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47 条记录 (耗时 0.029 秒)

    Mounting structure for component of electronic device
    25.
    发明授权
    Mounting structure for component of electronic device 有权
    电子元器件安装结构

    公开(公告)号：US09165607B2

    公开(公告)日：2015-10-20

    申请号：US13484079

    申请日：2012-05-30

    申请人： Cheng Ping Tan ,  Con Phan ,  Steven Lee Owen ,  Michael D. Hillman

    发明人： Cheng Ping Tan ,  Con Phan ,  Steven Lee Owen ,  Michael D. Hillman

    IPC分类号： G06F1/16 ,  G11B33/08 ,  F16F1/371 ,  F16F1/376 ,  F16F1/42 ,  G06F1/18

    CPC分类号： G11B33/08 ,  F16F1/371 ,  F16F1/376 ,  F16F1/428 ,  G06F1/187

    摘要： A portable electronic device having an outer housing, a component, and a shock-absorption assembly is disclosed. A shock-absorption assembly located within the outer housing and coupled to the component can include one or more elements adapted to dampen a mechanical shock to the component. The shock-absorption assembly elements can be mounted to corners and/or edges of the component. Shock-absorption assembly elements can include a first portion comprising protrusions that provide initial damping of the mechanical shock and a second portion comprising an elastic block that provides final damping of the mechanical shock.

    摘要翻译： 公开了具有外壳，部件和减震组件的便携式电子设备。 位于外壳内并联接到部件上的减震组件可以包括一个或多个适于抑制对部件的机械冲击的元件。 减震组件元件可以安装到部件的角部和/或边缘。 冲击吸收组件元件可以包括第一部分，其包括提供机械冲击的初始阻尼的突起，以及包括提供机械冲击的最终阻尼的弹性块的第二部分。

    Portable hard drive and mounting structure for same
    26.
    发明授权
    Portable hard drive and mounting structure for same 有权
    便携式硬盘驱动器和安装结构相同

    公开(公告)号：US08223482B2

    公开(公告)日：2012-07-17

    申请号：US12641947

    申请日：2009-12-18

    申请人： Cheng Ping Tan ,  Con Phan ,  Steven Lee Owen ,  Michael D. Hillman

    发明人： Cheng Ping Tan ,  Con Phan ,  Steven Lee Owen ,  Michael D. Hillman

    IPC分类号： H05K5/00 ,  H05K7/00

    CPC分类号： G11B33/08 ,  F16F1/371 ,  F16F1/376 ,  F16F1/428 ,  G06F1/187

    摘要： A portable computing device having an outer housing, and internal hard disk drive and a shock damping mounting assembly is disclosed. Multiple outer dimensions of the portable computing device can be less than the width of the hard drive due to a diagonal arrangement of the hard drive within the overall device. The hard drive can comply with a standardized form factor, such as a 3.5 inch form factor. A mounting assembly located within the outer housing and coupled to the hard drive can include one or more components adapted to damp a mechanical shock to the hard drive, which components can be mounted to corners and/or edges of the hard drive. Mounting assembly components can includes a first stage spring comprising a finger geometry that provides initial damping of the mechanical shock and a second stage spring comprising an elastic block that provides final damping of the mechanical shock.

    摘要翻译： 公开了一种具有外壳体，内部硬盘驱动器和减震安装组件的便携式计算设备。 便携式计算设备的多个外部尺寸可以由于整个设备内的硬盘驱动器的对角排列而小于硬盘驱动器的宽度。 硬盘驱动器可以符合标准化的外形尺寸，例如3.5英寸外形尺寸。 位于外部壳体内并联接到硬盘驱动器的安装组件可以包括一个或多个组件，其适于阻止对硬盘驱动器的机械冲击，该组件可以安装到硬盘驱动器的角部和/或边缘。 安装组件部件可以包括第一级弹簧，其包括提供机械冲击的初始阻尼的手指几何形状，以及包括提供机械冲击的最终阻尼的弹性块的第二级弹簧。

    Method of assembling integrated circuit components
    28.
    发明授权
    Method of assembling integrated circuit components 有权
    集成电路组件的组装方法

    公开(公告)号：US08039360B2

    公开(公告)日：2011-10-18

    申请号：US12241933

    申请日：2008-09-30

    申请人： Bradley Spare ,  Michael D. Hillman ,  Gregory Tice

    发明人： Bradley Spare ,  Michael D. Hillman ,  Gregory Tice

    IPC分类号： H01L21/30

    CPC分类号： H01L31/188 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/83801 ,  H01L2924/12043 ,  H01L2924/14 ,  Y02E10/50 ,  H01L2924/00

    摘要： The disclosure identified as methods of mounting integrated circuits, including solar cells, to a substrate wherein the circuits are mounted prior to being singulated into discrete die. Once the semiconductor die sites or other circuits are formed on a wafer, the wafer will be attached, either whole, or divided into one or more multi-die site wafer segments, to a substrate. This attachment may be by conventional surface mount technology, for example. After such mounting, the individual die sites on the wafer segments will be singulated to form discrete die already mounted to the supporting substrate. The singulation may be preferably performed by laser dicing of the wafer segments.

    摘要翻译： 本公开被确定为将集成电路（包括太阳能电池）安装到基板的方法，其中在将单元切割成离散模具之前将电路安装在基板上。 一旦在晶片上形成半导体芯片位置或其它电路，则晶片将被整体地或分成一个或多个多晶片位置晶片段而连接到衬底。 该附件可以是例如常规的表面贴装技术。 在这种安装之后，晶片段上的各个晶片位置将被单独化以形成已经安装到支撑衬底上的离散模具。 单片化可以优选地通过晶片片段的激光切割来进行。

    METHOD OF ASSEMBLING INTEGRATED CIRCUIT COMPONENTS
    29.
    发明申请
    METHOD OF ASSEMBLING INTEGRATED CIRCUIT COMPONENTS 有权
    组装电路组件的方法

    公开(公告)号：US20100081229A1

    公开(公告)日：2010-04-01

    申请号：US12241933

    申请日：2008-09-30

    申请人： Bradley Spare ,  Michael D. Hillman ,  Gregory Tice

    发明人： Bradley Spare ,  Michael D. Hillman ,  Gregory Tice

    IPC分类号： H01L31/18 ,  H01L21/58

    CPC分类号： H01L31/188 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/83801 ,  H01L2924/12043 ,  H01L2924/14 ,  Y02E10/50 ,  H01L2924/00

    摘要： The disclosure identified as methods of mounting integrated circuits, including solar cells, to a substrate wherein the circuits are mounted prior to being singulated into discrete die. Once the semiconductor die sites or other circuits are formed on a wafer, the wafer will be attached, either whole, or divided into one or more multi-die site wafer segments, to a substrate. This attachment may be by conventional surface mount technology, for example. After such mounting, the individual die sites on the wafer segments will be singulated to form discrete die already mounted to the supporting substrate. The singulation may be preferably performed by laser dicing of the wafer segments.

    摘要翻译： 本公开被确定为将集成电路（包括太阳能电池）安装到基板的方法，其中在将单元切割成离散模具之前将电路安装在基板上。 一旦在晶片上形成半导体芯片位置或其它电路，则晶片将被整体地或分成一个或多个多晶片位置晶片段而连接到衬底。 该附件可以是例如常规的表面贴装技术。 在这种安装之后，晶片段上的各个晶片位置将被单独化以形成已经安装到支撑衬底上的离散模具。 单片化可以优选地通过晶片片段的激光切割来进行。