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公开(公告)号：US20210263350A1
公开(公告)日：2021-08-26
申请号：US17302905
申请日：2021-05-14
Applicant: Cisco Technology, Inc.
Inventor： Jock T. BOVINGTON
Abstract: Thermal isolation elements are provided in wafer-bonded silicon photonics that include a photonic platform, including a heating element and an optical waveguide that are disposed between a first surface and a second surface (opposite to the first surface) of the photonic platform; a substrate, including a third surface and a fourth surface (opposite to the third surface); wherein the first surface of the photonic platform is bonded to the third surface of the substrate; and wherein a cavity is defined by a trench in one or more of: the first surface and extending towards, but not reaching, the second surface, and the third surface and extending towards, but not reaching, the fourth surface; wherein the cavity is filled with a gas of a known composition at a predefined pressure; and wherein the cavity is aligned with the optical waveguide and the heating element.
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公开(公告)号：US20210223487A1
公开(公告)日：2021-07-22
申请号：US17301407
申请日：2021-04-01
Applicant: Cisco Technology, Inc.
Inventor： Vipulkumar PATEL , Kumar Satya Harinadh POTLURI , Jock T. BOVINGTON , Ashley J. MAKER
Abstract: A fiber array unit (FAU) includes a substrate, a plurality of optical fibers, and a lid. The substrate includes: an optical window extending through a layer of non-transparent material, a plurality of grooves, and an alignment protrusion configured to mate with an alignment receiver. The plurality of optical fibers are disposed in the plurality of grooves. The alignment protrusion is configured to align the plurality of optical fibers with an external device when mated with the alignment receiver. The plurality of optical fibers is disposed between the lid and the substrate.
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公开(公告)号：US20200220329A1
公开(公告)日：2020-07-09
申请号：US16242984
申请日：2019-01-08
Applicant: Cisco Technology, Inc.
Inventor： Dominic F. SIRIANI , Jock T. BOVINGTON , Matthew J. TRAVERSO
Abstract: An optical apparatus comprises a semiconductor substrate and a slab-coupled optical waveguide (SCOW) emitter disposed on the semiconductor substrate. The SCOW emitter comprises an optical waveguide comprising: a first region doped with a first conductivity type; a second region doped with a different, second conductivity type; and an optically active region disposed between the first region and the second region. The optically active region comprises a plurality of quantum dots.
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24.发明申请公开(公告)号：US20200049890A1
公开(公告)日：2020-02-13
申请号：US16058608
申请日：2018-08-08
Applicant: Cisco Technology, Inc.
Inventor： Vipulkumar PATEL , Matthew J. TRAVERSO , Ashley J. MAKER , Jock T. BOVINGTON
IPC: G02B6/30
Abstract: By determining an alignment point for a photonic element in a substrate of a given material; applying, via a laser aligned with the photonic element according to the alignment point, an etching pattern to the photonic element to produce a patterned region and an un-patterned region in the photonic element, wherein applying the etching pattern alters a chemical bond in the given material for the patterned region of the photonic element that increases a reactivity of the given material to an etchant relative to a reactivity of the un-patterned region, and wherein the patterned region defines an engagement feature in the un-patterned region that is configured to engage with a mating feature on a Photonic Integrated Circuit (PIC); and removing the patterned region from the photonic element via the etchant, various systems and methods may make use of laser patterning in optical components to enable alignment of optics to chips.
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公开(公告)号：US20240295694A1
公开(公告)日：2024-09-05
申请号：US18177552
申请日：2023-03-02
Applicant: Cisco Technology, Inc.
Inventor： Jock T. BOVINGTON , Mark C. NOWELL , Matthew J. TRAVERSO , Long CHEN
CPC classification number: G02B6/126 , G02B6/2766 , G02B6/2773
Abstract: A system, method, and photonic chip for an optical circulator are described. The system includes a first polarization splitter, a first optical circuit, and a first controller. The first polarization splitter receives, at a first port of the first polarization splitter, a first optical signal. The first optical circuit is optically coupled to the first polarization splitter. The first optical circuit includes a first plurality of phase shifters. The first optical circuit receives, at a first port of the first optical circuit, a second optical signal. The first controller adjusts the first plurality of phase shifters such that the first optical circuit outputs the first optical signal at a second port of the first optical circuit and such that the first polarization splitter outputs the second optical signal at the first port of the first polarization splitter.
