公开(公告)号：US6079991A

公开(公告)日：2000-06-27

申请号：US778380

申请日：1996-12-31

申请人： Timothy A. Lemke ,  Timothy W. Houtz ,  Charles M. Gross ,  Charles R. Gingrich

发明人： Timothy A. Lemke ,  Timothy W. Houtz ,  Charles M. Gross ,  Charles R. Gingrich

IPC分类号： H01M2/30 ,  H01R13/415 ,  H01R43/02 ,  H01R43/20 ,  H05K3/34 ,  H01R9/09

CPC分类号： H01R12/716 ,  H01R43/0256 ,  H01R43/20 ,  H01M2/30 ,  H05K3/3426 ,  H05K3/3478 ,  Y10T29/49117

摘要： Electrical connectors capable of being mounted on circuit substrates by BGA techniques and a method for manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side of the into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portion of the contact extending into the recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the housing, thereby reducing warpage. Solder resist areas are formed on central portions of the contacts to promote uniformity of solder volume. As a result of these features, substantial coplanarity of the BGA array along the mounting interface of the connector is achieved.

摘要翻译： 能够通过BGA技术安装在电路基板上的电连接器以及用于制造这种连接器的方法。 在连接器元件的外侧有至少一个凹槽。 导电接触部从相邻的内侧延伸到壳体外侧的凹部中。 将控制体积的焊膏引入凹部。 以焊球的形式的可熔导电元件位于凹槽中。 连接器经受回流处理以将焊球熔合到延伸到凹部中的接触部分。 接触件通过变形部分固定在连接器的绝缘壳体中，使得施加在壳体上的应力最小化，从而减少翘曲。 在触点的中心部分形成有阻焊区域，以促进焊料体积的均匀性。 作为这些特征的结果，实现了沿着连接器的安装界面的BGA阵列的显着的共面性。