公开(公告)号：US20210288027A1

公开(公告)日：2021-09-16

申请号：US16814785

申请日：2020-03-10

Applicant: Applied Materials, Inc.

Inventor： Kurtis LESCHKIES ,  Han-Wen CHEN ,  Steven VERHAVERBEKE ,  Giback PARK ,  Kyuil CHO ,  Jeffrey L. FRANKLIN ,  Wei-Sheng LEI

IPC: H01L25/065 ,  H05K1/14 ,  H01L25/00 ,  H01L23/495 ,  H01L23/522

Abstract: The present disclosure generally relates to stacked miniaturized electronic devices and methods of forming the same. More specifically, embodiments described herein relate to semiconductor device spacers and methods of forming the same. The semiconductor device spacers described herein may be utilized to form stacked semiconductor package assemblies, stacked PCB assemblies, and the like.