公开(公告)号：US20240136740A1

公开(公告)日：2024-04-25

申请号：US18481982

申请日：2023-10-04

申请人： NIPPON MEKTRON, LTD.

发明人： Shuzo YAMADA ,  Kenichi NAKAYAMA ,  Tomoki KANAYAMA

IPC分类号： H01R12/61 ,  H05K1/11

CPC分类号： H01R12/61 ,  H05K1/118 ,  H05K2201/09381 ,  H05K2201/09781

摘要： Provided is a flexible printed circuit connection structure which includes a flexible printed circuit having a plurality of wires, a board to be connected having a plurality of wires to be connected, a plurality of solder connection portions, and a partition wall, in which: the plurality of solder connection portions is a part where the plurality of wires of the flexible printed circuit and the plurality of wires to be connected of the board to be connected are connected to each other by solder; the partition wall is provided away from the plurality of solder connection portions so as to surround the plurality of solder connection portions; and the flexible printed circuit, the board to be connected, and the partition wall define a sealed space, and the plurality of solder connection portions is arranged inside the sealed space.

公开(公告)号：US11871511B2

公开(公告)日：2024-01-09

申请号：US17003308

申请日：2020-08-26

申请人： WuHan TianMa Micro-electronics CO., LTD.

发明人： Han Wu ,  Houfu Gong ,  Zhenhua Liang ,  Xiang Huang

IPC分类号： H05K1/02 ,  G01R31/28 ,  H01R12/59 ,  H01R12/61 ,  H05K1/11 ,  H05K3/00 ,  H05K3/30 ,  H05K3/40

CPC分类号： H05K1/0268 ,  G01R31/2818 ,  H01R12/592 ,  H01R12/61 ,  H05K1/111 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/303 ,  H05K3/403 ,  H05K2201/09781 ,  H05K2201/10015 ,  H05K2201/10022

摘要： Provided are a flexible circuit mother board and a detection method. The flexible circuit mother board includes flexible circuit daughter boards, at least one detection terminal group and external pad groups corresponding to the flexible circuit daughter boards in one-to-one correspondence. Each flexible circuit daughter board has a bonding pad area adjacent to a corresponding one of the plurality of external pad groups. Each detection terminal group detects at least one flexible circuit daughter board, and each of the at least one detection terminal group comprises a plurality of detection terminals. Each flexible circuit daughter board includes a plurality of capacitors including a first electrode plate and a second electrode plate. Each of the first electrode plate and the second electrode plate is electrically connected to one detection terminal.

公开(公告)号：US20230413425A1

公开(公告)日：2023-12-21

申请号：US18037825

申请日：2021-11-19

申请人： LG INNOTEK CO., LTD.

发明人： Myung Jae KWON ,  Dong Sun KIM ,  Sang Hyuck NAM ,  Sung Wuk RYU ,  Chang Woo YOO ,  Ju Hyun LEE

IPC分类号： H05K1/02 ,  H05K1/11

CPC分类号： H05K1/0272 ,  H05K1/113 ,  H05K1/0271 ,  H05K2201/09409 ,  H05K2201/09381 ,  H05K2201/09781 ,  H05K3/4038

摘要： A circuit board according to an embodiment includes a first insulating layer including a first region and a second region; and a first circuit pattern layer disposed on the first insulating layer; wherein the first circuit pattern layer includes a first electrode disposed on the first region of the first insulating layer and including a first opening, and wherein the first opening pass through upper and lower surfaces of the first electrode.

公开(公告)号：US11653451B2

公开(公告)日：2023-05-16

申请号：US16278530

申请日：2019-02-18

申请人： SAMSUNG DISPLAY CO., LTD.

