公开(公告)号：US20140148017A1

公开(公告)日：2014-05-29

申请号：US14086773

申请日：2013-11-21

Applicant: Applied Materials, Inc.

Inventor： Bruce E. ADAMS ,  Stephen MOFFATT

IPC: H01L21/67 ,  H01L21/324

CPC classification number: H01L21/324 ,  H01L21/268 ,  H01L21/67115

Abstract: Embodiments described herein provide methods and apparatus for thermally treating a substrate. A first radiant energy source that delivers a first radiation at a first fluence and a second radiant energy source that delivers a second radiation at a second fluence are disposed to direct energy toward a substrate support positioned to receive the first radiation at a first location and the second radiation at a second location, wherein the first fluence is 10 to 100 times the second fluence and the first radiation cannot reach the second location. The first radiant energy source may be a laser, and the second radiant energy source may be a plurality of lasers, for example a pulsed laser assembly with a plurality of pulsed lasers. The second radiant energy source may also be a flash lamp. The first and second radiant energy sources may be in the same chamber or different chambers.

Abstract translation: 本文所述的实施方案提供了用于热处理基底的方法和装置。 设置以第一注量递送第一辐射的第一辐射能量源和以第二注量递送第二辐射的第二辐射能源，以将能量引向定位成在第一位置处接收第一辐射的基底支撑件，并且 在第二位置处的第二辐射，其中第一注量是第二注量的10至100倍，并且第一辐射不能到达第二位置。 第一辐射能量源可以是激光器，并且第二辐射能量源可以是多个激光器，例如具有多个脉冲激光器的脉冲激光器组件。 第二辐射能源也可以是闪光灯。 第一和第二辐射能源可以在相同的室或不同的室中。