公开(公告)号：US20150183193A1

公开(公告)日：2015-07-02

申请号：US14423871

申请日：2013-08-28

申请人： Dow Global Technologies LLC ,  Rohm and Haas Company

发明人： Xuming Chen ,  Robert L. McGee ,  David E. Vietti ,  Kevin Miyake ,  Larry F. Brinkman

IPC分类号： B32B27/08 ,  B32B27/40 ,  B32B27/32

CPC分类号： B32B27/08 ,  B32B15/08 ,  B32B15/085 ,  B32B15/09 ,  B32B15/20 ,  B32B27/10 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/40 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2439/70 ,  B32B2439/80 ,  B32B2553/00 ,  Y10T428/31587

摘要： In the construction of a multilayer film in which an ethylene-based polymer layer is joined to one another layer by a polyurethane (PU) adhesive, the rate of cure and the degree of cure of the PU adhesive are accelerated by incorporating into the ethylene-based polymer layer a functional compound with active hydrogens, e.g., a polyol, and/or a cure catalyst, e.g., an amine, zinc or tin-based compound. The catalyst and reactive functionality may be present on the same molecule (e.g. alkoxylated amine or zinc ricinoleate). The catalyst and isocyanate reactive compound will migrate into the PU adhesive over time and accelerate the rate and promote the degree of PU adhesive cure, and the functional compound will promote the migration of the cure catalyst into the PU adhesive. In turn, this accelerated cure inhibits the migration of residual, monomeric amines from the PU adhesive into and through the ethylene-based polymer.

摘要翻译： 在通过聚氨酯（PU）粘合剂将乙烯类聚合物层与另一层接合的多层膜的构造中，PU粘合剂的固化速度和固化程度通过加入到乙烯 - 基于聚合物层的是具有活性氢的官能化合物，例如多元醇和/或固化催化剂，例如胺，锌或锡基化合物。 催化剂和反应性官能团可以存在于相同的分子上（例如烷氧基化胺或蓖麻醇酸锌）。 催化剂和异氰酸酯反应性化合物随时间迁移到PU粘合剂中，加速速率并促进PU粘合剂固化程度，功能化合物将促进固化催化剂迁移到PU粘合剂中。 反过来，这种加速的固化抑制残留的单体胺从PU粘合剂迁移到乙烯基聚合物中并通过乙烯基聚合物。

公开(公告)号：US20130118583A1

公开(公告)日：2013-05-16

申请号：US13667744

申请日：2012-11-02

申请人： Dow Global Technologies LLC

发明人： Rajen M. Patel ,  Shaofu Wu ,  Mark T. Bernius ,  Mohamed Esseghir ,  Robert L. McGee ,  Michael H. Mazor ,  John A. Naumovitz

IPC分类号： H01L31/048 ,  H01L31/18

CPC分类号： H01L31/0481 ,  B32B17/10018 ,  B32B17/10678 ,  B32B2457/12 ,  C08L51/06 ,  H01L31/18 ,  Y02E10/50 ,  C08L2666/02 ,  C08L2666/04

摘要： An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer with at least one of (a) a density of less than about 0.90 g/cc, (b) a 2% secant modulus of less than about 150 megaPascal (mPa) as measured by ASTM D-882-02), (c) a melt point of less than about 95 C, (d) an ∀-olefin content of at least about 15 and less than about 50 wt % based on the weight of the polymer, (e) a Tg of less than about −35 C, and (f) a SCBDI of at least about 50, (2) optionally, free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (3) optionally, a co-agent. Typically, the polyolefin copolymer is an ethylene/∀-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.