发明人： Hyeong-Cheol Ahn

IPC分类号： H05K1/02 ,  H01L51/52 ,  H01L27/32 ,  G02F1/1345 ,  G09G3/3225 ,  G06F1/16 ,  H01L23/13 ,  H05K3/36 ,  H05K3/28 ,  H01L25/00 ,  H04R19/00 ,  H04M1/02 ,  H05K1/18 ,  G06F3/041 ,  G06F3/047 ,  H05K1/11

CPC分类号： H05K1/189 ,  G06F3/047 ,  G06F3/0412 ,  H05K1/028 ,  H05K1/0296 ,  G06F2203/04102 ,  H05K1/118 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/09063 ,  H05K2201/09781 ,  H05K2201/10121 ,  H05K2201/10128 ,  H05K2201/10136 ,  H05K2201/10681

摘要： A flexible circuit board and display device including the same are disclosed. In one aspect, the flexible circuit board includes a base film including a bending area and a plurality of signal wires formed over the bending area of the base film. At least one through-hole is defined in the base film.

公开(公告)号：US20190189344A1

公开(公告)日：2019-06-20

申请号：US16255041

申请日：2019-01-23

申请人： TDK CORPORATION

发明人： Takeru YOSHIDA ,  Takuya IMAEDA ,  Shogo MUROSAWA ,  Hideki KAMO ,  Naoto IMAIZUMI ,  Keiichi TAKIZAWA

IPC分类号： H01G4/002 ,  H01G4/012 ,  H01G4/30 ,  H05K1/11 ,  H01G4/248

CPC分类号： H01G4/002 ,  H01G4/012 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30 ,  H01G4/385 ,  H05K1/111 ,  H05K1/115 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/09781 ,  H05K2201/10015

摘要： A multilayer capacitor includes an element assembly, a first external electrode, a second external electrode, and a plurality of internal electrodes which are disposed at the inside of the element assembly. The plurality of internal electrodes include a first internal electrode that is electrically connected to the first external electrode, a second internal electrode that is electrically connected to the second external electrode, and a plurality of third internal electrodes. The plurality of third internal electrodes are electrically connected to each other by a first connection conductor and a second connection conductor, a first capacitance portion is constituted by the first internal electrode and the third internal electrodes, a second capacitance portion is constituted by the second internal electrode and the third internal electrodes, and the first capacitance portion and the second capacitance portion are electrically connected in series.

公开(公告)号：US10080284B2

公开(公告)日：2018-09-18

申请号：US15822222

申请日：2017-11-27

申请人： Unimicron Technology Corp.

发明人： Ming-Hao Wu ,  Shu-Sheng Chiang ,  Wei-Ming Cheng

IPC分类号： H05K1/18 ,  H05K3/00 ,  H05K1/11 ,  H05K3/46 ,  H05K1/02 ,  H05K1/09 ,  H05K3/40

CPC分类号： H05K1/111 ,  H05K1/0266 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0047 ,  H05K3/0073 ,  H05K3/4038 ,  H05K3/4092 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2201/094 ,  H05K2201/09563 ,  H05K2201/09781 ,  H05K2203/0376 ,  H05K2203/163

摘要： A circuit board structure includes an inner circuit structure and a first build-up circuit structure. The inner circuit structure includes a core layer having an upper surface and a lower surface, a first patterned circuit layer disposed on the upper surface, a second patterned circuit layer disposed on the lower surface and a conductive through hole connecting the first and the second patterned circuit layers. The first build-up circuit structure at least has a cavity and an inner dielectric layer. The inner dielectric layer has an opening communicating the cavity and a pad of the first patterned circuit layer is located in the opening. A hole diameter of the opening is smaller than a hole diameter of cavity. An inner surface of the inner dielectric layer exposed by the cavity and a top surface of the pad are coplanar or have a height difference.

公开(公告)号：US09992880B2

公开(公告)日：2018-06-05

申请号：US14995139

申请日：2016-01-13

申请人： Multek Technologies Limited

发明人： Pui Yin Yu ,  Mark Zhang ,  Jiawen Chen

IPC分类号： H05K3/36 ,  H05K3/46

CPC分类号： H05K3/4691 ,  H05K2201/09127 ,  H05K2201/09781 ,  H05K2203/0228 ,  Y10T29/49126

摘要： A printed circuit board (PCB) has multiple layers, where select portions of one or more conductive layers, referred to as core circuitry, form a semi-flexible PCB portion that is protected by an exposed prepreg layer. The semi-flexible PCB portion having an exposed prepreg layer is formed using a dummy core process that leaves the exposed prepreg layer smooth and undamaged. The core circuitry is part of a core structure. The semi-flexible PCB portion is an extension of the remaining adjacent multiple layer PCB. The remaining portion of the multiple layer PCB is rigid. The core structure is common to both the semi-flexible PCB portion and the remaining rigid PCB portion.

