Self-aligning connectorized fiber array assembly
    21.
    发明授权
    Self-aligning connectorized fiber array assembly 有权
    自对准连接器光纤阵列组件

    公开(公告)号:US08876410B2

    公开(公告)日:2014-11-04

    申请号:US13737080

    申请日:2013-01-09

    Abstract: An apparatus for providing self-aligned optical coupling between an opto-electronic substrate and a fiber array, where the substrate is enclosed by a transparent lid such that the associated optical signals enter and exit the arrangement through the transparent lid. The apparatus takes the form of a two-part connectorized fiber array assembly where the two pieces uniquely mate to form a self-aligned configuration. A first part, in the form of a plate, is attached to the transparent lid in the area where the optical signals pass through. The first plate includes a central opening with inwardly-tapering sidewalls surrounding its periphery. A second plate is also formed to include a central opening and has a lower protrusion with inwardly-tapering sidewalls that mate with the inwardly-tapering sidewalls of the first plate to form the self-aligned connectorized fiber array assembly. The fiber array is then attached to the second plate in a self-aligned fashion.

    Abstract translation: 一种用于在光电子基板和光纤阵列之间提供自对准光耦合的装置,其中基板由透明盖包围,使得相关联的光信号通过透明盖进入和离开布置。 该装置采取两部分连接的光纤阵列组件的形式,其中两个部件独特地配合以形成自对准配置。 在光信号通过的区域中,透明盖附着有板的形式的第一部分。 第一板包括具有围绕其周边的向内逐渐变细的侧壁的中心开口。 第二板也形成为包括中心开口并且具有下突起,其具有向内渐缩的侧壁,与第一板的向内渐缩的侧壁配合形成自对准的连接纤维阵列组件。 然后将纤维阵列以自对准的方式附接到第二板。

    Lid Design to Seal Optical Components of a Transceiver Module
    22.
    发明申请
    Lid Design to Seal Optical Components of a Transceiver Module 有权
    封装设计封装收发模块的光学元件

    公开(公告)号:US20140043685A1

    公开(公告)日:2014-02-13

    申请号:US13678915

    申请日:2012-11-16

    CPC classification number: G02B27/0006 G02B6/4257 Y10T156/10

    Abstract: Techniques and configurations are provided for packaging optoelectronic devices. In particular, a lid component of an optoelectronic device is provided, and the lid component is configured to cover active components of the optoelectronic device. An optically transparent wall is also provided. The optically transparent wall is coated with an anti-reflective material and configured to interface with a section of the lid component. The optically transparent wall is joined with the section of the lid component such that the optically transparent wall and the lid provide a seal for the active components of the optoelectronic device. Additionally, the lid component has a top surface and a plurality of side surfaces that are coupled to the top surface. An optically transparent wall coated with an anti-reflective material adhesively joins to the top surface and one or more side surfaces.

    Abstract translation: 提供了用于封装光电器件的技术和配置。 特别地,提供了光电子器件的盖部件,并且盖部件构造成覆盖光电子器件的有源部件。 还提供了光学透明的壁。 光学透明壁涂有抗反射材料并且被配置为与盖部件的一部分相接合。 光学透明壁与盖部件的部分连接,使得光学透明壁和盖为光电器件的有源部件提供密封。 此外,盖部件具有联接到顶表面的顶表面和多个侧表面。 涂有抗反射材料的光学透明壁粘合地连接到顶表面和一个或多个侧表面。

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