公开(公告)号：US08446546B2

公开(公告)日：2013-05-21

申请号：US12416302

申请日：2009-04-01

Applicant: Ya-Ting Ho ,  Chi-Chih Chu ,  Keng-Ju Liu

Inventor： Ya-Ting Ho ,  Chi-Chih Chu ,  Keng-Ju Liu

IPC: G02F1/1335 ,  G02F1/1333 ,  G09F13/04 ,  G09F13/08 ,  F21V21/00 ,  F21V7/04

CPC classification number: G02F1/133605 ,  G02F2202/22 ,  G09F13/04 ,  G09F13/14

Abstract: A backlight module and a display panel device using the same are provided. The backlight module includes a light source module, an open frame, and a reflector sheet. The open frame is disposed around the light source module and has a first free-end and a second free-end. A space interval exists between the first and second free-ends. The reflector sheet is disposed on a rear side of the light source module and has a body and a sidewall. The sidewall corresponds to the space interval between the first and second free-ends and extends over the light source module. The display panel further includes a liquid crystal display panel (LCD panel) on the light source module and a front frame which is disposed on the LCD panel enclosing a lateral side of the LCD panel. The sidewall of the reflector sheet extends between the lateral side of the LCD panel and the front frame to provide insulation.

Abstract translation: 提供背光模块和使用其的显示面板装置。 背光模块包括光源模块，开放框架和反射板。 开放框架设置在光源模块周围，并且具有第一自由端和第二自由端。 在第一和第二自由端之间存在空间间隔。 反射片设置在光源模块的后侧，具有主体和侧壁。 侧壁对应于第一自由端和第二自由端之间的间隔，并且在光源模块上延伸。 显示面板还包括在光源模块上的液晶显示面板（LCD面板）和设置在LCD面板上的前框架，该框架包围LCD面板的侧面。 反射片的侧壁在LCD面板的侧面和前框架之间延伸以提供绝缘。

公开(公告)号：US07385143B2

公开(公告)日：2008-06-10

申请号：US11085097

申请日：2005-03-22

Applicant: Ya-Ting Ho ,  Li-Hui Chen

Inventor： Ya-Ting Ho ,  Li-Hui Chen

IPC: H05K1/00

CPC classification number: H05K3/363 ,  H05K1/0206 ,  H05K1/0212 ,  H05K3/281 ,  H05K3/3494 ,  H05K3/42 ,  H05K2201/09781 ,  H05K2203/0195 ,  Y10T29/49126 ,  Y10T29/49165

Abstract: A thermal bonding structure and manufacture process of a flexible printed circuit (FPC) board are disclosed, and the thermal bonding structure includes a laminated structure having a first insulating layer with a solder pad area and showing parts of a first conductive layer, the first conductive layer, a second insulating layer, a second conductive layer, and a third insulating layer with a bonding area such that a part of the second conductive layer is exposed, and at least a through hole passing through the first conductive layer to the second conductive layer for propagating heat energy to fuse a solder. Accordingly, the reduction of heat energy lost in the third insulating layer improves the bonding quality, shortens the bonding period, and maintains the material stability under high temperature resulted from high heat energy.

公开(公告)号：US20070229753A1

公开(公告)日：2007-10-04

申请号：US11476484

申请日：2006-06-28

Applicant: Chi-Chen Cheng ,  Ya-Ting Ho ,  Meng-Chai Wu

Inventor： Chi-Chen Cheng ,  Ya-Ting Ho ,  Meng-Chai Wu

IPC: G02F1/1333

CPC classification number: G02B6/0085 ,  F21K9/00 ,  F21V29/70 ,  F21V29/83 ,  G02B6/0073 ,  H05K1/0206 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/0209 ,  H05K2201/10106

Abstract: The heat dissipation structure of the backlight module of the present invention comprises a circuit board, a heat-conductive element (such as thermally conductive glue) and a light-emitting diode (LED) chip, wherein the circuit board has an electric circuit layer and a heat conductive layer respectively formed on two opposite surfaces thereof. The circuit board has a plurality of through holes penetrating through the electric circuit layer and the heat-conductive layer of the circuit board, wherein each of the through holes is filled with heat-conductive material. The heat-conductive element is placed on the circuit layer and covers the through holes, and the LED chip is disposed on the heat-conductive element and is electrically connected to the electric circuit layer.