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Patent Agency Ranking
公开(公告)号：US20220404649A1
公开(公告)日：2022-12-22
申请号：US17821067
申请日：2022-08-19
Applicant: Cisco Technology, Inc.
Inventor： Jock T. BOVINGTON
Abstract: Thermal isolation elements are provided in wafer-bonded silicon photonics that include a photonic platform, including a heating element and an optical waveguide that are disposed between a first surface and a second surface (opposite to the first surface) of the photonic platform; a substrate, including a third surface and a fourth surface (opposite to the third surface); wherein the first surface of the photonic platform is bonded to the third surface of the substrate; and wherein a cavity is defined by a trench in one or more of: the first surface and extending towards, but not reaching, the second surface, and the third surface and extending towards, but not reaching, the fourth surface; wherein the cavity is filled with a gas of a known composition at a predefined pressure; and wherein the cavity is aligned with the optical waveguide and the heating element.
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公开(公告)号：US20220368102A1
公开(公告)日：2022-11-17
申请号：US17302964
申请日：2021-05-17
Applicant: Cisco Technology, Inc.
Inventor： Norbert SCHLEPPLE , Jock T. BOVINGTON , Mary NADEAU , Mittu PANNALA , Jarrett S. NEIMAN
IPC: H01S5/024 , H01S5/02 , H01S5/02326
Abstract: Heatsinking in laser devices may be improved via a device, including: a header disk having a first face with a circumference; a header post that is thermally conductive, and having: a second face connected to the first face coterminously with the circumference; a third face opposite to the second face; and a fourth face perpendicular to the second face and the third face; a lens holder, having a fifth face connected to the third face; and an optical subassembly connected to the fourth face and optically aligned with the lens holder. The device may also be understood to comprise: a header disk having a circumference; a header post that is thermally conductive, the header post having: an arc coterminous to a portion of the circumference; a mounting face, perpendicular to a plane in which the arc and the circumference are defined; and a bonding face perpendicular to the mounting face.
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公开(公告)号：US20220236477A1
公开(公告)日：2022-07-28
申请号：US17446013
申请日：2021-08-26
Applicant: Cisco Technology, Inc.
Inventor： Jock T. BOVINGTON , Matthew J. TRAVERSO , Mark C. NOWELL
Abstract: Aspects include a pluggable optical device and related optical system. The pluggable optical device comprises a housing, a printed circuit board (PCB) within the housing, and one or more blind mate optical connectors attached to the PCB along a first end of the PCB. The pluggable optical device further comprises one or more electrical contacts of the PCB near the first end, one or more external optical connectors arranged near a second end of the PCB opposite the first end, and one or more optical components attached to the PCB and included in optical paths extending between the one or more external optical connectors and the one or more blind mate optical connectors.
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公开(公告)号：US20210359490A1
公开(公告)日：2021-11-18
申请号：US17444202
申请日：2021-08-02
Applicant: Cisco Technology, Inc.
Inventor： Jock T. BOVINGTON , Vipulkumar K. PATEL , Dominic F. SIRIANI
Abstract: A laser integrated photonic platform to allow for independent fabrication and development of laser systems in silicon photonics. The photonic platform includes a silicon substrate with an upper surface, one or more through silicon vias (TSVs) defined through the silicon substrate, and passive alignment features in the substrate. The photonic platform includes a silicon substrate wafer with through silicon vias (TSVs) defined through the silicon substrate, and passive alignment features in the substrate for mating the photonic platform to a photonics integrated circuit. The photonic platform also includes a III-V semiconductor material structure wafer, where the III-V wafer is bonded to the upper surface of the silicon substrate and includes at least one active layer forming a light source for the photonic platform.
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公开(公告)号：US20210265806A1
公开(公告)日：2021-08-26
申请号：US17302099
申请日：2021-04-23
Applicant: Cisco Technology, Inc.
Inventor： Dominic F. SIRIANI , Jock T. BOVINGTON , Vipulkumar K. PATEL
Abstract: Embodiments provide for selective-area growth of III-V materials for integration with silicon photonics. The resulting platform includes a substrate; an insulator, extending a first distance from the substrate, including a passive optical component at a second distance from the substrate less than the first distance, and defining a pit extending to the substrate; and a III-V component, extending from the substrate within in the pit defined in the insulator, the III-V component including a gain medium included at the second distance from the substrate and optically coupled with the passive optical component. The pit may define an Optical Coupling Interface between the III-V component and the passive optical component, or a slit defined between the III-V component and the passive optical component may define the Optical Coupling Interface.
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