公开(公告)号：US20220059728A1

公开(公告)日：2022-02-24

申请号：US17340672

申请日：2021-06-07

Applicant: BOE Technology Group Co., Ltd.

Inventor： Lubin SHI ,  Bin QIN ,  Liang CHEN ,  Dongni LIU ,  Fangzhen ZHANG ,  Ke WANG

IPC: H01L33/48 ,  H01L25/075

Abstract: A displaying base plate and a fabricating method thereof. The displaying base plate includes a substrate, and a first flat layer on one side of the substrate; a first metal layer on one side of the first flat layer that is further away from the substrate; a second flat layer on sides of the first metal layer and the first flat layer that are further away from the substrate; and a second metal layer on one side of the second flat layer that is further away from the substrate; wherein the first metal layer includes a first metal trace, an orthographic projection of the second metal layer on the substrate and an orthographic projection of the first metal trace on the substrate have an overlapping part, and an orthographic projection of the second flat layer on the substrate covers the orthographic projection of the first metal trace on the substrate.

公开(公告)号：US20240412682A1

公开(公告)日：2024-12-12

申请号：US18273989

申请日：2022-07-07

Applicant: BOE Technology Group Co., Ltd.

Inventor： Weixing LIU ,  Kuanjun PENG ,  Bin QIN ,  Kai GUO ,  Tieshi WANG ,  Fangzhen ZHANG

IPC: G09G3/32 ,  H01L25/075 ,  H01L25/16 ,  H01L33/62

Abstract: A display substrate (910), comprising a plurality of pixel units (P11, P12, P21, P22) and at least one compensation circuit. At least one pixel unit (P11, P12, P21, P22) comprises: a main light-emitting unit and an auxiliary light-emitting unit; and the at least one compensation circuit is connected to the auxiliary light-emitting unit of the at least one pixel unit (P11, P12, P21, P22). The at least one compensation circuit is configured to measure the brightness or temperature of the at least one pixel unit (P11, P12, P21, P22) and control the auxiliary light-emitting unit of the at least one pixel unit (P11, P12, P21, P22) to emit light according to a measurement result.

公开(公告)号：US20240222570A1

公开(公告)日：2024-07-04

申请号：US17920811

申请日：2021-11-30

Applicant: BOE Technology Group Co., Ltd.

Inventor： Yanan NIU ,  Yan QU ,  Ming YANG ,  Jintao PENG ,  Bin QIN ,  Wanzhi CHEN

IPC: H01L33/48 ,  H01L25/075 ,  H01L33/20 ,  H01L33/54 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L25/0753 ,  H01L33/20 ,  H01L33/54 ,  H01L33/62 ,  H01L2933/0066

Abstract: A light emitting substrate, a preparation method therefor, and a display device are provided. The light emitting substrate includes a base substrate, a die bonding structure, a light shielding structure and a light emitting chip disposed on the base substrate, wherein the light emitting chip is disposed at a side of the die bonding structure away from the base substrate, the light shielding structure is located at a peripheral side of the light emitting chip, the light emitting substrate further comprises a flux functional layer covering the side of the die bonding structure away from the base substrate, the light shielding structure comprises a shielding material layer and a partition structure, and the flux functional layer is blocked at the partition structure.

公开(公告)号：US20230274696A1

公开(公告)日：2023-08-31

申请号：US18014254

申请日：2021-11-22

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Weixing LIU ,  Kuanjun PENG ,  Bin QIN ,  Xue DONG ,  Fangzhen ZHANG ,  Wanpeng TENG ,  Tieshi WANG ,  Wanzhi CHEN ,  Kai GUO ,  Chunfang ZHANG

IPC: G09G3/3233 ,  H01L27/15 ,  H01L33/06 ,  H01L33/38

CPC classification number: G09G3/3233 ,  H01L27/156 ,  H01L33/06 ,  H01L33/38 ,  G09G2300/0819 ,  G09G2300/0842 ,  G09G2310/0262 ,  G09G2310/08 ,  G09G2300/0426 ,  G09G2320/0233

Abstract: A pixel driving circuit includes a data writing circuit, a light-emitting control circuit and a light-emitting diode chip. The data writing circuit is electrically connected to a first scanning signal terminal, a data signal terminal and a first node. The light-emitting control circuit is electrically connected to the first node, an enable signal terminal, a first voltage signal terminal and a second node, and is configured to transmit a first voltage signal received at the first voltage signal terminal to the second node. The light-emitting diode chip is electrically connected to the second node and a second voltage signal terminal. The light-emitting diode chip includes a plurality of light-emitting portions. The light-emitting diode chip is configured to drive the plurality of light-emitting portions to emit light in different periods of time respectively or drive at least two light-emitting portions to emit light in a same period of time.

