公开(公告)号：US07906421B2

公开(公告)日：2011-03-15

申请号：US11766326

申请日：2007-06-21

申请人： Octavio Trovarelli ,  Martin Reiss ,  Bernd Zimmermann

发明人： Octavio Trovarelli ,  Martin Reiss ,  Bernd Zimmermann

IPC分类号： H01L21/00 ,  H01L21/44 ,  H01L21/4763

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05548 ,  H01L2224/05647 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/00014

摘要： In a method of making an electronic component, an electrically conductive redistribution line is formed on a surface of a semiconductor chip. The redistribution line includes a solder pad. A covering material is formed over the solder pad and an uncovered portion of the redistribution line is passivated. The covering material prevents passivation of the solder pad. Solder is then formed over the solder pad such that the uncovered portion of the redistribution line has solder resist properties due to the passivating.

摘要翻译： 在制造电子元件的方法中，在半导体芯片的表面上形成导电再分配线。 再分配线包括焊盘。 覆盖材料形成在焊盘上方，再分配线的未覆盖部分被钝化。 覆盖材料防止焊盘的钝化。 然后在焊料焊盘上形成焊料，使得再分配线的未覆盖部分由于钝化而具有阻焊性能。