FLEXIBLE DISPLAY PANEL, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE

    公开(公告)号:US20200243574A1

    公开(公告)日:2020-07-30

    申请号:US15764552

    申请日:2017-10-13

    Abstract: A flexible display panel, a manufacturing method thereof and a display device are provided. The flexible display panel includes: a flexible substrate and an inorganic insulating layer(s) and an organic insulating layer on the flexible substrate. The inorganic insulating layer(s) is provided with a recess in a region to be bent of the flexible display panel. The organic insulating layer at least covers a surface of the recess, and the flexibility of the organic insulating layer is greater than that of the inorganic insulating layer(s).

    SUBSTRATE AND MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE

    公开(公告)号:US20190189639A1

    公开(公告)日:2019-06-20

    申请号:US16051947

    申请日:2018-08-01

    Abstract: A substrate and a manufacturing method thereof and a display device are provided. The substrate includes: a base including a bendable region; an interlayer on the base and in the bendable region; and a signal line at a side, facing away from the base, of the interlayer. In the bendable region, an orthographic projection of the signal line on the base is within an orthographic projection of the interlayer on the base; and in the bendable region, the interlayer is provided with a groove on at least one side of a portion, corresponding to the signal line, of the interlayer.

    DISPLAY PANEL AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20250081686A1

    公开(公告)日:2025-03-06

    申请号:US18250446

    申请日:2022-06-30

    Abstract: A display panel is disclosed and includes a driving backplane, a plurality of light-emitting devices and an encapsulation structure. The plurality of light-emitting devices are located on a first side of the driving backplane and are disposed at intervals. A light-emitting device includes a device main body and device pins. The device main body includes a light-emitting portion, and the device pins are electrically connected to the driving backplane. The encapsulation structure is located on the first side of the driving backplane and includes a light-shielding pattern and a plurality of encapsulation portions. The light-shielding pattern has a plurality of accommodation regions, an accommodation region exposes at least one light-emitting device. At least part of an encapsulation portion is located in the accommodation region and covers the light-emitting device. A light-emitting portion of at least one light-emitting device is located in the accommodation region.

    DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE

    公开(公告)号:US20230075199A1

    公开(公告)日:2023-03-09

    申请号:US17800902

    申请日:2021-10-13

    Abstract: A display substrate and a manufacturing method therefor, and a display device. The display substrate comprises a plurality of island areas that are spaced apart from each other, a plurality of hole areas, and bridge areas for connecting adjacent island areas. The island areas or/and the bridge areas comprise an edge area adjacent to the hole area; the edge area comprises a composite structure layer provided on a base substrate; a stepped structure is formed at a side surface of the composite structure layer facing the hole areas; the edge area further comprises an inorganic encapsulation layer disposed on the composite structure layer and the stepped structure.

    DISPLAY PANEL, AND ARRAY SUBSTRATE AND MANUFACTURING THEREOF

    公开(公告)号:US20210223896A1

    公开(公告)日:2021-07-22

    申请号:US16772971

    申请日:2020-01-06

    Abstract: The present invention provides an array substrate. The array substrate includes: a backplane including a display area and a bonding area; a wiring layer provided on the backplane and exposed in the bonding area; a protective layer provided on a surface of the wiring layer away from the backplane and covering the wiring layer in the display area and the bonding area, wherein a through-hole is provided in the protective layer in the boding area; and a connection layer provided on a surface of the protective layer away from the backplane and coupled to the wiring layer through the through-hole.

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