公开(公告)号：US20240186454A1

公开(公告)日：2024-06-06

申请号：US17789351

申请日：2021-05-31

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Weixing LIU ,  Kuanjun PENG ,  Xiaolong LI ,  Wanpeng TENG ,  Bin QIN ,  Wanzhi CHEN ,  Fangzhen ZHANG ,  Chunfang ZHANG ,  Zhiqiang XU

IPC: H01L33/38 ,  G09G3/32 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L33/382 ,  G09G3/32 ,  H01L25/0753 ,  H01L33/62 ,  G09G2300/0819 ,  G09G2300/0852 ,  G09G2320/0626 ,  G09G2330/021

Abstract: A light-emitting device includes a first semiconductor layer, a light-emitting functional layer and a second semiconductor layer that are stacked. The first semiconductor layer includes a first semiconductor pattern and a second semiconductor pattern. The light-emitting functional layer includes a first light-emitting pattern and a second light-emitting pattern spaced apart. The second semiconductor layer includes a third semiconductor pattern and a fourth semiconductor pattern spaced apart. Orthographic projections of the first semiconductor pattern, the first light-emitting pattern and the third semiconductor pattern on a reference plane at least partially overlap to form a first light-emitting portion. Orthographic projections of the second semiconductor pattern, the second light-emitting pattern and the fourth semiconductor pattern on the reference plane at least partially overlap to form a second light-emitting portion. The reference plane is parallel to a plane where the first semiconductor layer is located.

公开(公告)号：US20240282263A1

公开(公告)日：2024-08-22

申请号：US18650738

申请日：2024-04-30

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Weixing LIU ,  Kuanjun PENG ,  Bin QIN ,  Xue DONG ,  Fangzhen ZHANG ,  Wanpeng TENG ,  Tieshi WANG ,  Wanzhi CHEN ,  Kai GUO ,  Chunfang ZHANG

IPC: G09G3/3233 ,  H01L27/15 ,  H01L33/06 ,  H01L33/38

CPC classification number: G09G3/3233 ,  H01L27/156 ,  H01L33/06 ,  H01L33/38 ,  G09G2300/0426 ,  G09G2300/0819 ,  G09G2300/0842 ,  G09G2310/0262 ,  G09G2310/08 ,  G09G2320/0233

Abstract: A pixel driving circuit includes a data writing circuit, a light-emitting control circuit, a switching circuit and a light-emitting diode chip. The data writing circuit is electrically connected to a first scanning signal terminal, a data signal terminal and a first node. The light-emitting control circuit is configured to transmit a first voltage signal received at the first voltage signal terminal to a second node. The switching circuit includes switching transistors. The light-emitting diode chip is electrically connected to the second node. The light-emitting diode chip includes light-emitting portions. The light-emitting diode chip is configured to drive the light-emitting portions to emit light in different periods of time respectively or drive at least two light-emitting portions to emit light in a same period of time. At least part of the light-emitting portions are sequentially connected in series through at least one switching transistor.

公开(公告)号：US20230013848A1

公开(公告)日：2023-01-19

申请号：US17783207

申请日：2021-05-20

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Lubin SHI ,  Wanpeng TENG ,  Liang CHEN ,  Bin QIN ,  Ke WANG ,  Jintao PENG ,  Fangzhen ZHANG ,  Kuanjun PENG

IPC: H01L27/32

Abstract: A display panel has a display region and a fan-out lead region, the fan-out lead region is located within the display region. The display panel comprises a base, a pixel circuit layer, a plurality of fan-out leads disposed between the base and the pixel circuit layer and located in the fan-out lead region, and an electrical field shielding pattern disposed between the pixel circuit layer and a film layer in which the plurality of fan-out leads are located. The pixel circuit layer includes a plurality of pixel circuits, at least one pixel circuit is located in the fan-out lead region. At least one fan-out lead is electrically connected to the pixel circuits. Orthographic projection of active layer patterns of transistors of the pixel circuit located in the fan-out lead region on the base are located within an orthographic projection of the electric field shielding pattern on the base.

