SHEET SET FOR ENCAPSULATING SOLAR CELL, AND SOLAR CELL MODULE
    5.
    发明申请
    SHEET SET FOR ENCAPSULATING SOLAR CELL, AND SOLAR CELL MODULE 审中-公开
    用于封装太阳能电池和太阳能电池模块的表格

    公开(公告)号:US20160254402A1

    公开(公告)日:2016-09-01

    申请号:US15028516

    申请日:2014-10-08

    摘要: Provided is a sheet set for encapsulating a solar cell which is disposed between a light-receiving surface side protective member and a back surface side protective member, and is used for encapsulating a solar cell element and a wiring material. The sheet set for encapsulating a solar cell includes a first encapsulating material sheet disposed on a light-receiving surface side and a second encapsulating material sheet disposed on a back surface side. A storage elastic modulus (P1) of the first encapsulating material sheet before a cross-linking treatment and a storage elastic modulus (P2) of the second encapsulating material sheet before the cross-linking treatment satisfy a relationship of the following Expression (1), at 120° C. when solid viscoelasticity is measured under conditions of a measurement temperature range of 25° C. to 180° C., a frequency of 1.0 Hz, a temperature rising rate of 10° C./minute, and a shear mode. Log(P1/P2)>0  (1)

    摘要翻译: 提供一种用于封装太阳能电池的片材,其设置在受光面侧保护部件和背面侧保护部件之间,用于封装太阳能电池元件和布线材料。 用于封装太阳能电池的片组包括设置在受光面侧的第一封装材料片和设置在背面侧的第二封装材料片。 交联处理前的第一包封材料片的储能弹性模量(P1)和交联处理前的第二包封材料片的储存弹性模量(P2)满足下述式(1), 当在25℃至180℃的测量温度范围,1.0Hz的频率,10℃/分钟的升温速率和剪切模式的条件下测量固体粘弹性时,在120℃ 。 日志(P1 / P2)> 0(1)

    ENCAPSULANT SHEET FOR SOLAR CELL
    6.
    发明申请
    ENCAPSULANT SHEET FOR SOLAR CELL 审中-公开
    太阳能电池的封装

    公开(公告)号:US20160032064A1

    公开(公告)日:2016-02-04

    申请号:US14812209

    申请日:2015-07-29

    发明人: Hiroaki YODA

    IPC分类号: C08J5/18 H01L31/048

    摘要: An encapsulant sheet for a solar cell contains not less than 91% but less than 99% by mass of an ethylene-unsaturated ester copolymer (A), more than 1% but not more than 9% by mass of an olefin resins (B), 0.001 parts to 5 parts by mass of silicon dioxide and 0.001 to 0.5 parts by mass of a silane coupling agent, where the sum total of the content of the ethylene-unsaturated ester copolymer (A) and the content of the olefin resin (B) is taken as 100% by mass. The content of the silicon dioxide and the content of the silane coupling agent are relative to the total content of the ethylene-unsaturated ester copolymer (A) and the content of the olefin resin (B) being taken as 100% by mass. The encapsulant sheet is excellent in insulating property, storage stability, transparency, and durability of adhesion to glass.

    摘要翻译: 用于太阳能电池的密封片包含不少于乙烯 - 不饱和酯共聚物(A)的91%但小于99质量%,烯烃树脂(B)大于1%但不大于9质量% ,0.001〜5质量份的二氧化硅和0.001〜0.5质量份的乙烯 - 不饱和酯共聚物(A)的含量与烯烃系树脂(B)的含量的合计量的硅烷偶联剂 )为100质量%。 二氧化硅的含量和硅烷偶联剂的含量相对于乙烯 - 不饱和酯共聚物(A)的总含量和烯烃树脂(B)的含量为100质量%。 密封片的绝缘性,保存稳定性,透明性和与玻璃的粘合耐久性优异。

    SILANE-CONTAINING ETHYLENE INTERPOLYMER FORMULATION INCLUDING FILMS AND ELECTRONIC DEVICE MODULE COMPRISING SAME
    10.
    发明申请
    SILANE-CONTAINING ETHYLENE INTERPOLYMER FORMULATION INCLUDING FILMS AND ELECTRONIC DEVICE MODULE COMPRISING SAME 有权
    含有乙烯的乙烯嵌段共聚物配方包括膜和包含其的电子器件模块

    公开(公告)号:US20150013753A1

    公开(公告)日:2015-01-15

    申请号:US14371136

    申请日:2013-02-01

    IPC分类号: H01L31/048 C08J5/18

    摘要: Disclosed in more detail in this application are ethylene interpolymer films having one or more layers, comprising surface layer comprising: (A) a silane-containing ethylene interpolymer comprising (1) an ethylene interpolymer having a density of less than 0.905 g/cm3, and (2) at least 0.1 percent by weight alkoxysilane; characterized by: (3) having a volume resistivity of greater than 5×1015 ohm-cm as measured at 60 C. In one embodiment, such ethylene interpolymer has a residual boron content of less than 10 ppm and residual aluminum content of less than 100 ppm. Also disclosed are laminated electronic device modules comprising: A. at least one electronic device, and B. one of the ethylene interpolymer films as described above in intimate contact with at least one surface of the electronic device. Such laminated electronic device modules according to the invention have been shown to suffer reduced potential induced degradation (“PID”).

    摘要翻译: 在本申请中更详细地公开的是具有一层或多层的乙烯互聚物膜,其包含表面层,其包含:(A)含硅烷的乙烯互聚物,其包含(1)密度小于0.905g / cm 3的乙烯互聚物,以及 (2)至少0.1重量%的烷氧基硅烷; 其特征在于:(3)在60℃下测量的体积电阻率大于5×1015欧姆 - 厘米。在一个实施方案中,这种乙烯互聚物的残余硼含量小于10ppm,残余铝含量小于100 ppm。 还公开了层压电子器件模块,其包括:A.至少一个电子器件,以及B.如上所述的乙烯互聚物膜之一,与电子器件的至少一个表面紧密接触。 已经示出了根据本发明的这种层压电子器件模块遭受降低的电位诱导退化(“PID”)。