Abstract translation: 本发明的背光模块的散热结构包括电路板，导热性胶（例如导热胶）和发光二极管（LED）芯片，其中电路板具有电路层和 分别形成在其两个相对表面上的导热层。 电路板具有穿过电路层和电路板的导热层的多个通孔，其中每个通孔填充有导热材料。 导热元件放置在电路层上并覆盖通孔，LED芯片设置在导热元件上并与电路层电连接。

公开(公告)号：US20060157853A1

公开(公告)日：2006-07-20

申请号：US11085097

申请日：2005-03-22

Applicant: Ya-Ting Ho ,  Li-Hui Chen

Inventor： Ya-Ting Ho ,  Li-Hui Chen

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H05K3/363 ,  H05K1/0206 ,  H05K1/0212 ,  H05K3/281 ,  H05K3/3494 ,  H05K3/42 ,  H05K2201/09781 ,  H05K2203/0195 ,  Y10T29/49126 ,  Y10T29/49165

Abstract: A thermal bonding structure and manufacture process of a flexible printed circuit (FPC) board are disclosed, and the thermal bonding structure includes a laminated structure having a first insulating layer with a solder pad area and showing parts of a first conductive layer, the first conductive layer, a second insulating layer, a second conductive layer, and a third insulating layer with a bonding area such that a part of the second conductive layer is exposed, and at least a through hole passing through the first conductive layer to the second conductive layer for propagating heat energy to fuse a solder. Accordingly, the reduction of heat energy lost in the third insulating layer improves the bonding quality, shortens the bonding period, and maintains the material stability under high temperature resulted from high heat energy.

Abstract translation: 公开了柔性印刷电路板（FPC）板的热粘合结构和制造工艺，并且热粘合结构包括具有第一绝缘层和焊料区域并且示出第一导电层的部分的叠层结构，第一导电 层，第二绝缘层，第二导电层和具有使第二导电层的一部分露出的接合面积的第三绝缘层，以及至少穿过第一导电层的通孔到第二导电层 用于传播热能以熔化焊料。 因此，第三绝缘层中损失的热能的降低提高了接合质量，缩短了接合时间，并且在由高热能导致的高温下保持材料的稳定性。

公开(公告)号：US20100014015A1

公开(公告)日：2010-01-21

申请号：US12416302

申请日：2009-04-01

Applicant: Ya-Ting Ho ,  Chi-Chih Chu ,  Keng-Ju Liu

Inventor： Ya-Ting Ho ,  Chi-Chih Chu ,  Keng-Ju Liu

IPC: G02F1/1335 ,  G09F13/04

CPC classification number: G02F1/133605 ,  G02F2202/22 ,  G09F13/04 ,  G09F13/14

Abstract: A backlight module and a display panel device using the same are provided. The backlight module includes a light source module, an open frame, and a reflector sheet. The open frame is disposed around the light source module and has a first free-end and a second free-end. A space interval exists between the first and second free-ends. The reflector sheet is disposed on a rear side of the light source module and has a body and a sidewall. The sidewall corresponds to the space interval between the first and second free-ends and extends over the light source module. The display panel further includes a liquid crystal display panel (LCD panel) on the light source module and a front frame which is disposed on the LCD panel enclosing a lateral side of the LCD panel. The sidewall of the reflector sheet extends between the lateral side of the LCD panel and the front frame to provide insulation.

Abstract translation: 提供背光模块和使用其的显示面板装置。 背光模块包括光源模块，开放框架和反射板。 开放框架设置在光源模块周围，并且具有第一自由端和第二自由端。 在第一和第二自由端之间存在空间间隔。 反射片设置在光源模块的后侧，具有主体和侧壁。 侧壁对应于第一自由端和第二自由端之间的间隔，并且在光源模块上延伸。 显示面板还包括在光源模块上的液晶显示面板（LCD面板）和设置在LCD面板上的前框架，该框架包围LCD面板的侧面。 反射片的侧壁在LCD面板的侧面和前框架之间延伸以提供绝缘。

公开(公告)号：US20080209717A1

公开(公告)日：2008-09-04

申请号：US12081792

申请日：2008-04-22

Applicant: Ya-Ting Ho ,  Li-Hui Chen

Inventor： Ya-Ting Ho ,  Li-Hui Chen

IPC: H05K3/00 ,  H05K3/36

CPC classification number: H05K3/363 ,  H05K1/0206 ,  H05K1/0212 ,  H05K3/281 ,  H05K3/3494 ,  H05K3/42 ,  H05K2201/09781 ,  H05K2203/0195 ,  Y10T29/49126 ,  Y10T29/49165

