公开(公告)号：US20230019158A1

公开(公告)日：2023-01-19

申请号：US17862919

申请日：2022-07-12

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Na Yeon KIM ,  Young Ju KIM ,  Yoon Ho HUH

IPC: H01Q1/52 ,  H01Q1/22

Abstract: An antenna package according to an embodiment of the present disclosure includes an antenna device including an antenna unit, a first circuit board including a first core layer having a first surface and a second surface opposite to each other, a signal wiring extending on the first surface of the first core layer to be electrically connected to the antenna unit, and a first via structure penetrating through the first core layer, and a first connector mounted on the second surface of the first core layer, the first connector including a first terminal electrically connected to the antenna unit and the first via structure.

公开(公告)号：US20220312594A1

公开(公告)日：2022-09-29

申请号：US17838374

申请日：2022-06-13

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Dong Pil PARK ,  Byung Jin CHOI ,  Na Yeon KIM

IPC: H05K1/18 ,  H05K1/02

Abstract: A printed circuit board according to an embodiment of the present invention includes a core layer and a circuit wiring layer disposed on a top surface of the core layer. The core layer is spaced apart from the circuit wiring layer and includes through-holes formed around the circuit wiring layer. Flexibility of the printed circuit board may be enhanced by the through-hole to obtain bending stability.

公开(公告)号：US20220158328A1

公开(公告)日：2022-05-19

申请号：US17525016

申请日：2021-11-12

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Na Yeon KIM ,  Young Ju KIM ,  Won Hee LEE

IPC: H01Q1/22 ,  H01Q1/48

Abstract: An antenna package according to an embodiment of the present disclosure includes an antenna device including an antenna unit, and a flexible circuit board electrically connected to the antenna unit. The flexible circuit board has a bending area. The flexible circuit board includes a core layer having a first surface and a second surface facing each other, a signal wiring disposed on the first surface of the core layer and electrically connected to the antenna unit, a ground line disposed on the first surface of the core layer to be spaced apart from the signal wiring, a ground layer disposed on the second surface of the core layer, and a via structure penetrating a portion of the core layer in a region excluding the bending area and connecting the ground line and the ground layer with each other.

公开(公告)号：US20230246330A1

公开(公告)日：2023-08-03

申请号：US18100704

申请日：2023-01-24

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Na Yeon KIM ,  Sung Hoe KIM ,  Dae Kyu KIM ,  Byung Eun JEON

IPC: H01Q1/38 ,  H01Q1/24 ,  H01Q1/46 ,  H01Q1/50

CPC classification number: H01Q1/38 ,  H01Q1/243 ,  H01Q1/46 ,  H01Q1/50 ,  H01Q21/0006

Abstract: An antenna package includes an antenna device including an antenna dielectric layer and an antenna unit formed on the antenna dielectric layer, and an intermediate circuit board electrically connected to the antenna unit. The intermediate circuit board includes a core layer and a signal line formed on a surface of the core layer and electrically connected to the antenna unit. A width of one end portion of the signal line connected to the antenna unit is smaller than a width of the other end portion opposite to the one end portion of the signal line. Impedance mismatching is prevented by the construction of the signal line to improve antenna properties.

公开(公告)号：US20230019483A1

公开(公告)日：2023-01-19

申请号：US17862868

申请日：2022-07-12

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Na Yeon KIM ,  Young Ju KIM ,  Hee Jun PARK ,  Won Hee LEE

IPC: H05K1/02 ,  H01Q1/24 ,  H01Q9/04 ,  H01Q21/08 ,  H01R13/646

Abstract: A package board according to an embodiment of the present disclosure includes a first core layer, a feeding wiring disposed on the first core layer, and a first connector mounted on the first core layer and electrically connected to the feeding wiring through a row directional side thereof The feeding wiring includes a first portion extending in a column direction of the first core layer and a second portion bent from the first portion to extend in a row direction of the first core layer.

