公开(公告)号：US20220199542A1

公开(公告)日：2022-06-23

申请号：US17554036

申请日：2021-12-17

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Yoon Ho HUH ,  Young Ju KIM ,  Young Su LEE

IPC: H01L23/538 ,  H01Q1/24 ,  H01L23/66 ,  G09F9/30

Abstract: An antenna structure according to an embodiment of the present disclosure includes a passivation layer, an antenna unit at least partially embedded in an upper portion of the passivation layer, and an insulating layer disposed on a top surface of the passivation layer to cover the antenna unit. A spatial efficiency of the antenna structure is improved and a thickness of the image display device is reduced to improve a bending property.

公开(公告)号：US20230092067A1

公开(公告)日：2023-03-23

申请号：US18070704

申请日：2022-11-29

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Na Yeon KIM ,  Young Ju KIM ,  Byung Jin CHOI

IPC: H01Q1/24 ,  H01Q1/48 ,  H01Q21/08 ,  H01Q1/52 ,  H01Q1/38 ,  H05K1/02

Abstract: An antenna package according to an embodiment includes an antenna unit and a circuit board bonded to the antenna unit. The circuit board includes a core layer comprising a plurality of portions having different widths from each other in a planar view, the core layer having a first surface and a second surface opposing each other, and a circuit wiring disposed on the first surface of the core layer and electrically connected to the antenna unit.

公开(公告)号：US20230052259A1

公开(公告)日：2023-02-16

申请号：US17977205

申请日：2022-10-31

Applicant: DONGWOO FINE-CHEM CO., LTD. ,  POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION

Inventor： Byung Jin CHOI ,  Na Yeon KIM ,  Young Ju KIM ,  Won Bin HONG

IPC: H01Q5/35 ,  H01Q9/04 ,  H01Q1/24

Abstract: An antenna package according to an embodiment includes an antenna unit including a radiator, a transmission line extending from the radiator and an antenna ground pad disposed around the transmission line, and a circuit board electrically connected to the antenna unit. The circuit board includes a core layer, a circuit wiring layer disposed on one surface of the core layer, the circuit wiring layer including a signal transmission wiring electrically connected to the transmission line of the antenna unit and a first ground pattern bonded to the antenna ground pad, and a ground layer disposed on an opposite surface facing the one surface of the core layer. The ground layer does not overlap a portion of the antenna ground pad except for a region bonded to the first ground pattern in a planar view.

公开(公告)号：US20220416410A1

公开(公告)日：2022-12-29

申请号：US17848888

申请日：2022-06-24

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Young Ju KIM ,  Yoon Ho HUH ,  Hee Jun PARK ,  Young Su LEE ,  In Kak SONG ,  Dong Pil PARK

IPC: H01Q1/42 ,  H01Q1/22 ,  H01Q1/38

Abstract: An antenna structure according to an embodiment of the present invention includes a first antenna unit including a first radiator, a first transmission line connected to the first radiator, and a guide pattern disposed around the first transmission line and separated from the first transmission line, a second antenna unit at least partially covered by the guide pattern of the first antenna unit in a plan view, and a dielectric layer interposed between the first antenna unit and the second antenna unit. An antenna structure implementing low-frequency and high-frequency properties with high reliability is provided.

公开(公告)号：US20220229472A1

公开(公告)日：2022-07-21

申请号：US17577723

申请日：2022-01-18

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Won Hee LEE ,  Young Ju KIM ,  Yun Seok OH

IPC: G06F1/16 ,  H01Q1/22 ,  H01Q1/38

Abstract: An antenna package according to an embodiment of the present disclosure includes an antenna device including an antenna unit that includes a first radiator, and an intermediate circuit board coupled to the antenna device to be electrically connected to the antenna unit. The intermediate circuit board includes a core layer, a first feeding wiring formed on one surface of the core layer and electrically connected to the antenna unit, and a second radiator formed on the one surface of the core layer. A radiation coverage is expanded using an antenna included in the intermediate circuit board.