摘要翻译： 一种电子设备模块，包括：A.至少一个电子设备，例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合物材料，所述聚合材料包含（1）聚烯烃共聚物， （a）小于约0.90g / cc的密度，（b）通过ASTM D-882-02测量的小于约150兆帕（mPa）的2％割线模量中的至少一个），（c） 熔点小于约95℃，（d）基于聚合物的重量，至少约15至小于约50重量％的烯烃含量，（e）小于约-35℃的Tg， 和（f）至少约50的SCBDI，（2）任选的自由基引发剂，例如过氧化物或偶氮化合物，或光引发剂，例如二苯甲酮，和（3）任选的助剂。 通常，聚烯烃共聚物是乙烯/∀-烯烃共聚物。 任选地，聚合物材料还可以包含乙烯基硅烷和/或焦烧抑制剂，并且共聚物可保持未交联或交联。

公开(公告)号：US20180148525A1

公开(公告)日：2018-05-31

申请号：US15874492

申请日：2018-01-18

申请人： Dow Global Technologies LLC

发明人： Rajen M. Patel ,  Shaofu Wu ,  Mark T. Bernius ,  Mohamed Esseghir ,  Robert L. McGee ,  Michael H. Mazor ,  John Naumovitz

IPC分类号： C08F210/02 ,  H01L31/048 ,  B32B17/10

CPC分类号： C08F210/02 ,  B32B17/10018 ,  B32B17/10678 ,  B32B17/10697 ,  H01L31/048 ,  H01L31/0481 ,  Y02E10/50

摘要： An electronic device module comprises: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer. Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0.90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked.

公开(公告)号：US20130112270A1

公开(公告)日：2013-05-09

申请号：US13667722

申请日：2012-11-02

申请人： Dow Global Technologies LLC

发明人： Rajen M. Patel ,  Shaofu Wu ,  Mark T. Bernius ,  Mohamed Esseghir ,  Robert L. McGee ,  Michael H. Mazor ,  John A. Naumovitz

IPC分类号： C08F210/02 ,  H01L31/048

CPC分类号： C08F210/02 ,  B32B17/10018 ,  B32B17/10678 ,  B32B17/10697 ,  H01L31/048 ,  H01L31/0481 ,  Y02E10/50

摘要： An electronic device module comprises: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer. Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0.90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked.

摘要翻译： 电子设备模块包括：A.至少一个电子设备，例如太阳能电池和B.与电子设备的至少一个表面紧密接触的聚合材料，聚合物材料包含乙烯多嵌段共聚物。 通常，聚烯烃材料是密度小于约0.90克/立方厘米（g / cc）的乙烯多嵌段共聚物。 聚合物材料可以完全封装电子器件，或者它可以层压到器件的一个表面。 任选地，聚合物材料还可以包含焦烧抑制剂，并且该共聚物可以保持未交联或可以交联。

公开(公告)号：US10160186B2

公开(公告)日：2018-12-25

申请号：US15505426

申请日：2015-08-25

申请人： Dow Global Technologies LLC

发明人： Bruce A. Menning ,  Robert L. McGee ,  Patrick Chang Dong Lee ,  Rajen M. Patel

IPC分类号： B32B27/08 ,  B32B27/30 ,  B32B27/32 ,  B32B27/20

摘要： The present disclosure provides a coextruded multilayer film. The coextruded multilayer film includes a core component having from 10 to 1000 alternating layers of layer A and layer B. Layer A has a thickness from 30 nm to 1000 nm and includes a polymer selected from an ethylene/a-olefin copolymer, an ethylene vinyl acetate polymer (EVA), an ethylene methyl-acrylate copolymer (EMA), an ethylene n-butyl acetate polymer (EnBA), and combinations thereof. Layer B has a thickness from 30 nm to 1000 nm. Layer B is a blend composed of (i) a polymer selected from an ethylene-based polymer, an EVA, an EMA, an EnBA, and combinations thereof, and (ii) a particulate filler material. The core component has a water vapor transmission rate from 50 to less than 500 g-mil/m2/24 hr and a carbon dioxide transmission rate from 50,000 to 300,000 cc-mil/m2/24 hr/atm.

