-
公开(公告)号：US10014246B2
公开(公告)日：2018-07-03
申请号：US15284514
申请日：2016-10-03
发明人： Chen-Yueh Kung
IPC分类号： H05K1/11 , H05K1/18 , H01L23/498 , H05K3/00 , H05K3/40 , H01L23/13 , H01L23/367 , H01L21/48 , H01L21/56 , H01L23/31 , H01L23/00 , H05K3/28
CPC分类号： H01L23/49838 , H01L21/4853 , H01L21/4857 , H01L21/486 , H01L21/4882 , H01L21/563 , H01L23/13 , H01L23/3185 , H01L23/3675 , H01L23/3677 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L24/16 , H01L2224/10 , H01L2224/16157 , H01L2224/73204 , H05K1/112 , H05K1/119 , H05K1/181 , H05K3/0026 , H05K3/28 , H05K3/4007 , H05K2201/09472 , H05K2201/10378 , H05K2201/10674 , H05K2201/10734 , H05K2203/0723 , H05K2203/107 , H05K2203/1476 , Y10T29/49156
摘要： A circuit substrate has the following elements. A stacked circuit structure has a first surface and a second surface opposite thereto surface. A first patterned inner conductive layer is disposed on the first surface and has multiple pads. A first patterned outer conductive layer is disposed on the patterned inner conductive layer and has multiple conductive pillars, wherein each of the first conductive pillar is located on the corresponding first pad. The first dielectric layer covers the first surface, the first patterned inner conductive layer and the first patterned outer conductive layer, and has multiple first concaves, wherein the first concave exposes the top and side of the corresponding first conductive pillar. A semiconductor package structure applied the above circuit substrate and a process for fabricating the same are also provided here.
-
公开(公告)号：US09995701B2
公开(公告)日：2018-06-12
申请号：US14728642
申请日：2015-06-02
CPC分类号： G01N27/221 , G01N27/026 , Y10T29/49156
摘要： A sensor system can be configured to perform dielectric spectroscopy (DS). For example, the system can include a sensor configured to measure dielectric permittivity of a fluid in response to an RF input signal. Associated interface electronics can include a transmitter to drive the sensor with the RF input signal and a receiver to receive and process an RF output signal from the sensor in response to the RF input signal.
-
公开(公告)号：US09942990B2
公开(公告)日：2018-04-10
申请号：US15245361
申请日：2016-08-24
IPC分类号： H05K3/02 , H05K3/26 , H01P3/02 , H05K1/02 , H05K1/11 , H05K1/18 , H05K3/46 , H05K1/09 , H05K3/38 , H05K3/06 , H05K1/03
CPC分类号： H05K3/26 , H01P3/02 , H05K1/0213 , H05K1/0237 , H05K1/0242 , H05K1/0298 , H05K1/0393 , H05K1/09 , H05K1/111 , H05K1/115 , H05K1/181 , H05K3/06 , H05K3/064 , H05K3/382 , H05K3/46 , H05K3/4611 , H05K2201/0355 , H05K2201/0391 , Y10T29/49117 , Y10T29/49124 , Y10T29/49155 , Y10T29/49156
摘要： A circuit apparatuses include at least one circuit feature formed from patterning a conductive sheet. The conductive sheet includes an irregular surface and a planarized surface. Conductive sheet roughness is minimized in first regions of the circuit apparatus and is maintained in second regions of the circuit apparatus. Selectively planarizing portions of the conductive sheet allows for the utilization of lower cost rougher conductive sheets. The planarized surface allows for increased signal integrity and reduced insertion loss and the irregular surface allows for increased adhesion and enhancing reliability of the circuit apparatus.
-
公开(公告)号：US09935600B2
公开(公告)日：2018-04-03
申请号：US14940815
申请日：2015-11-13
发明人： James W. Adkisson , Panglijen Candra , Thomas J. Dunbar , Jeffrey P. Gambino , Mark D. Jaffe , Anthony K. Stamper , Randy L. Wolf
IPC分类号： H03H9/64 , H03H3/04 , H03H3/08 , H03H9/05 , H03H9/10 , H01L41/09 , B81B7/00 , B81B7/02 , G06F17/50 , H03H9/48 , H03H9/54 , H01P1/205
CPC分类号： H03H3/04 , B81B7/008 , B81B7/02 , G06F17/5045 , H01L41/094 , H01L41/0973 , H03H3/08 , H03H9/0542 , H03H9/0547 , H03H9/1064 , H03H9/1092 , H03H9/48 , H03H9/542 , H03H9/6403 , H03H9/6423 , Y10T29/42 , Y10T29/49005 , Y10T29/49126 , Y10T29/49147 , Y10T29/49156
摘要： Switchable and/or tunable filters, methods of manufacture and design structures are disclosed herein. The method of forming the filters includes forming at least one piezoelectric filter structure comprising a plurality of electrodes formed on a piezoelectric substrate. The method further includes forming a micro-electro-mechanical structure (MEMS) comprising a MEMS beam formed above the piezoelectric substrate and at a location in which, upon actuation, the MEMS beam shorts the piezoelectric filter structure by contacting at least one of the plurality of electrodes.
