公开(公告)号：US20090280593A1

公开(公告)日：2009-11-12

申请号：US12116724

申请日：2008-05-07

申请人： Bogdan-Catalin Serban ,  Stefan I. Voicu ,  Stefan-Dan Costea ,  Cornel P. Cobianu

发明人： Bogdan-Catalin Serban ,  Stefan I. Voicu ,  Stefan-Dan Costea ,  Cornel P. Cobianu

IPC分类号： H01L51/40 ,  C08K3/22

CPC分类号： G01N29/022 ,  G01N29/036 ,  G01N33/0044 ,  G01N2291/021 ,  G01N2291/0255 ,  G01N2291/0257 ,  G01N2291/0423 ,  G01N2291/0426 ,  Y10S977/748 ,  Y10S977/835 ,  Y10T29/49002

摘要： A method can be adapted for design and preparation of a matrix nanocomposite sensing film for hydrogen sulphide SAW/BAW detection at room temperature. A matrix nanocomposite can be synthesized by incorporating both single-wall and multi-wall thiolated carbon nanotubes into conductive organic polymers or ceramic nanocrystalline in a properly functionalized manner. A thin organic sensing film can be prepared based on the matrix nanocomposite. The matrix nanocomposite sensing film can be prepared on a surface of a SAW/BAW device by an additive process or a direct printing process. Finally, the sensing film can be consolidated by thermal annealing or laser annealing under ambient conditions in order to obtain the stable sensing film with higher sensitivity and electrical properties for a SAW/BAW based H2S sensor.

摘要翻译： 一种方法可以适用于在室温下用于硫化氢SAW / BAW检测的基质纳米复合材料感测膜的设计和制备。 可以通过将单壁和多壁硫醇化碳纳米管以适当的官能化方式并入导电有机聚合物或陶瓷纳米晶体中来合成基质纳米复合材料。 可以基于基体纳米复合材料制备薄的有机传感膜。 可以通过添加方法或直接印刷方法在SAW / BAW装置的表面上制备基质纳米复合材料感测膜。 最后，感应膜可以在环境条件下通过热退火或激光退火进行固结，以获得具有更高灵敏度和电气性能的稳定感测膜，用于基于SAW / BAW的H2S传感器。

公开(公告)号：US20090193897A1

公开(公告)日：2009-08-06

申请号：US12363842

申请日：2009-02-02

申请人： Bogdan-Catalin Serban ,  Sarinkumar A. Koyilothu ,  Stefan-Dan Costea ,  Cornel Cobianu

发明人： Bogdan-Catalin Serban ,  Sarinkumar A. Koyilothu ,  Stefan-Dan Costea ,  Cornel Cobianu

IPC分类号： G01N29/00 ,  C12Q1/00

CPC分类号： G01N29/036 ,  G01N29/022 ,  G01N33/004 ,  G01N33/02 ,  G01N2291/011 ,  G01N2291/0256

摘要： A sensor includes a piezoelectric substrate and conductive elements formed in or over the substrate. The sensor also includes a sensing layer formed over the substrate. The sensing layer has one or more properties (such as a mass loading, an electrical property, or a visco-elastic property) that vary based on at least one measurand to be measured by the sensor (such as carbon dioxide). This may affect, for example, a propagation velocity of acoustic waves in the sensor and/or a resonant frequency of the sensor. The sensing layer includes a combination of polyaniline and carbonic anhydrase. The combination of polyaniline and carbonic anhydrase could be formed using an emeraldine base. For instance, an aniline can be dissolved in water to form a mixture, and hydrochloric acid and an oxidant can be added to the mixture. A chemical polymerization of the aniline in the mixture can be performed to form polyanilne.

摘要翻译： 传感器包括压电基板和形成在基板内或上的导电元件。 传感器还包括形成在衬底上的感测层。 感测层具有基于由传感器（例如二氧化碳）测量的至少一个被测量而变化的一个或多个特性（例如质量负载，电性能或粘弹性）。 这可能会影响传感器中声波的传播速度和/或传感器的谐振频率。 感测层包括聚苯胺和碳酸酐酶的组合。 聚苯胺和碳酸酐酶的组合可以使用翠绿亚胺碱形成。 例如，苯胺可以溶解在水中以形成混合物，并且可以向混合物中加入盐酸和氧化剂。 可以进行混合物中苯胺的化学聚合以形成聚苯胺。

公开(公告)号：US08372674B2

公开(公告)日：2013-02-12

申请号：US12362636

申请日：2009-01-30

申请人： Cornel Cobianu ,  Bogdan-Catalin Serban

发明人： Cornel Cobianu ,  Bogdan-Catalin Serban

IPC分类号： H01L21/00

CPC分类号： G01N29/022 ,  B81B2201/0214 ,  B81C1/00206 ,  B81C1/00325 ,  B81C2203/0109 ,  B81C2203/019 ,  G01N29/2437 ,  G01N2291/0255 ,  G01N2291/0423 ,  Y10T29/42 ,  Y10T29/49002

摘要： A method includes forming a hole in a first wafer and forming a sensor structure in or on a second wafer. The second wafer includes a piezoelectric material. The method also includes bonding the first wafer and the second wafer, where the sensor structure is located between the wafers. The method further includes forming a sensing layer by depositing material between the wafers through the hole in the first wafer. The sensing layer could be formed by depositing a sensing layer material on the second wafer using direct printing. Also, the hole through the first wafer could be formed using ultrasonic milling, micro-drilling, laser drilling, wet etching, and/or plasma etching. A spacer material could be used to bond the wafers together, such as frit glass paste or an organic adhesive. Trenches could be formed in the first wafer to facilitate easier separation of multiple sensors.

摘要翻译： 一种方法包括在第一晶片中形成孔并在第二晶片上形成传感器结构。 第二晶片包括压电材料。 该方法还包括将第一晶片和第二晶片接合，其中传感器结构位于晶片之间。 该方法还包括通过在第一晶片中的孔通过在晶​​片之间沉积材料来形成感测层。 感测层可以通过使用直接印刷在第二晶片上沉积感测层材料来形成。 此外，穿过第一晶片的孔可以使用超声波铣削，微钻孔，激光钻孔，湿蚀刻和/或等离子体蚀刻来形成。 可以使用间隔物材料将晶片粘合在一起，例如熔结玻璃浆料或有机粘合剂。 可以在第一晶片中形成沟槽，以便于更容易地分离多个传感器。