公开(公告)号：US20170239921A1

公开(公告)日：2017-08-24

申请号：US15505426

申请日：2015-08-25

申请人： Dow Global Technologies LLC

发明人： Bruce A. Menning ,  Robert L. McGee ,  Patrick Chang Dong Lee ,  Rajen M. Patel

IPC分类号： B32B27/08 ,  B32B27/30 ,  B32B27/32 ,  B32B27/20

CPC分类号： B32B27/08 ,  B32B27/20 ,  B32B27/205 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B2307/724 ,  B32B2410/00 ,  B32B2439/70

摘要： The present disclosure provides a coextruded multilayer film. The coextruded multilayer film includes a core component having from 10 to 1000 alternating layers of layer A and layer B. Layer A has a thickness from 30 nm to 1000 nm and includes a polymer selected from an ethylene/a-olefin copolymer, an ethylene vinyl acetate polymer (EVA), an ethylene methyl-acrylate copolymer (EMA), an ethylene n-butyl acetate polymer (EnBA), and combinations thereof. Layer B has a thickness from 30 nm to 1000 nm. Layer B is a blend composed of (i) a polymer selected from an ethylene-based polymer, an EVA, an EMA, an EnBA, and combinations thereof, and (ii) a particulate filler material. The core component has a water vapor transmission rate from 50 to less than 500 g-mil/m2/24 hr and a carbon dioxide transmission rate from 50,000 to 300,000 cc-mil/m2/24 hr/atm.

公开(公告)号：US09169340B2

公开(公告)日：2015-10-27

申请号：US13667722

申请日：2012-11-02

申请人： Dow Global Technologies LLC

发明人： Rajen M. Patel ,  Shaofu Wu ,  Mark T. Bernius ,  Mohamed Esseghir ,  Robert L. McGee ,  Michael H. Mazor ,  John A. Naumovitz

IPC分类号： C08F210/02 ,  H01L31/048 ,  B32B17/10

CPC分类号： C08F210/02 ,  B32B17/10018 ,  B32B17/10678 ,  B32B17/10697 ,  H01L31/048 ,  H01L31/0481 ,  Y02E10/50

摘要： An electronic device module comprises: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer. Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0.90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked.

摘要翻译： 电子设备模块包括：A.至少一个电子设备，例如太阳能电池和B.与电子设备的至少一个表面紧密接触的聚合材料，聚合物材料包含乙烯多嵌段共聚物。 通常，聚烯烃材料是密度小于约0.90克/立方厘米（g / cc）的乙烯多嵌段共聚物。 聚合物材料可以完全封装电子器件，或者它可以层压到器件的一个表面。 任选地，聚合物材料还可以包含焦烧抑制剂，并且该共聚物可以保持未交联或可以交联。

公开(公告)号：US08592679B2

公开(公告)日：2013-11-26

申请号：US13667744

申请日：2012-11-02

申请人： Dow Global Technologies LLC

发明人： Rajen M. Patel ,  Shaofu Wu ,  Mark T. Bernius ,  Mohamed Esseghir ,  Robert L. McGee ,  Michael H. Mazor ,  John A. Naumovitz

IPC分类号： H01L31/042 ,  H02N6/00 ,  H01L31/00

CPC分类号： H01L31/0481 ,  B32B17/10018 ,  B32B17/10678 ,  B32B2457/12 ,  C08L51/06 ,  H01L31/18 ,  Y02E10/50 ,  C08L2666/02 ,  C08L2666/04

摘要： An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer with at least one of (a) a density of less than about 0.90 g/cc, (b) a 2% secant modulus of less than about 150 megaPascal (mPa) as measured by ASTM D-882-02), (c) a melt point of less than about 95 C, (d) an ∀-olefin content of at least about 15 and less than about 50 wt % based on the weight of the polymer, (e) a Tg of less than about −35 C, and (f) a SCBDI of at least about 50, (2) optionally, free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (3) optionally, a co-agent. Typically, the polyolefin copolymer is an ethylene/∀-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.

摘要翻译： 一种电子设备模块，包括：A.至少一个电子设备，例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合材料，所述聚合材料包含（1）聚烯烃共聚物， （a）小于约0.90g / cc的密度，（b）通过ASTM D-882-02测量的小于约150兆帕（mPa）的2％割线模量中的至少一个），（c） 熔点小于约95℃，（d）基于聚合物的重量，至少约15至小于约50重量％的烯烃含量，（e）小于约-35℃的Tg， 和（f）至少约50的SCBDI，（2）任选的自由基引发剂，例如过氧化物或偶氮化合物，或光引发剂，例如二苯甲酮，和（3）任选的助剂。 通常，聚烯烃共聚物是乙烯/∀-烯烃共聚物。 任选地，聚合物材料还可以包含乙烯基硅烷和/或焦烧抑制剂，并且共聚物可保持未交联或交联。