公开(公告)号：US20250040317A1

公开(公告)日：2025-01-30

申请号：US18272570

申请日：2022-06-29

Applicant: BOE Technology Group Co., Ltd.

Inventor： Yanan NIU ,  Yan QU ,  Dongni LIU ,  Jinqian WANG ,  Jing NIU ,  Tingting ZHOU ,  Shuang SUN ,  Bin QIN ,  Hongwei TIAN ,  Fangzhen ZHANG ,  Wei WANG

IPC: H01L33/56 ,  H01L25/16 ,  H01L33/62

Abstract: The present disclosure provides a display apparatus and a display panel. The display panel includes: a drive backplate, including a substrate and a drive circuit layer on the substrate, where the drive circuit layer includes drive circuit regions arranged at intervals and transparent regions around the drive circuit regions, the transparent region includes concave parts, and a number of layers in the respective concave parts of the drive circuit layer is less than a number of layers in the respective drive circuit regions; a side of the drive circuit regions of the drive circuit layer away from the substrate includes pads for connecting a light-emitting unit; a light-transmissive glue for filling the concave parts, and a surface of the light-transmissive glue away from the substrate is on a side of the pads away from the substrate. The present disclosure can improve display effect.

公开(公告)号：US20240276775A1

公开(公告)日：2024-08-15

申请号：US18023381

申请日：2022-03-16

Applicant: BOE Technology Group Co., Ltd.

Inventor： Jintao PENG ,  Yanan NIU ,  Zhikun GAO ,  Tingting ZHOU ,  Bin QIN ,  Shuang SUN

IPC: H10K59/122 ,  H10K59/35

CPC classification number: H10K59/122 ,  H10K59/35

Abstract: A display substrate includes a light emitting structure layer arranged on a base substrate, the light emitting structure layer includes a first electrode layer, a pixel definition layer, a light emitting functional layer, a second electrode layer, a third electrode layer and an electrode insulation layer; the first electrode layer includes multiple first electrodes, and the pixel definition layer is provided with a pixel opening exposing a first electrode and a grid-shaped isolation groove structure; the third electrode layer and the electrode insulation layer are sequentially stacked on a side of the pixel definition layer; the light emitting functional layer and the second electrode layer are sequentially stacked; the second electrode layer and the third electrode layer are configured to be equipotential; the light emitting functional layer includes at least two stacked light emitting units and a charge generation layer positioned between two adjacent light emitting units.

公开(公告)号：US20240088328A1

公开(公告)日：2024-03-14

申请号：US18263567

申请日：2021-10-22

Applicant: BOE Technology Group Co., Ltd.

Inventor： Bin QIN ,  Kuanjun PENG ,  Weixing LIU ,  Fangzhen ZHANG ,  Xue DONG ,  Jintao PENG ,  Wanpeng TENG ,  Xiaolong LI ,  Shuang SUN ,  Wanzhi CHEN ,  Guangcai YUAN ,  Qian JIA

IPC: H01L33/38 ,  H01L27/15 ,  H01L33/06 ,  H01L33/14 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64

CPC classification number: H01L33/385 ,  H01L27/15 ,  H01L33/06 ,  H01L33/145 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642

Abstract: A light-emitting device, a light-emitting substrate, and a method for manufacturing the light-emitting device. The light-emitting device includes at least one light-emitting structure. The light-emitting structure includes: a first semiconductor layer; a light-emitting layer; a second semiconductor layer, doping ions of the second semiconductor layer and a first semiconductor layer being oppositely charged; a barrier structure provided with an opening for exposing the second semiconductor layer, the orthographic projection of the opening on the base substrate being located in the orthographic projection of the light-emitting layer on the base substrate, and the area of the opening being smaller than that of the light-emitting layer; and a landing electrode located on the side of the barrier structure facing away from the second semiconductor layer, the landing electrode being in contact with the second semiconductor layer by means of the opening.