公开(公告)号：US09980374B2

公开(公告)日：2018-05-22

申请号：US15033836

申请日：2014-10-24

申请人： INGENICO GROUP

发明人： Stephane Pavageau ,  Xavier Lambert

IPC分类号： H05K7/00 ,  H05K1/02 ,  G06K7/00 ,  G06F21/86 ,  B23K1/00 ,  H05K3/10 ,  H05K3/34 ,  H05K3/12 ,  H05K3/14 ,  H05K3/24 ,  B23K101/42

CPC分类号： H05K1/0284 ,  B23K1/0016 ,  B23K2101/42 ,  G06F21/86 ,  G06K7/0091 ,  H05K1/0275 ,  H05K3/10 ,  H05K3/1241 ,  H05K3/1275 ,  H05K3/143 ,  H05K3/245 ,  H05K3/34 ,  H05K2201/09409 ,  H05K2201/09781 ,  H05K2201/098 ,  H05K2201/10204 ,  H05K2203/0551

摘要： A support is provided for fabrication of an electronic device. The support includes at least one component to be protected and at least one three-dimensional element of a height at least equal to a height of the electronic component. The three-dimensional element is disposed laterally opposite the at least one component to be protected. The three-dimensional element is chiefly constituted of a permanent assembling material.

公开(公告)号：US09958496B2

公开(公告)日：2018-05-01

申请号：US14838605

申请日：2015-08-28

申请人： Oracle International Corporation

发明人： Stephanie Moran ,  Michael C. Freda ,  Karl Sauter

IPC分类号： G01R31/28 ,  H05K1/11 ,  H05K1/02 ,  H05K3/46 ,  H05K1/16 ,  H05K3/00

CPC分类号： G01R31/2813 ,  H05K1/0266 ,  H05K1/0268 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/167 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/4679 ,  H05K2201/09381 ,  H05K2201/09636 ,  H05K2201/097 ,  H05K2201/09781 ,  H05K2203/166

摘要： A method and apparatus for determining misregistration of internal layers of a PCB using resistance measurements is disclosed. In one embodiment, a method includes measuring a first resistance between a first center terminal and a first peripheral terminal of a first registration coupon on a printed circuit board (PCB) panel including at least one PCB. The method further includes measuring a second resistance between the first center terminal and a second peripheral terminal of the first registration coupon, wherein the first and second peripheral terminals are associated with a first internal layer of the PCB. A difference between the first and second resistances is then calculated. Then, based on this difference, a determination is made of a distance of misregistration of the first internal layer, if any, along a first axis.

公开(公告)号：US09905973B2

公开(公告)日：2018-02-27

申请号：US14949958

申请日：2015-11-24

申请人： CommScope, Inc. of North Carolina

发明人： Richard A. Schumacher

IPC分类号： H01R13/6473 ,  H01R13/6461 ,  H01R24/62 ,  H01R13/6466 ,  H05K1/16 ,  H01R24/64 ,  H05K1/02 ,  H05K1/11

CPC分类号： H01R13/6473 ,  H01R13/6466 ,  H01R24/64 ,  H05K1/0219 ,  H05K1/0228 ,  H05K1/024 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/117 ,  H05K1/165 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/09672 ,  H05K2201/09727 ,  H05K2201/09781 ,  H05K2201/1034 ,  H05K2201/10356

摘要： Communications plugs are provided that include a housing that receives the conductors of the communication cable. A printed circuit board is mounted at least partially within the housing. A plurality of plug contacts are on the printed circuit board, and the printed circuit board includes a plurality of conductive paths that electrically connect respective ones of the conductors to respective ones of the plug contacts. First and second of the conductive paths are arranged as a first differential pair of conductive paths that comprise a portion of a first differential transmission line through the communications plug, where the first differential transmission line includes a first transition region where the impedance of the first differential transmission line changes by at least 20% and a second transition region impedance of the first differential transmission line changes by at least 20%.