公开(公告)号：US20160168428A1

公开(公告)日：2016-06-16

申请号：US14904456

申请日：2014-07-28

Applicant: DEXERIALS CORPORATION

Inventor： Seiichiro SHINOHARA

IPC: C09J9/02 ,  H01R4/04 ,  H05K3/30 ,  C09J7/00

CPC classification number: C09J9/02 ,  C08K3/04 ,  C08K3/08 ,  C08K2201/001 ,  C09J7/00 ,  C09J7/10 ,  C09J11/04 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  H01R4/04 ,  H01R12/62 ,  H01R43/007 ,  H05K3/303 ,  H05K3/323 ,  H05K2201/0224 ,  H05K2203/0139 ,  H05K2203/0278

Abstract: A step of scattering electrically conductive particles on a wiring board having wiring that is formed in accordance with an array pattern of the electrically conductive particles and prevented from being charged, and charging the electrically conductive particles; a step of aligning the charged electrically conductive particles in a predetermined array pattern corresponding to the wiring pattern by moving a squeegee on the wiring board; and a step of bonding a transfer film having an adhesive material layer formed thereon to the wiring board and transferring the electrically conductive particles aligned in a predetermined array pattern to the adhesive layer.

Abstract translation: 在具有根据导电颗粒的阵列图案形成并且防止带电的布线的布线板上散射导电颗粒并对导电颗粒进行充电的步骤; 通过移动所述布线板上的刮板将与所述布线图形对应的预定阵列图案对准所述带电的导电粒子的步骤; 以及将其上形成有粘合剂材料层的转移膜接合到所述布线板并将以预定阵列图案对准的导电颗粒转印到所述粘合剂层的步骤。