATHEW , Andreas SCHMID
IPC: H01J37/32
Abstract: Embodiments of the present disclosure provide a method and an apparatus for processing a substrate. The apparatus has a ring assembly. The ring assembly has an edge ring and a shadow ring. The edge ring has a ring shaped body. The edge ring body has a top surface and a bottom surface. Pin holes extend through the edge ring body from the top surface to the bottom surface. The shadow ring has a ring shaped body. The shadow ring body has an upper surface and a lower surface. Sockets are formed on the lower surface, wherein the sockets in the shadow ring body align with the pin holes in the edge ring body.
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公开(公告)号:US20210375599A1
公开(公告)日:2021-12-02
申请号:US16887596
申请日:2020-05-29
Applicant: Applied Materials, Inc.
Inventor: Andrew Antoine NOUJAIM , Álvaro GARCÍA DE GORORDO , Andreas SCHMID , Stephen Donald PROUTY
IPC: H01J37/32 , H01L21/683 , H01L21/67
Abstract: An electrical connector for a substrate support assembly is disclosed herein. The electrical connector includes a first interface body, and a second interface body coupled to the first interface body and to a third interface body. The second interface body is circumscribed by the third interface body. The first interface body and the second interface body each comprise a plurality of electrical terminals disposed in sockets formed in the respective first and second interface bodies, each electrical terminal disposed in sockets of the first interface body coupled to a respective one of the electrical terminals disposed in sockets of the second interface body to form a plurality of isolated conductive electrical unions, wherein the second interface body includes a plurality of protruding sidewalls that extend into the first interface body between each of the electrical terminals of the first interface body.
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