Abstract: A thermal bonding structure and manufacture process of a flexible printed circuit (FPC) board are disclosed, and the thermal bonding structure includes a laminated structure having a first insulating layer with a solder pad area and showing parts of a first conductive layer, the first conductive layer, a second insulating layer, a second conductive layer, and a third insulating layer with a bonding area such that a part of the second conductive layer is exposed, and at least a through hole passing through the first conductive layer to the second conductive layer for propagating heat energy to fuse a solder. Accordingly, the reduction of heat energy lost in the third insulating layer improves the bonding quality, shortens the bonding period, and maintains the material stability under high temperature resulted from high heat energy.

Abstract translation: 公开了柔性印刷电路板（FPC）板的热粘合结构和制造工艺，并且热粘合结构包括具有第一绝缘层和焊料区域并且示出第一导电层的部分的叠层结构，第一导电 层，第二绝缘层，第二导电层和具有使第二导电层的一部分露出的接合面积的第三绝缘层，以及至少穿过第一导电层的通孔到第二导电层 用于传播热能以熔化焊料。 因此，第三绝缘层中损失的热能的降低提高了接合质量，缩短了接合时间，并且在由高热能导致的高温下保持材料的稳定性。

公开(公告)号：US07505109B2

公开(公告)日：2009-03-17

申请号：US11476484

申请日：2006-06-28

Applicant: Chi-Chen Cheng ,  Ya-Ting Ho ,  Meng-Chai Wu

Inventor： Chi-Chen Cheng ,  Ya-Ting Ho ,  Meng-Chai Wu

IPC: G02F1/1333 ,  G02F1/1335

CPC classification number: G02B6/0085 ,  F21K9/00 ,  F21V29/70 ,  F21V29/83 ,  G02B6/0073 ,  H05K1/0206 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/0209 ,  H05K2201/10106

Abstract: The heat dissipation structure of the backlight module of the present invention comprises a circuit board, a heat-conductive element (such as thermally conductive glue) and a light-emitting diode (LED) chip, wherein the circuit board has an electric circuit layer and a heat conductive layer respectively formed on two opposite surfaces thereof. The circuit board has a plurality of through holes penetrating through the electric circuit layer and the heat-conductive layer of the circuit board, wherein each of the through holes is filled with heat-conductive material. The heat-conductive element is placed on the circuit layer and covers the through holes, and the LED chip is disposed on the heat-conductive element and is electrically connected to the electric circuit layer.

Abstract translation: 本发明的背光模块的散热结构包括电路板，导热性胶（例如导热胶）和发光二极管（LED）芯片，其中电路板具有电路层和 分别形成在其两个相对表面上的导热层。 电路板具有穿过电路层和电路板的导热层的多个通孔，其中每个通孔填充有导热材料。 导热元件放置在电路层上并覆盖通孔，LED芯片设置在导热元件上并与电路层电连接。

公开(公告)号：US20060072345A1

公开(公告)日：2006-04-06

申请号：US11024136

申请日：2004-12-28

Applicant: Ya-Ting Ho ,  Tsung-Hsun Hsieh

Inventor： Ya-Ting Ho ,  Tsung-Hsun Hsieh

IPC: F21V7/04

CPC classification number: G02B6/009 ,  G02B6/0046 ,  G02B6/0071 ,  G02F1/133308 ,  G02F1/133615 ,  G02F2001/133317

Abstract: Flat panel display. A flat panel display comprises a first case, a second case connected to the first case, a light guide unit disposed between the first and second cases, a flat display panel and a light assembly. The light guide unit includes a light incident surface. The flat display panel includes a display surface between the first case and the light guide unit. A recess, formed by the light incident surface and the first and second cases, includes an opening toward a direction substantially parallel to the display surface. The light assembly is fixed in the recess, comprising a third case and a light source disposed in the third case.

Abstract translation: 平板显示器。 平板显示器包括第一壳体，连接到第一壳体的第二壳体，布置在第一壳体和第二壳体之间的导光单元，平面显示面板和灯组件。 导光单元包括光入射表面。 平面显示面板包括在第一壳体和导光单元之间的显示面。 由光入射表面和第一和第二壳体形成的凹部包括朝向基本上平行于显示表面的方向的开口。 灯组件固定在凹部中，包括设置在第三壳体中的第三壳体和光源。