公开(公告)号：US20130176266A1

公开(公告)日：2013-07-11

申请号：US13346848

申请日：2012-01-10

申请人： Yih-Feng Kao ,  Chih-Feng Hsu ,  Li-Hui Chen

发明人： Yih-Feng Kao ,  Chih-Feng Hsu ,  Li-Hui Chen

IPC分类号： G06F3/045

CPC分类号： G06F3/044 ,  G06F3/0416 ,  G06F3/0436 ,  G06F2203/04106

摘要： The invention discloses a touch sensing method and a portable electronic apparatus. The portable electronic apparatus includes a capacitive touch sensor unit, an acoustic touch sensor unit and a processing unit. The capacitive touch sensor unit and the acoustic touch sensor unit are used for monitoring a touch input interface. When both of the capacitive touch sensor unit and the acoustic touch sensor unit sense a touch input on the touch input interface at the same time and in response generate a first sensed coordinate and a second sensed coordinate respectively, the processing unit selects or executes an application function on the touch input interface according to the first sensed coordinate.

摘要翻译： 本发明公开了一种触摸感测方法和便携式电子设备。 便携式电子设备包括电容式触摸传感器单元，声学触摸传感器单元和处理单元。 电容式触摸传感器单元和声学触摸传感器单元用于监视触摸输入接口。 当电容式触摸传感器单元和声学触摸传感器单元同时感测触摸输入接口上的触摸输入并且响应分别产生第一感测坐标和第二感测坐标时，处理单元选择或执行应用 根据第一感测坐标在触摸输入接口上的功能。

公开(公告)号：US20130009989A1

公开(公告)日：2013-01-10

申请号：US13416165

申请日：2012-03-09

申请人： Li-Hui Chen ,  Chun-Hsiang Huang ,  Tai-Ling Lu ,  Hao-Yuan Chen

发明人： Li-Hui Chen ,  Chun-Hsiang Huang ,  Tai-Ling Lu ,  Hao-Yuan Chen

IPC分类号： G09G5/00 ,  G06F3/041

CPC分类号： G06F3/0488

摘要： The invention provides methods and systems for image segmentation and related application in a portable device. Movements of a input tool on an image is detected for determining a region to be segmented from the image. When image segmentation is done, segmented region can be applied with various visual effects. For example, background can be replaced with a plurality of other different images.

摘要翻译： 本发明提供了用于便携式设备中的图像分割和相关应用的方法和系统。 检测图像上的输入工具的移动以确定要从图像分割的区域。 当图像分割完成时，分割区域可以应用各种视觉效果。 例如，可以用多个其他不同的图像替换背景。

公开(公告)号：US07385143B2

公开(公告)日：2008-06-10

申请号：US11085097

申请日：2005-03-22

申请人： Ya-Ting Ho ,  Li-Hui Chen

发明人： Ya-Ting Ho ,  Li-Hui Chen

IPC分类号： H05K1/00

CPC分类号： H05K3/363 ,  H05K1/0206 ,  H05K1/0212 ,  H05K3/281 ,  H05K3/3494 ,  H05K3/42 ,  H05K2201/09781 ,  H05K2203/0195 ,  Y10T29/49126 ,  Y10T29/49165

摘要： A thermal bonding structure and manufacture process of a flexible printed circuit (FPC) board are disclosed, and the thermal bonding structure includes a laminated structure having a first insulating layer with a solder pad area and showing parts of a first conductive layer, the first conductive layer, a second insulating layer, a second conductive layer, and a third insulating layer with a bonding area such that a part of the second conductive layer is exposed, and at least a through hole passing through the first conductive layer to the second conductive layer for propagating heat energy to fuse a solder. Accordingly, the reduction of heat energy lost in the third insulating layer improves the bonding quality, shortens the bonding period, and maintains the material stability under high temperature resulted from high heat energy.