Abstract:
A method for fabrication of passive electronic components includes disposing a sacrificial layer on a carrier and forming a curable resin layer on top of the sacrificial layer and patterning the curable resin to form a cured resin template having multiple pattern levels. A metal material is deposited into the first pattern level to form a first structure. A dielectric material is then formed on exposed portions of the first structure. A nonselective subtractive process is used to expose the sacrificial layer in a bottom of the second pattern level and metal material is deposited into the second pattern level and built up to include a portion which crosses over the dielectric material.
Abstract:
A system and method are disclosed for managing collateral allocation and substitution in general collateral repurchase agreements. In a preferred embodiment, an intermediary computer system facilitates the execution of anonymous general collateral repurchase agreements between buyers and sellers. The intermediary system manages initial collateral allocations and substitutions in accordance with systematic and impartial rules.
Abstract:
The invention provides methods and compositions for reducing or preventing fibrosis in a subject suffering from a fibrotic disorder by administering a therapeutically effective amount of at least one antagonist to the cytokine thymic stromal lymphopoietin to the subject. In one embodiment, the methods and compositions further comprise administering at least one additional antagonist to an additional profibrotic cytokine, growth factor or chemokine.