公开(公告)号：US20220263276A1

公开(公告)日：2022-08-18

申请号：US17673048

申请日：2022-02-16

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Young Ju KIM ,  Byung Jin CHOI ,  Han Sub RYU ,  Na Yeon KIM ,  Dong Pil PARK ,  Jae Hyun LEE

IPC: H01R13/6585 ,  H01Q1/52 ,  H01Q1/22 ,  H01R12/70 ,  H01R12/79

Abstract: A connector structure according to an embodiment of the present disclosure includes a second connector and a first connector coupled to the second connector. The first connector includes a first insulator, a first conductive connection terminal disposed on the first insulator, a second conductive connection terminal spaced apart from the first conductive connection terminal to form a single row structure on the first insulator together with the first conductive connection terminal, and a first barrier structure disposed between the first conductive connection terminal and the second conductive connection terminal on the first insulator.

公开(公告)号：US20220216596A1

公开(公告)日：2022-07-07

申请号：US17568198

申请日：2022-01-04

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Han Sub RYU ,  Na Yeon KIM ,  Byung Jin CHOI

IPC: H01Q1/24 ,  H01Q9/04 ,  H01Q21/08 ,  H05K1/02

Abstract: An antenna structure according to an embodiment of the present invention includes a dielectric layer, a radiator disposed on the dielectric layer, a transmission line branching from the radiator, a signal pad electrically connected to the radiator through the transmission line on the dielectric layer, and an external circuit structure bonded to the signal pad. The signal pad includes a bonding region that is bonded to the external circuit structure and a margin region that is not bonded to the external circuit structure and is adjacent to the bonding region. An area ratio of the margin region relative to the bonding region in the signal pad is 0.05 or more and less than 0.5.

公开(公告)号：US20220216587A1

公开(公告)日：2022-07-07

申请号：US17569772

申请日：2022-01-06

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Byung Jin CHOI ,  Na Yeon KIM ,  Han Sub RYU ,  Dong Pil PARK

IPC: H01Q1/22 ,  H01Q1/38 ,  H01Q1/44

Abstract: An antenna package according to an embodiment of the present disclosure includes a first antenna device including a first antenna unit, a first circuit board electrically connected to the first antenna unit, a second circuit board electrically connected to the first circuit board, a second antenna unit integrated with the second circuit board, and an antenna driving integrated circuit chip mounted on the second circuit board and electrically connected to the first antenna unit and the second antenna unit. Multi-axial radiation is implemented using the antenna package with high efficiency and reliability.

公开(公告)号：US20220158329A1

公开(公告)日：2022-05-19

申请号：US17526240

申请日：2021-11-15

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Byung Jin CHOI ,  Na Yeon KIM ,  Young Ju KIM ,  Han Sub RYU

IPC: H01Q1/22 ,  H01Q1/24

Abstract: An antenna package according to an embodiment of the present disclosure includes an antenna device including an antenna unit, and a first circuit board electrically connected to the antenna device. The first circuit board includes a first core layer, a first circuit wiring layer formed on one surface of the first core layer and electrically connected to the antenna unit, a first connector connected to an end portion of the first circuit wiring layer on the one surface of the first core layer, and a first shielding barrier disposed on the other surface opposite to the one surface of the first core layer. The first shielding barrier at least partially covers the first connector in a planar view.

公开(公告)号：US20230369745A1

公开(公告)日：2023-11-16

申请号：US18196063

申请日：2023-05-11

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Won Hee LEE ,  Na Yeon KIM ,  Dae Kyu KIM

IPC: H01Q1/24 ,  H01Q21/08 ,  H01Q9/04 ,  H01Q1/48

CPC classification number: H01Q1/243 ,  H01Q1/48 ,  H01Q9/045 ,  H01Q21/08

Abstract: A circuit board for an antenna according to an embodiment includes a core layer having a first surface and second surface that face each other, a second conductive layer disposed on the second surface of the core layer, and a first conductive layer disposed on the first surface of the core layer. The first conductive layer includes signal wirings, and a co-planar ground spaced apart from the signal wirings in a horizontal direction. The co-planar ground includes a first recess formed between end portions of neighboring signal wirings of the signal wirings.