-
公开(公告)号：US09876265B2
公开(公告)日：2018-01-23
申请号：US13160289
申请日：2011-06-14
申请人： Ian J. Forster , Christian K. Oelsner , Robert Revels , Benjamin Kingston , Peter Cockerell , Moris Amon , Norman Howard
发明人： Ian J. Forster , Christian K. Oelsner , Robert Revels , Benjamin Kingston , Peter Cockerell , Moris Amon , Norman Howard
IPC分类号： B32B3/10 , H01P11/00 , B32B38/10 , G06K19/077 , G06K19/07 , B23K26/364 , B32B37/12 , B32B38/00
CPC分类号： H01P11/003 , B23K26/364 , B32B37/12 , B32B38/10 , B32B38/145 , B32B2305/10 , B32B2307/302 , B32B2317/12 , B32B2519/02 , G06K19/0723 , G06K19/07718 , G06K19/07749 , G06K19/0775 , G06K19/07754 , G06K19/07786 , Y10T29/49016 , Y10T29/49018 , Y10T29/49117 , Y10T29/49156 , Y10T29/5317 , Y10T29/53174 , Y10T156/1052 , Y10T428/24802 , Y10T428/24917 , Y10T428/2809 , Y10T428/2817
摘要： The present invention relates to a method of manufacturing a metal foil laminate which may be used for example to produce an antenna for a radio frequency (RFID) tag, electronic circuit, photovoltaic module or the like. A web of material is provided to at least one cutting station in which a first pattern is generated in the web of material. A further cutting may occur to create additional modifications in order to provide additional features for the intended end use of the product. The cutting may be performed by a laser either alone or in combinations with other cutting technologies.
-
公开(公告)号：US09832885B2
公开(公告)日：2017-11-28
申请号：US14722084
申请日：2015-05-26
发明人： Myung Sam Kang , Ki Jung Sung , Seung Yeop Kook , Seung Eun Lee
IPC分类号： H05K7/10 , H05K7/12 , H05K3/40 , H05K1/18 , H05K1/09 , H05K3/10 , H05K1/11 , H05K3/18 , H05K3/24
CPC分类号： H05K3/40 , H01L2224/48471 , H05K1/09 , H05K1/114 , H05K1/181 , H05K3/10 , H05K3/188 , H05K3/244 , H05K2203/049 , Y02P70/611 , Y10T29/49156
摘要： Disclosed is a circuit board having a contact pad for connection with an external device, which protrudes from an upper surface of an outermost insulating layer. A device can be mounted on the circuit board, and a connection terminal of the device can be connected to the contact pad of the circuit board by a wire etc.
-
公开(公告)号：US09814140B2
公开(公告)日：2017-11-07
申请号：US15090730
申请日：2016-04-05
发明人： Brian Samuel Beaman
CPC分类号： H05K1/117 , H01R12/721 , H05K3/403 , H05K2201/09145 , H05K2201/09909 , H05K2201/10863 , Y10T29/49124 , Y10T29/49155 , Y10T29/49156
摘要： A printed circuit board assembly and method of assembly is provided for a printed circuit board having a top and bottom surface with at least one edge portion having a rounded surface extending from the top surface to a point below the top surface and at least one electrical contact pad located on the top surface and extending over the edge portion rounded surface to a point below the top surface.
-
公开(公告)号：US20170303853A1
公开(公告)日：2017-10-26
申请号：US15621935
申请日：2017-06-13
申请人： BeBop Sensors, Inc.
发明人： Keith A. McMillen , Kyle Lobedan , Gregory Wille , Florian Muller
CPC分类号： A61B5/6806 , A61B5/1114 , A61B5/6843 , A61B34/76 , A61B2034/741 , A61B2090/064 , A61B2562/0247 , A61B2562/0261 , G01L1/18 , G01L1/2206 , G01L1/2293 , G01L5/228 , G01L25/00 , G06F3/014 , G06F3/045 , H03K17/964 , Y10T29/49156
摘要： Sensor systems are described that are designed to be integrated with gloves for the human hand. An array of sensors detects forces associated with action of a hand in the glove, and associated circuitry generates corresponding control information that may be used to control a wide variety of processes and devices.
-
公开(公告)号：US09739825B2
公开(公告)日：2017-08-22
申请号：US15205617
申请日：2016-07-08
CPC分类号： G01R31/2801 , B23Q17/20 , G01R1/067 , G01R27/2605 , G01R31/28 , G01R31/281 , H05K1/0251 , H05K3/0047 , H05K3/429 , H05K2201/096 , H05K2201/09845 , H05K2203/0207 , H05K2203/163 , Y10T29/49005 , Y10T29/49156 , Y10T29/49726 , Y10T408/05
摘要： A stub of a via formed in a printed circuit board is backdrilled to a predetermined depth. A capacitance probe is positioned within the via. Then the capacitance probe is used to obtain a test capacitance measurement. The test capacitance measurement is compared to a predetermined baseline capacitance measurement. Residual conductive plating material in the backdrilled stub causes the test capacitance measurement to exceed the predetermined baseline capacitance measurement. An indication is made that the predetermined baseline capacitance measurement has been exceeded.
-
公开(公告)号：US20170232251A1
公开(公告)日：2017-08-17
申请号：US15585093
申请日：2017-05-02
发明人： Jordan Neysmith , Robert Greenberg , James Little , Brian Mech , Neil Talbot , Qingfang Yao , David Zhou
CPC分类号： A61N1/0543 , A61N1/0541 , A61N1/36046 , H05K1/028 , H05K1/0353 , H05K1/09 , H05K1/111 , H05K1/115 , H05K1/118 , H05K3/0014 , H05K3/0017 , H05K3/0041 , H05K3/06 , H05K3/188 , H05K3/22 , H05K3/388 , H05K3/4644 , H05K2201/0129 , H05K2201/0133 , H05K2201/0141 , H05K2201/0154 , Y10T29/49156 , Y10T29/49158
摘要： A flexible circuit electrode array with more than one layer of metal traces comprising: a polymer base layer; more than one layer of metal traces, separated by polymer layers, deposited on the polymer base layer, including electrodes suitable to stimulate neural tissue; and a polymer top layer deposited on the polymer base layer and the metal traces. Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, or cortical stimulation many purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow.
-
-
-
-
-
-
-
-
-
搜索结果
3003 条记录 (耗时 0.026 秒)
