公开(公告)号：US09169340B2

公开(公告)日：2015-10-27

申请号：US13667722

申请日：2012-11-02

Applicant: Dow Global Technologies LLC

Inventor： Rajen M. Patel ,  Shaofu Wu ,  Mark T. Bernius ,  Mohamed Esseghir ,  Robert L. McGee ,  Michael H. Mazor ,  John A. Naumovitz

IPC: C08F210/02 ,  H01L31/048 ,  B32B17/10

CPC classification number: C08F210/02 ,  B32B17/10018 ,  B32B17/10678 ,  B32B17/10697 ,  H01L31/048 ,  H01L31/0481 ,  Y02E10/50

Abstract: An electronic device module comprises: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer. Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0.90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked.

Abstract translation: 电子设备模块包括：A.至少一个电子设备，例如太阳能电池和B.与电子设备的至少一个表面紧密接触的聚合材料，聚合物材料包含乙烯多嵌段共聚物。 通常，聚烯烃材料是密度小于约0.90克/立方厘米（g / cc）的乙烯多嵌段共聚物。 聚合物材料可以完全封装电子器件，或者它可以层压到器件的一个表面。 任选地，聚合物材料还可以包含焦烧抑制剂，并且该共聚物可以保持未交联或可以交联。