公开(公告)号：US20170121082A1

公开(公告)日：2017-05-04

申请号：US15336220

申请日：2016-10-27

申请人： Dow Global Technologies LLC

发明人： Rashi Tiwari ,  Robert L. McGee ,  Timothy J. Pope ,  Lamy J. Chopin, III ,  Jose Eduardo Ruiz

IPC分类号： B65D75/00 ,  B65D75/58 ,  B32B27/32 ,  B65D41/00 ,  B32B27/08 ,  B65D75/56 ,  B65D30/20

CPC分类号： B65D75/008 ,  B32B1/02 ,  B32B3/02 ,  B32B7/02 ,  B32B7/04 ,  B32B27/08 ,  B32B27/20 ,  B32B27/32 ,  B32B27/327 ,  B32B27/34 ,  B32B2250/03 ,  B32B2250/04 ,  B32B2250/05 ,  B32B2250/242 ,  B32B2270/00 ,  B32B2307/31 ,  B32B2307/54 ,  B32B2307/558 ,  B32B2307/5825 ,  B32B2307/72 ,  B32B2307/7244 ,  B32B2307/7246 ,  B32B2307/732 ,  B32B2307/75 ,  B32B2439/40 ,  B32B2439/46 ,  B32B2439/70 ,  B65D31/10 ,  B65D75/563 ,  B65D75/566 ,  B65D75/5883

摘要： The present disclosure provides a flexible container. In an embodiment, the flexible container includes A. a front panel, a rear panel, a first gusseted side panel, and a second gusseted side panel, the gusseted side panels adjoining the front panel and the rear panel along peripheral seals to form a chamber, each panel is a multilayer film having at least three layers, each multilayer film comprising (i) an outermost layer comprising a high density polyethylene (HDPE) having a density from greater than 0.94 g/cc to 0.98 g/cc, (ii) a core layer comprising a core ethylene-based polymer having a density from 0.908 g/cc to less than 0.93 g/cc, (iii) an innermost seal layer comprising a seal ethylene-based polymer having a density from 0.86 g/cc to 0.92 g/cc; and B. each panel includes a bottom face comprising two opposing peripheral tapered seals, each peripheral tapered seal extending from a respective peripheral seal.

公开(公告)号：US20150237877A1

公开(公告)日：2015-08-27

申请号：US14430109

申请日：2013-09-13

申请人： Fernando K. EDAGI ,  Nazir MIR ,  Evan McCaskey ,  Robert L. McGee ,  Bruce Menning ,  AGROFRESH INC. ,  DOW GLOBAL TECHNOLOGIES LLC

发明人： Fernando K. Edagi ,  Nazir Mir ,  Evan McCaskey ,  Robert L. McGee ,  Bruce Menning

IPC分类号： A23B7/144

CPC分类号： A23B7/144 ,  A23L3/3409

摘要： Provided is a method of storing persimmons comprising the step of exposing persimmons to an atmosphere that contains a cyclopropene compound, wherein either (a) the persimmons are in a modified-atmosphere package during exposure to the cyclopropene compound, or (b) the persimmons are placed into a modified-atmosphere package after exposure to the cyclopropene compound, and the persimmons remain in the modified atmosphere package for at least two hours. In some embodiments, the modified-atmosphere package is constructed so that the transmission rate of oxygen for the entire package is from 200 to 40,000 cubic centimeters per day per kilogram of persimmons.

摘要翻译： 提供了一种储存柿子的方法，包括将柿子暴露于含有环丙烯化合物的气氛的步骤，其中（a）在暴露于环丙烯化合物期间，（a）柿子处于改性气氛包装中，或（b）柿子是 在暴露于环丙烯化合物之后置于改性气氛包装中，并且柿子保持在改性气氛包装中至少2小时。 在一些实施方案中，改性气氛包装被构造成使得整个包装的氧的透过率为每公斤柿子每天200至40,000立方厘米。